Semiconductor device and a method of manufacturing the same

METALLIZATION LAYER STACK WITHOUT A TERMINAL ALUMINUM METAL LAYER

Flip-Chip Semiconductor Package with Encapsulant Retaining Structure and Strip

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

Bondwire utilized for coulomb counting and safety circuits

Stacked chip package structure with leadframe having inner leads with transfer pad

Semiconductor package and method of forming wire loop of semiconductor package

Semiconductor device and a method of manufacturing the same

CONNECTING A PLURALITY OF BOND PADS AND/OR INNER LEADS WITH A SINGLE BOND WIRE

Stacked chip packaging with heat sink structure

Semiconductor device, method of manufacturing the same

Array quad flat no-lead package and method of forming same

Semiconductor integrated circuit and method for manufacturing the same

Light emitting diode, optical semiconductor device, epoxy resin composition and phosphor suited for optical semiconductor device, and method for manufacturing the same

Method for mounting electronic component on substrate and method for forming solder surface

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

Method for fabricating a leadframe

METHOD FOR PRODUCING AN INTEGRATED CIRCUIT INCLUDING A CONNECTION CONTACT ON A SEMICONDUCTOR BODY

Flip chip metallization method and devices

Method for forming conductive layer and substrate having the same, and method for manufacturing semiconductor device

Sawn power package and method of fabricating same

Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates

Low profile ball grid array (BGA) package with exposed die and method of making same

Apparatus and method for connecting components

METHODS FOR FORMING PATTERNS OF A FILLED DIELECTRIC MATERIAL ON SUBSTRATES

Single chip USB packages with swivel cover

Electronics module and method for manufacturing the same

Three dimensional device integration method and integrated device

High performance system-on-chip using post passivation process

Integrated circuit with a reduced pad bump area and the manufacturing method thereof

SEMICONDUCTOR DEVICE

Semiconductor module arrangement

Metallised film for sheet contacting

SEMICONDUCTOR PACKAGE PREVENTING WARPING AND WIRE SEVERING DEFECTS, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

Stackable micropackages and stacked modules

Single chip USB packages with contact-pins cover

CHIP PACKAGE STRUCTURE

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor device with recess portion over pad electrode

Probe arrays and method for making

Wire bonding and wire bonding method

Electronic device handler for a bonding apparatus

Terminal pad structures and methods of fabricating same

Method for fabricating heat dissipating package structure

Microelectronic packages fabricated at the wafer level and methods therefor

Process for fabricating electronic components using liquid injection molding

Manufacturing device of semiconductor package and manufacturing method of semiconductor package

Bond pad structures and integrated circuit chip having the same

Dicing die-bonding film

Circuit board assembly

Semiconductor device and method for manufacturing the same

ATTACHING AND INTERCONNECTING DIES TO A SUBSTRATE

Structure and manufacturing method of a chip scale package

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE

Interconnections for fine pitch semiconductor devices and manufacturing method thereof

Semiconductor device and wire bonding method therefor

WAFER LEVEL PACKAGE STRUCTURE WITH BUILD UP LAYERS

Semiconductor integrated circuit device having reduced terminals and I/O area

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor apparatus

Semiconductor device having recessed connector portions

Semiconductor package having a bridged plate interconnection

Materials, structures and methods for microelectronic packaging

Semiconductor device and method for producing the same

RESONATOR, ULTRASONIC DIE BONDING HEAD, AND ULTRASONIC DIE BONDING APPARATUS

Method of providing solder bumps on a substrate using localized heating

SEMICONDUCTOR PACKAGING METHOD BY USING LARGE PANEL SIZE

Semiconductor device and an information management system therefor

Method for producing a semiconductor component and substrate for carrying out the method

Gold-Tin Solder Joints Having Reduced Embrittlement

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Wafer-level interconnect for high mechanical reliability applications

Low fabrication cost, fine pitch and high reliability solder bump

BUMP ELECTRODE INCLUDING PLATING LAYERS AND METHOD OF FABRICATING THE SAME

Semiconductor device

Edge connect wafer level stacking with leads extending along edges

Stacked structures and methods of fabricating stacked structures

Light emitting device

SEMICONDUCTOR DEVICE

Combination wedge bonding and ball bonding transducer

Integrated circuit chips with fine-line metal and over-passivation metal

INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL

Fuse structure for semiconductor integrated circuit with improved insulation film thickness uniformity and moisture resistance

Processes and packaging for high voltage integrated circuits, electronic devices, and circuits

Manufacturing Method of Semiconductor Apparatus

Electronic device including a nickel-palladium alloy layer

Integrated circuit chips with fine-line metal and over-passivation metal

Integrated circuit chips with fine-line metal and over-passivation metal

Integrated circuit chips with fine-line metal and over-passivation metal

INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL

Method of making a light emitting device having a molded encapsulant

Substrate slot design for die stack packaging

Integrated circuit package system with pad to pad bonding

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Semiconductor module, method for manufacturing the semiconductor module and portable device carrying the same

