PROCESS FOR FORMING METAL FILM AND RELEASE LAYER ON POLYMER

Fan out type wafer level package structure and method of the same

Semiconductor package structure

LEAD FRAME STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

Multi-chip module package

Semiconductor component

Electronic component with buffer layer

Semiconductor device

Switching assembly for an aircraft ignition system

Method And Device For Enhancing Solderability

Electronic component mounting method and electronic component mounting device

Method of manufacturing component-embedded printed circuit board

PACKAGING METHOD INVOLVING REARRANGEMENT OF DICE

Components joining method and components joining structure

Microelectronic lithographic alignment using high contrast alignment mark

Semiconductor device

Multi-substrate region-based package and method for fabricating the same

Semiconductor element and semiconductor device

Microelectronic package

Top layers of metal for high performance IC's

Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device

Carrier substrate and integrated circuit

Integrated circuit including parylene material layer

Electronic device

Flip chip interconnection

Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same

Semiconductor device including a first land on the wiring substrate and a second land on the sealing portion

Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices

Semiconductor component having maximized bonding areas of electrically conductive members connected to semiconductor device and connected to leadframe and method of producing

SEMICONDUCTOR PACKAGE STRUCTURE AND LEADFRAME THEREOF

Power semiconductor device

INTEGRATED DEVICE AND CIRCUIT SYSTEM

INDIUM-SOLDER-COATED COPPER FOIL RIBBON CONDUCTOR AND METHOD OF CONNECTING THE SAME

Manufacturing method of semiconductor device

Method of manufacturing an integrated circuit module

Fabrication method of an organic substrate having embedded active-chips

Multilayer printed circuit board structure comprising an integrated electrical component, and production method therefor

Cascode current sensor for discrete power semiconductor devices

ADHESION STRUCTURE FOR A PACKAGE APPARATUS

Near chip scale package integration process

Method of fabricating stacked assembly including plurality of stacked microelectronic elements

METHODS AND APPARATUS TO SUPPORT AN OVERHANGING REGION OF A STACKED DIE

Packaged integrated circuit devices with through-body conductive vias, and methods of making same

Power semiconductor component with metal contact layer and production method therefor

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Electronic element that includes multilayered bonding interface between first electrode having aluminum-containing surface and second electrode composed of metal nanoparticle sintered body

Semiconductor device including a semiconductor chip which is mounted spaning a plurality of wiring boards and manufacturing method thereof

Semiconductor device

Power semiconductor module

Method for fabricating a semiconductor and semiconductor package

Semiconductor package having buried post in encapsulant and method of manufacturing the same

Leadframe-based semiconductor package

Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member

Thermally enhanced ball grid array package formed in strip with one-piece die-attached exposed heat spreader

Semiconductor device with semiconductor chip and method for producing it

Optical communication module

Light source, manufacturing method of light source, lighting apparatus, and display apparatus

Noncontact information storage medium and method for manufacturing same

BONDING WIRE CLEANING UNIT AND METHOD OF WIRE BONDING USING THE SAME

Mounting method

C4NP servo controlled solder fill head

Method of manufacturing semiconductor device

Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same

Component bonding method, component laminating method and bonded component structure

Method and apparatus for flip-chip bonding

Substrate and manufacturing method of the same, and semiconductor device and manufacturing method of the same

Output control device, and AC/DC power source device, circuit device, LED backlight circuit device, and switching DC/DC converter device each using output control device

Semiconductor device manufacturing method

Semiconductor device and method of providing common voltage bus and wire bondable redistribution

Method and structure to reduce cracking in flip chip underfill

Semiconductor stack package having wiring extension part which has hole for wiring

SEMICONDUCTOR DEVICE

Die stacking apparatus and method

STACKING OF INTEGRATED CIRCUITS USING GLASSY METAL BONDING

Semiconductor devices including a through-substrate conductive member with an exposed end and methods of manufacturing such semiconductor devices

Small area, robust silicon via structure and process

Semiconductor chip package and method for designing the same

Semiconductor device having a stacked bump to reduce kirkendall voids and or cracks and method of manufacturing

