Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei

Semiconductor package with flow controller

Highly conductive composition for wafer coating

INJECTION MOLDED SOLDER BALL METHOD

Semiconductor device and method for producing the same

Plate structure having chip embedded therein and the manufacturing method of the same

Semiconductor package, manufacturing method thereof and IC chip

Semiconductor power device

High power semiconductor package

Method for reduction of soft error rates in integrated circuits

Electronic components produced by a method of separating two layers of material from one another

Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece

METHOD FOR CHIP TO PACKAGE INTERCONNECT

MICROELECTRONIC DIE INCLUDING SOLDER CAPS ON BUMPING SITES THEREOF AND METHOD OF MAKING SAME

Method for fabricating semiconductor package

Method of making a semiconductor device having multiple die redistribution layer

Composition for pressure sensitive adhesive film, pressure sensitive adhesive film, and dicing die bonding film including the same

CONDUCTIVE SINTERED LAYER FORMING COMPOSITION AND CONDUCTIVE COATING FILM FORMING METHOD AND BONDING METHOD USING THE SAME

Dual molded multi-chip package system

Wafer level package with die receiving through-hole and method of the same

Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers

Semiconductor device

METHODS OF FORMING STEPPED BUMPS AND STRUCTURES FORMED THEREBY

Metal Line of Semiconductor Device and Manufacturing Method Thereof

Method to reduce UBM undercut

Semiconductor components having through interconnects

Conductive systems and devices including wires coupled to anisotropic conductive film, and methods of forming the same

Wafer level package with die receiving through-hole and method of the same

STACK PACKAGE HAVING REDUCED ELECTRICAL CONNECTION LENGTH SUITABLE FOR HIGH SPEED OPERATIONS AND METHOD OF MANUFACTURING THE SAME

Methods of forming stepped bumps and structures formed thereby

Reducing underfill keep out zone on substrate used in electronic device processing

RF module package for releasing stress

RF module package

Packing board for electronic device, packing board manufacturing method, semiconductor module, semiconductor module manufacturing method, and mobile device

Wafer level package with die receiving through-hole and method of the same

Manufacturing method of chip package

Semiconductor device with chip mounted on a substrate

Stacked die package with die interconnects

Stackable integrated circuit package system with recess

Multi-chips package and method of forming the same

Semiconductor package having leadframe with exposed anchor pads

Power device package

Lead frame and method of manufacturing the same, and semiconductor device

CHIP PACKAGE STRUCTURE

Structure of super thin chip scale package and method of the same

Integrated circuits and interconnect structure for integrated circuits

Lens compression molded over LED die

Anisotropic electrically conductive structure

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE

Alignment and cutting of microelectronic substrates

Transfer assembly for manufacturing electronic devices

Bonding method and bonding material using metal particle

Methods of connecting an antenna to a transponder chip

Method for integrating pre-fabricated chip structures into functional electronic systems

Fabrication for electroplating thick metal pads

Semiconductor device and method of forming passive devices

Thinned die integrated circuit package

Chip mounting with flowable layer

SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DICE HAVING BACK SIDE REDISTRIBUTION LAYER ACCESSED USING THROUGH-SILICON VIAS, METHODS

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Flip chip mounting method by no-flow underfill

Flip chip mounting method by no-flow underfill having level control function

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Multilayer printed circuit board

Multilayer printed circuit board

Multilayer printed circuit board

Printed-wiring board, method of manufacturing printed-wiring board, and electronic equipment

System in package integrating a plurality of semiconductor chips

Voltage regulator integrated with semiconductor chip

Semiconductor device and method of protecting passivation layer in a solder bump process

Integrated circuit package system with offset stacked die and method of manufacture thereof

Semiconductor device and manufacturing method of the same

METHOD FOR FABRICATING A CIRCUIT

High surface area aluminum bond pad for through-wafer connections to an electronic package

Mounting method for semiconductor parts on circuit substrate

Semiconductor chip assembly and fabrication method therefor

Structure of dielectric layers in built-up layers of wafer level package

Heat dissipating chip structure and fabrication method thereof and package having the same