Die arrangement and method for producing a die arrangement

Semiconductor-embedded substrate and manufacturing method thereof

Power semiconductor arrangement

ELECTRONIC SYSTEM MODULES AND METHOD OF FABRICATON

Dual-die package structure having dies externally and simultaneously connected via bump electrodes and bond wires

Pin Array No Lead Package and Assembly Method Thereof

INTERDIGITATED LEADFINGERS

Process of forming an electronic device including an inductor

Sensor-type package and fabrication method thereof

Arrangement for cooling a power semiconductor module

Method of assembling carbon nanotube reinforced solder caps

Copper bonding or superfine wire with improved bonding and corrosion properties

Manufacturing method of a semiconductor device having a package dicing

METHOD FOR PRODUCING FLEXIBLE INTEGRATED CIRCUITS WHICH MAY BE PROVIDED CONTIGUOUSLY

Manufacturing method of semiconductor device

Nanoscopic Assurance Coating for Lead-Free Solders

Wire Bump Material

Methods of connecting an antenna to a transponder chip

Semiconductor device and manufacturing method thereof

SEMICONDUCTOR APPARATUS AND FABRICATION METHOD THEREOF

Electronic device and method for production

METHOD OF FABRICATING A WIRE BOND PAD WITH Ni/Au METALLIZATION

Semiconductor device and method of manufacturing the same

Circuit substrate for preventing warpage and package using the same

Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument

SEMICONDUCTOR PACKAGE COMPRISING ALIGNMENT MEMBERS

Integrated circuit package system for chip on lead

ELECTRONIC DEVICE AND PRODUCTION METHOD

Pressure-contact semiconductor device

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device

Modified gold-tin system with increased melting temperature for wafer bonding

Deep access large ribbon bond head

Multi-part capillary

Methods and apparatus to dispense adhesive for semiconductor packaging

LAMINATED CIRCUIT BOARD AND ITS MANUFACTURING METHOD, AND MANUFACTURING METHOD FOR MODULE USING THE LAMINATED CIRCUIT BOARD AND ITS MANUFACTURING APPARATUS

Method of forming an inlay substrate having an antenna wire

FIXING APPARATUS FOR SEMICONDUCTOR WAFER

Method for fabricating resin-molded semiconductor device having posts with bumps

Structure of high performance combo chip and processing method

Structure of high performance combo chip and processing method

Optical semiconductor device and method of manufacturing thereof

Removing dry film resist residues using hydrolyzable membranes

Positioning stage, bump forming apparatus equipped with the positioning stage, and bump forming method performed using the positioning stage

Semiconductor apparatus and method of producing the same

Semiconductor assembly with component attached on die back side

Bonding pad for contacting a device

Structure and manufacturing method of a chip scale package with low fabrication cost, fine pitch and high reliability solder bump

Electrical interconnection structure formation

Castellation wafer level packaging of integrated circuit chips

Semiconductor device and method for fabricating the same

Semiconductor device and method for manufacturing the same

Semiconductor device with a semiconductor chip stack and plastic housing, and methods for producing the same

Wafer level chip package and a method of fabricating thereof

Stack semiconductor package including an interposer chip having an imposed diode or capacitor

Semiconductor device, lead-frame product used for the same and method for manufacturing the same

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Packaged microelectronic components with terminals exposed through encapsulant

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ENCAPSULATION LOCK

Electronic packages with fine particle wetting and non-wetting zones

Process for manufacturing semiconductor devices

Process of fabricating a semiconductor package

Adhesive film for circuit connection, and circuit connection structure

Circuit-connecting material and circuit terminal connected structure and connecting method

INTEGRATED DEVICE

System and method for increasing the strength of a bond made by a small diameter wire in ball bonding

Methods using die attach paddle for mounting integrated circuit die

Extendable connector and network

Bonding wire and bond using a bonding wire

Copper alloy bonding wire for semiconductor device

Methods and substrates to connect an electrical member to a substrate to form a bonded structure

Power semiconductor module

Stacked chip package structure with leadframe having bus bar

Three dimensional device integration method and integrated device

Three dimensional device integration method and integrated device

Die attach paddle for mounting integrated circuit die

Method of producing a semiconductor package

Chip-stacked package structure having leadframe with multi-piece bus bar

Chip-stacked package structure for lead frame having bus bars with transfer pads

Electronic device having wiring substrate and lead frame

Stacked dual MOSFET package

Semiconductor device

Systems and methods for supporting a subset of multiple interface types in a semiconductor device

METHOD AND APPARATUS FOR CREATING RFID DEVICES USING PENETRABLE CARRIER

Circuit-connecting material and circuit terminal connected structure and connecting method

Modified chip attach process

Method of manufacturing a semiconductor device

Lead pin for mounting semiconductor and printed wiring board

Component embedded printed circuit board

Distributed semiconductor device methods, apparatus, and systems

Semiconductor device and method of producing the same

RELIABLE WAFER-LEVEL CHIP-SCALE PACKAGE SOLDER BUMP STRUCTURE IN A PACKAGED SEMICONDUCTOR DEVICE

Structure of wafer level package with area bump

Low fabrication cost, fine pitch and high reliability solder bump

Electronic device and method of manufacturing the same

Semiconductor chip and method for fabricating the same

SEMICONDUCTOR PACKAGE INCLUDING SILVER BUMP AND METHOD FOR FABRICATING THE SAME

MICROELECTRONIC DEVICE HAVING A PLURALITY OF STACKED MICROELECTRONIC DIES AND METHODS FOR MANUFACTURING SUCH MICROELECTRONIC ASSEMBLIES