INTEGRATED CIRCUIT

Electronic device, method of producing the same, and semiconductor device

Substrate, substrate fabrication, semiconductor device, and semiconductor device fabrication

SEMICONDUCTOR CHIP WITH SOLDER BUMP AND METHOD OF FABRICATING THE SAME

Under Bump Routing Layer Method and Apparatus

Conductor bump method and apparatus

Redistributed chip packaging with thermal contact to device backside

Integrated circuit packaging system for fine pitch substrates

Semiconductor device and lead frame

Integrated circuit package system with multiple devices

TFCC (TM) and SWCC (TM) thermal flex contact carriers

Three-dimensional package module

INTEGRATED CIRCUIT WITH INTERCONNECTED FRONTSIDE CONTACT AND BACKSIDE CONTACT

Compression bonding device and a mounting method

METHODS AND SYSTEMS FOR LASER ASSISTED WIREBONDING

WAFER-LEVEL ACA FLIP CHIP PACKAGE USING DOUBLE-LAYERED ACA/NCA

INTERCONNECT STRUCTURE

Semiconductor die package with internal bypass capacitors

MCU with integrated voltage isolator to provide a galvanic isolation between input and output

Semiconductor device

Method of manufacturing an electronic part mounting structure

Flip chip package structure and method for manufacturing the same

CHIP-TO-CHIP PACKAGE AND PROCESS THEREOF

Semiconductor package having a stacked wafer level package and method for fabricating the same

Electrical connections for multichip modules

Bond pad stacks for ESD under pad and active under pad bonding

Semiconductor device having external connection terminals and method of manufacturing the same

Electronic device and method of manufacturing same

Electronic component package and method of manufacturing same

Method for manufacturing and making planar contact with an electronic apparatus, and correspondingly manufactured apparatus

Semiconductor module

Thin plastic leadless package with exposed metal die paddle

Thin semiconductor die packages and associated systems and methods

SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCIATED SYSTEMS AND METHODS

Leadframe panel

Sensor package

Semiconductor device having a sensor chip, and method for producing the same

Semiconductor device

Light emitting device and method of manufacturing the same

Method and apparatus for loading solder balls

METHOD FOR SOLDERING TWO COMPONENTS TOGETHER BY USING A SOLDER MATERIAL

Methods and apparatus for measuring analytes using large scale FET arrays

Electronic component-embedded board and method of manufacturing the same

Methods of attaching a die to a substrate

Assembly substrate and method of manufacturing the same

Electronic component-embedded board and method of manufacturing the same

Isolated conformal shielding

Apparatus and method for producing semiconductor modules

Embedded chip package process

Flip chip mounting method and bump forming method

PUNCHED ADHESIVE TAPE FOR SEMICCONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH THE ADHESIVE TAPE, LEAD FRAME WITH THE ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING THE LEAD FRAME

Semiconductor device with offset stacked integrated circuits

Under bump metal film comprising a stress relaxation layer and a diffusion-resistant layer

Semiconductor apparatus having side surface wiring

Semiconductor device having double side electrode structure and method of producing the same

Semiconductor device and method for manufacturing semiconductor device

Method of manufacturing a semiconductor apparatus

WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP WITH SOLDER BUMP SUPPRESSING GROWTH OF INTER-METALLIC COMPOUND AND METHOD OF FABRICATING THE SAME

ELECTRONIC DEVICE PROVIDED WITH WIRING BOARD, METHOD FOR MANUFACTURING SUCH ELECTRONIC DEVICE AND WIRING BOARD FOR SUCH ELECTRONIC DEVICE

Method for packaging semiconductor dies having through-silicon vias

Semiconductor device and manufacturing method of the same

QUAD FLAT PACKAGE WITH EXPOSED COMMON ELECTRODE BARS

System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices

SEMICONDUCTOR DEVICE STRUCTURES AND METHODS FOR SHIELDING A BOND PAD FROM ELECTRICAL NOISE

Method for stacking serially-connected integrated circuits and multi-chip device made from same