Microelectronic assemblies having compliancy and methods therefor

Stacked semiconductor chips having double adhesive insulating layer interposed therebetween

Method of Manufacturing a Semiconductor Packages and Packages Made

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME

FLIP CHIP IN PACKAGE USING FLEXIBLE AND REMOVABLE LEADFRAME

Inverted lead frame in substrate

Power semiconductor component stack using lead technology with surface-mountable external contacts and a method for producing the same

Multi-die IC package and manufacturing method

Semiconductor device with lead frame including conductor plates arranged three-dimensionally

Microelectronic packages having improved input/output connections and methods therefor

IC package encapsulating a chip under asymmetric single-side leads

Multi-chip package

Process for making contact with and housing integrated circuits

Semiconductor device

Semiconductor device, method and apparatus for testing same, and method for manufacturing semiconductor device

Wiring structure of printed wiring board and method for manufacturing the same

Printed wiring board

Semiconductor Sensor Component Comprising Protected Feeders, and Method for the Production Thereof

Method of manufacturing multi-layer printed circuit board

Semiconductor device and electronic device

Electric component having microtips and ductile conducting bumps

Top layers of metal for high performance IC's

Method for fabricating a circuit component

Semiconductor component comprising a semiconductor chip and semiconductor component carrier with external connection strips

METHOD FOR FABRICATING CIRCUIT BOARD STRUCTURE WITH EMBEDDED SEMICONDUCTOR CHIP

Method of manufacturing wafer level chip size package

Semiconductor package, manufacturing method thereof and IC chip

Manufacturing method for micro-SD flash memory card

Semiconductor apparatus and manufacturing method of semiconductor apparatus

Printed circuit board

Flip chip semiconductor packaging device and testing method using first and second reflectors for determining gap between chip and circuit board or first and second chips

Contact Pad And Bump Pad Arrangement for High-Lead Or Lead-Free Bumps

Semiconductor integrated circuit

Semiconductor processing methods, methods of forming contact pads, and methods of forming electrical connections between metal-containing layers

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Dummy patterns and method of manufacture for mechanical strength of low K dielectric materials in copper interconnect structures for semiconductor devices

Semiconductor device

Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same

Tubular-shaped bumps for integrated circuit devices and methods of fabrication

Circuit device with at least partial packaging and method for forming

Stress management in BGA packaging

CIRCUIT BOARD STRUCTURE WITH EMBEDDED SEMICONDUCTOR CHIP

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Semiconductor assembly for improved device warpage and solder ball coplanarity

WAFER LEVEL PACKAGE WITH GOOD CTE PERFORMANCE

Integrated circuit package system with thermo-mechanical interlocking substrates

Leadframe on heat sink (LOHS) semiconductor packages and fabrication methods thereof

Semiconductor device package diepad having features formed by electroplating

Lead-frame circuit package

Semiconductor device having active element formation region provided under a bump pad

Semiconductor device

Semiconductor device and method for manufacturing the same

Printed circuit board

Semiconductor chip and production process therefor

Method of sputtering a nickel silicon alloy, especially useful for forming a solder bump barrier

Manufacturing method of semiconductor device

Semiconductor device and fabrication method thereof

Chip scale package structure with metal pads exposed from an encapsulant

Method of making semiconductor device

Liquid metal thermal interface material system

Semiconductor device

Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument

Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus

Method of bonding wire of semiconductor package

Structure and process for WL-CSP with metal cover

Semiconductor device

Method for manufacturing semiconductor device and semiconductor device

Solder Bump/Under Bump Metallurgy Structure for High Temperature Applications

Packaged integrated circuit with enhanced thermal dissipation

High power semiconductor package and method of making the same

MULTI-CHIP PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

MULTI-CHIPS PACKAGE AND METHOD OF FORMING THE SAME

Wire bond interconnection

Electronic component with layered frame

LDO regulator with ground connection through package bottom

Semiconductor device having plurality of leads

Semiconductor component including a semiconductor chip and a passive component

Electrical/optical integration scheme using direct copper bonding

Amplifier chip mounted on a lead frame

Articles and assembly for magnetically directed self assembly and methods of manufacture