SEMICONDUCTOR COMPONENT WITH COOLING APPARATUS

Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

Carrier board structure with semiconductor chip embedded therein

Chip package and method for fabricating the same

Wire bonding method, wire bonding apparatus and semiconductor device

SEMICONDUCTOR DEVICES AND MANUFACTURING METHOD THEREFOR

Semiconductor device and manufacturing method thereof

Power electronic package having two substrates with multiple electronic components

Apparatus and method for packaging circuits

Semiconductor device

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURE

CHIP CARRIER WITH SIGNAL COLLECTION TAPE AND FABRICATION METHOD THEREOF

POWER MODULE WITH LAMINAR INTERCONNECT

Circuit-connecting material and circuit terminal connected structure and connecting method

Microball placement solutions

Wire bonders and methods of wire-bonding

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Low fabrication cost, fine pitch and high reliability solder bump

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time

Adhesion by plasma conditioning of semiconductor chip

Method for producing semiconductor device

Au Alloy Bonding Wire

Semiconductor device

HIGH PERFORMANCE IC PACKAGE AND METHOD

Thin flip-chip method

Multi-chip module

Top layers of metal for high performance IC's

Stacked structure of chips and water structure for making the same

FLIP CHIP SEMICONDUCTOR ASSEMBLY WITH VARIABLE VOLUME SOLDER BUMPS

Low fabrication cost, fine pitch and high reliability solder bump

Packaged microdevices and methods for manufacturing packaged microdevices

Semiconductor device, substrate for producing semiconductor device and method of producing them

Stackable packages for three-dimensional packaging of semiconductor dice

Pre-encapsulated lead frames for microelectronic device packages, and associated methods

LED with phosphor tile and overmolded phosphor in lens

WIRE BONDER

Resonator, ultrasonic head, and ultrasonic bonder using the same

Resonator, ultrasonic head, and ultrasonic bonder using the same

Circuit Board Assembly Having Passive Component and Stack Structure Thereof

Top layers of metal for integrated circuits

Method of wire bonding over active area of a semiconductor circuit

Methods for releasably attaching sacrificial support members to microfeature workpieces and microfeature devices formed using such methods

High performance system-on-chip using post passivation process

High performance system-on-chip using post passivation process

Manufacturing method for resin sealed semiconductor device

Method to provide substrate-ground coupling for semiconductor integrated circuit dice constructed from SOI and related materials in stacked-die packages

Semiconductor die package using leadframe and clip and method of manufacturing

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Electronic module

Plastic overmolded packages with molded lid attachments

Circuit substrate and semiconductor device

Bond pad for wafer and package for CMOS imager

High performance system-on-chip using post passivation process

Semiconductor chip structure

MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE HAVING FLUX AND UNDER FILL RESIN LAYER AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE

Structure for bumped wafer test

High performance system-on-chip using post passivation process

Semiconductor device

Trace design to minimize electromigration damage to solder bumps

BUMP STRUCTURES AND PACKAGED STRUCTURES THEREOF

Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument

CHIP PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

Microelectronic package

Stacked semiconductor components with through wire interconnects (TWI)

High performance system-on-chip using post passivation process

High performance system-on-chip using post passivation process

Contact array layout for improving ESD capability of CMOS transistors

Laminating system, IC sheet, scroll of IC sheet, and method for manufacturing IC chip

Power semiconductor component

Component-embedded multilayer printed wiring board and manufacturing method thereof

Diamond heat sink

Assembling Two Substrates by Molecular Adhesion, One of the Two Supporting an Electrically Conductive Film

Semiconductor element and manufacturing method thereof

Interconnect for improved die to substrate electrical coupling

Chip package and method for fabricating the same

Method of manufacturing semiconductor device

Thermal method to control underfill flow in semiconductor devices

High performance system-on-chip using post passivation process

Process for packaging components, and packaged components

Solder elements with columnar structures and methods of making the same

Method for producing a component and device having a component

SEMICONDUCTOR PACKAGE, METHOD OF PRODUCTION THEREOF AND ENCAPSULATION RESIN

Method for embedding a component in a base

Semiconductor integrated circuit device

Semiconductor apparatus having improved thermal fatigue life

Semiconductor device and method for manufacturing the same

Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same

Conductive connection structure formed on the surface of circuit board and manufacturing method thereof

WIREBOND-LESS SEMICONDUCTOR PACKAGE

Bond Wireless Package

Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor device

Package structure with leadframe on offset chip-stacked structure

Method of packaging and interconnection of integrated circuits

Electronic device and method for producing a device

Semiconductor package having flexible lead connection plate for electrically connecting base and chip

Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant

Method for manufacturing a passive integrated matching network for power amplifiers

Lead frame with included passive devices

High performance system-on-chip using post passivation process

High performance system-on-chip using post passivation process