LED chip package structure with high-efficiency light-emitting effect and method of packaging the same

Semiconductor chip bonding apparatus

Method of manufacturing printed wiring board

Capacitive isolator

METHOD OF MANUFACTURING INTERCONNECT SUBSTRATE AND SEMICONDUCTOR DEVICE

Method of manufacturing a semiconductor device having an intermetallic terminal pad and solder junction structure

DOUBLE ENCAPSULATED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Manufacturing method of semiconductor integrated circuit device

Semiconductor assembly

Test structures for electrically detecting back end of the line failures and methods of making and using the same

Semiconductor module, and hybrid vehicle drive device including the same

Electronic device which disconnects first and second terminals upon lapse of a prescribed device lifetime

Solder cap application process on copper bump using solder powder film

Semiconductor chip package and method of manufacturing the same

Flip-chip package structure, and the substrate and the chip thereof

Stacked semiconductor device and semiconductor memory device

Bonding pad for preventing pad peeling and method for fabricating the same

Semiconductor package with reduced length interconnect and manufacturing method thereof

Electronic device and manufacturing method

Semiconductor device

SEMICONDUCTOR CHIP AND PACKAGE PROCESS FOR THE SAME

Microelectronic package element and method of fabricating thereof

Packaged semiconductor assemblies and methods for manufacturing such assemblies

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

Lead frame, semiconductor package including the lead frame and method of forming the lead frame

Integrated circuit package for semiconductor devices with improved electric resistance and inductance

Flip-Chip Packaging with Stud Bumps

Fusion quad flat semiconductor package

Electrically connecting substrate with electrical device

Mixed wire semiconductor lead frame package

Manufacturing process and structure of through silicon via

Method and apparatus for placing conductive balls

COMPRESSION BONDING DEVICE

Hybrid integrated circuit device and manufacturing method thereof

Method of fabricating chip package

Die-wafer package and method of fabricating same

Semiconductor Device Package Disassembly

Power semiconductor package

Semiconductor device and method for fabricating the same

Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus

Semiconductor device suitable for a stacked structure

COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT

Stackable microelectronic device carriers, stacked device carriers and methods of making the same

Stackable semiconductor package with encapsulant and electrically conductive feed-through

Power semiconductor substrates with metal contact layer and method of manufacture thereof

Composite carbon nanotube-based structures and methods for removing heat from solid-state devices

Chip package

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF THE SAME

Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing Method

Semiconductor device with welded leads and method of manufacturing the same

Semiconductor switching module

Method of fabricating a power semiconductor module

Semiconductor package system with patterned mask over thermal relief

Chip embedded substrate and method of producing the same

Ultra-Thin Wafer-Level Contact Grid Array

Ultra slim semiconductor package and method of fabricating the same

Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package

Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads

Conductor ball mounting apparatus, conductor ball mounting method, mask used for mounting conductor ball, and mask manufacturing method

Heating device, reflow device, heating method, and bump forming method

ELECTRONIC APPARATUS

Capacitor device and method of manufacturing the same

Adhesive composition and adhesive sheet

Method for fabricating semiconductor package free of substrate

Method of fabricating a two-sided die in a four-sided leadframe based package

METHOD OF MULTI-CHIP PACKAGING IN A TSOP PACKAGE

Semiconductor device and manufacturing method therefor

Method for producing a matrix for detecting electromagnetic radiation and method for replacing an elementary module of such a detection matrix

Mount Board and Electronic Device

Method of manufacturing a module

Process for manufacturing a module

Conformal shielding process using process gases

FIELD BARRIER STRUCTURES WITHIN A CONFORMAL SHIELD

Electronic module and fabrication method thereof

Packaging system with hollow package and method for the same

Integrated circuit package system with overhang die

ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SHEET, AND SEMICONDUCTOR DEVICE OBTAINED BY THE METHOD

Semiconductor device and wire bonding method

Semiconductor Package and Method for Producing Same

STACK PACKAGE THAT PREVENTS WARPING AND CRACKING OF A WAFER AND SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE HAVING AN INTERCONNECT ELECTRICALLY CONNECTING A FRONT AND BACKSIDE THEREOF AND A METHOD OF MANUFACTURE THEREFOR