Fabrication method of semiconductor package and structure thereof

Semiconductor wafer

Method for manufacturing an electrode and electrode component mounted body

Method for Preparing an Intergrated Circuits Device Having a Reinforcement Structure

Semiconductor device and manufacturing method of the same

Method of processing wafer

Packaged microelectronic devices and methods for packaging microelectronic devices

Electroplating method for a semiconductor device

METHOD OF DIE STACKING USING INSULATED WIRE BONDS

Method of fabricating a film-on-wire bond semiconductor device

Single Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices

Microchip assembly including an inductor and fabrication method

Method of fabricating an electronic device

METHOD FOR FORMING RFID TAGS

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Semiconductor device and manufacturing method therefor

Semiconductor device including microstrip line and coplanar line

Semiconductor device and method of manufacturing the same

Microcircuit package having ductile layer

Semiconductor device and manufacturing method thereof

Semiconductor module, method for manufacturing semiconductor modules and mobile device

Semiconductor chip and TAB package having the same

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Intergrated Circuits Device Having a Reinforcement Structure

CHIP PACKAGE AND FABRICATING PROCESS THEREOF

Semiconductor chip package, printed circuit board assembly including the same and manufacturing methods thereof

Semiconductor device having elastic solder bump to prevent disconnection

Stress decoupling structures for flip-chip assembly

DIE STACKING USING INSULATED WIRE BONDS

FILM-ON-WIRE BOND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Semiconductor chip and method of producing the same

Solid-state imaging device

SEMICONDUCTOR INTEGRATED CIRCUIT AND FABRICATION METHOD FOR THE SAME

Semiconductor integrated circuit providing for wire bonding directly above an active circuit region, and manufacturing method thereof

Light emitting device having a mirror portion

Flip-chip mounting resin composition and bump forming resin composition

Component mounting apparatus and component mounting method

Stacked structures and methods of fabricating stacked structures

Method and apparatus for linear die transfer

Reduction of damage to thermal interface material due to asymmetrical load

Electrical Insulating Layer for Metallic Thermal Interface Material

Adhesive composition, adhesive sheet and production process for semiconductor device

Gold/silicon eutectic die bonding method

Mounting method of semiconductor element using outside connection projection electyrode and manufacturing method of semiconductor device using outside connection projection electrode

PARTIALLY INSULATION COATED METAL WIRE FOR WIRE BONDING AND WIRE BONDING METHOD FOR SEMICONDUCTOR PACKAGE USING THE SAME

MULTI-COMPONENT ELECTRONIC PACKAGE WITH PLANARIZED EMBEDDED-COMPONENTS SUBSTRATE

METHOD AND APPARATUS FOR CREATING RFID DEVICES USING MASKING TECHNIQUES

Silica nanoparticles thermoset resin compositions

Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud-bumps

Three-dimensional wafer stacking with vertical interconnects

Bonding structures and methods of forming bonding structures

Rotation joint and semiconductor device having the same

Bond pad design to minimize dielectric cracking

Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apart

Solder bump structure and method of manufacturing same

Semiconductor device and a method of manufacturing the same

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE CONTAINING THE SAME

Method of fabricating electronic device having sacrificial anode, and electronic device fabricated by the same

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

Systems and methods to passivate on-die redistribution interconnects

Balanced semiconductor device packages including lead frame with floating leads and associated methods

HEAT SPREADER FOR AN ELECTRICAL DEVICE

Semiconductor device

Semiconductor device

Module comprising polymer-containing electrical connecting element

Semiconductor Device And Production Method For Semiconductor Device

Method for producing a semiconductor device including connecting a functional wafer to a carrier substrate and selectively etching the carrier substrate

Top layers of metal for integrated circuits

Semiconductor chips for TAG applications, devices for mounting the same, and mounting method