Integrated circuit package system with overhanging connection stack

Semiconductor device and method of manufacturing the same

Semiconductor device with flip-chip connection that uses gallium or indium as bonding material

Semiconductor device and method for manufacturing the same

IC chip with finger-like bumps

Semiconductor device

Semiconductor device, a method of manufacturing the same and an electronic device

Forming a semiconductor package including a thermal interface material

LOW TEMPERATURE THERMAL INTERFACE MATERIALS

Semiconductor device including semiconductor chips having contact elements

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SYMMETRIC PACKAGING

Stackable package by using internal stacking modules

Semiconductor module for a switched-mode power supply and method for its assembly

Two-sided die in a four-sided leadframe based package

Plastic-Encapsulated Semiconductor Device with an Exposed Radiator at the Top and Manufacture Thereof

Semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor device including fuse elements and bonding pad

Semiconductor device

SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD

Using a simultaneously tilting and moving bonding apparatus

Conformal shielding process using flush structures

CONFORMAL SHIELDING EMPLOYING SEGMENT BUILDUP

Heat sink formed with conformal shield

Method of machining substrate

METHOD FOR MAKING AN INTERCONNECT STRUCTURE AND INTERCONNECT COMPONENT RECOVERY PROCESS

Formation of alpha particle shields in chip packaging

Process applying die attach film to singulated die

Manufacturing Method of Semiconductor Integrated Circuit Device

Semiconductor apparatus and method for manufacturing the same

Manufacturing method for semiconductor integrated device

RECOVERABLE ELECTRONIC COMPONENT

LOW-TEMPERATURE RECOVERABLE ELECTRONIC COMPONENT

Demountable interconnect structure

Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system

Apparatus for non-conductively interconnecting integrated circuits

Quad flat non-leaded chip package

Semiconductor device including a stress buffer

Tape wiring substrate and chip-on-film package using the same

Self-aligned wafer or chip structure, and self-aligned stacked structure

Electrical shielding in stacked dies by using conductive die attach adhesive

Structure and manufactruing method of chip scale package

Semiconductor device

CHIP PACKAGE

Semiconductor device and manufacturing method thereof

Electronic device manufacturing method and electronic device

Electronic device manufacturing method and electronic device

Package Structure with Flat Bumps for Integrate Circuit or Discrete Device and Method of Manufacture the Same

Direct edge connection for multi-chip integrated circuits

Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

Power Semiconductor Module And Method of Manufacturing the Power Semiconductor Module

Mold compound circuit structure for enhanced electrical and thermal performance

Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same

RF transistor packages with internal stability network and methods of forming RF transistor packages with internal stability networks

RF power transistor packages with internal harmonic frequency reduction and methods of forming RF power transistor packages with internal harmonic frequency reduction

Integrated structures and methods of fabrication thereof with fan-out metallization on a chips-first chip layer

Bumpless flip-chip assembly with a complaint interposer contractor

Array molded package-on-package having redistribution lines

Integrated circuit package system having perimeter paddle

Semiconductor device with surface mounting terminals

Packaged electronic modules and fabrication methods thereof implementing a cell phone or other electronic system

Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

Method of making demountable interconnect structure

ELECTROLYTIC NI PLATING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Parallel chip embedded printed circuit board and manufacturing method thereof

METHOD FOR MAKING AN INTERCONNECT STRUCTURE AND LOW-TEMPERATURE INTERCONNECT COMPONENT RECOVERY PROCESS

METHOD OF FORMING AN INTERCONNECT JOINT

Method For Assembling Substrates By Depositing An Oxide Or Nitride Thin Bonding Layer

Radio frequency identification (RFID) tag lamination process using liner

Method for fabricating semiconductor package

Methods relating to the reconstruction of semiconductor wafers for wafer level processing including forming of alignment protrusion and removal of alignment material

Thick film circuit component and method for manufacturing the same

Apparatus for Producing Ic Chip Package

Connected body and optical transceiver module