Interconnect For Microelectronic Structures With Enhanced Spring Characteristics

Spread spectrum isolator

SEMICONDUCTOR CHIP HAVING BUMPS OF DIFFERENT HEIGHTS AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

METHOD FOR IMPROVED COPPER LAYER ETCHING OF WAFERS WITH C4 CONNECTION STRUCTURES

Vias having varying diameters and fills for use with a semiconductor device and methods of forming semiconductor device structures including same

Use of palladium in IC manufacturing with conductive polymer bump

Method for manufacturing semiconductor device

Wire and solder bond forming methods

Wire and solder bond forming methods

WAFER SCALE THIN FILM PACKAGE

Method of packaging a device using a dielectric layer

Lithographic apparatus and method

Semiconductor device and method for manufacturing same

Assembly and Method of Placing the Assembly on an External Board

MULTI-CHIP STRUCTURE

Semiconductor package and fabrication method thereof

Method of packaging a device having a multi-contact elastomer connector contact area and device thereof

Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate

Circuit board structure with embedded semiconductor chip and method for fabricating the same

Wafer level package with die receiving cavity and method of the same

Semiconductor device, stacked semiconductor device and interposer substrate

WIRE BOND AND METHOD OF FORMING SAME

CHIP-PACKAGING COMPOSITIONS INCLUDING CATALYSTS AND HARDENERS, PACKAGES MADE THEREWITH, AND METHODS OF ASSEMBLING SAME

System and method for solder bump plating

Solder joint reliability in microelectronic packaging

Method of making lithographic contact elements

Film and chip packaging process using the same

Method for manufacturing electronic component, and electronic component

Module with carrier element

Low loop height ball bonding method and apparatus

Structure and method for enhancing resistance to fracture of bonding pads

High performance system-on-chip using post passivation process

Integrated circuit chips with fine-line metal and over-passivation metal

WIRING FILM HAVING WIRE, SEMICONDUCTOR PACKAGE INCLUDING THE WIRING FILM, AND METHOD OF FABRICATING THE SEMICONDUCTOR PACKAGE

Semiconductor package

Bridge stack integrated circuit package system

Electronic assembly and circuit board

PACKAGE DESIGNS FOR VERTICAL CONDUCTION DIE

Method of sealing or welding two elements to one another

Method for fabricating semiconductor package free of substrate

Wiring board and method of manufacturing the same

Circuit device and method of manufacturing the same

Electrical component having external contacting

Electronic Device, a Chip Contacting Method and a Contacting Device

SEMICONDUCTOR CHIP STACK PACKAGE WITH REINFORCING MEMBER FOR PREVENTING PACKAGE WARPAGE CONNECTED TO SUBSTRATE

Semiconductor device having projecting electrode formed by electrolytic plating, and manufacturing method thereof

Metal filled through via structure for providing vertical wafer-to-wafer interconnection

Gold wire for connecting semiconductor chip

Semiconductor device and manufacturing method of the same

Fan out type wafer level package structure and method of the same

Semiconductor module including components in plastic casing

Integrated Circuit Package and Method for Manufacturing an Integrated Circuit Package

Thin, thermally enhanced flip chip in a leaded molded package

Semiconductor element and process of manufacturing semiconductor element

Semiconductor device, wiring of semiconductor device, and method of forming wiring

Semiconductor chip, semiconductor device and methods for producing the same

Power semiconductor module

Plating Device, Plating Method, Semiconductor Device, And Method For Manufacturing Semiconductor Device

Electronic component and wire bonding method

Method for manufacturing electronic substrate

Method for cooling a semiconductor device

Non-pull back pad package with an additional solder standoff

Method of manufacturing complementary metal oxide semiconductor image sensor

Technique for forming a passivation layer without a terminal metal

Base plate for a power semiconductor module

Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices

Semiconductor device

Solder pillar bumping and a method of making the same

Packaged microelectronic devices and methods for packaging microelectronic devices

Bonding structure