212089 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Lead [Pb]
Chip scale package for power devices and method for making the same
#7502Light emitting diode package
#7503Bonding apparatus, ball forming device in said bonding apparatus, and ball forming method using said bonding apparatus
#7504Mounting device for electrical component
#7505Acceleration sensor
#7506Interconnect structures with bond-pads and methods of forming bump sites on bond-pads
#7507Structure and method of making sealed capped chips
#7508Method of manufacturing a semiconductor device
#7509Semiconductor device with stacked chips and method for manufacturing thereof
#7510Method of fabricating microelectronic devices
#7511Method of assembling displays on substrates
#7512Multiplexed RF isolator
#7513Molded semiconductor device, apparatus for producing the same, and method for manufacturing the same
#7514Power semiconductor devices having integrated inductor
#7515Semiconductor switching module and method
#7516Integrated circuit package-in-package system
#7517Chip-stacked package structure
#7518EMBEDDED CHIP PACKAGE PROCESS AND CIRCUIT BOARD WITH EMBEDDED CHIP
#7519METHOD TO CREATE FLEXIBLE CONNECTIONS FOR INTEGRATED CIRCUITS
#7520Electronic device including a conductive stud over a bonding pad region
#7521Versatile Si-based packaging with integrated passive components for mmWave applications
#7522METHOD FOR SEPARATING PACKAGE OF WLP
#7523Bump pattern design for flip chip semiconductor package
#7524Integrated circuit component with a surface-mount housing
#7525Integrated circuit package system with molding vents
#7526Interposer and semiconductor package with reduced contact area
#7527Stackable multi-chip package system with support structure
#7528Electronic Device and Method For Producing the Same
#7529SEMICONDUCTOR DEVICE WITH INTERNAL HEAT SINK
#7530LEADFRAME AND NON-LEAD PACKAGE THEREWITH
#7531Electrical through contact
#7532Method for placing material onto a target board by means of a transfer board
#7533On-chip magnetic components
#7534Methods of forming electronic structures including conductive shunt layers and related structures
#7535Solder Ball Pad Structure
#7536Electronic system modules and method of fabrication
#7537SEMICONDUCTOR MULTI-CHIP PACKAGE AND FABRICATION METHOD
#7538Composite photoresist for modifying die-side bumps
#7539Film splicer
#7540Multiplexed RF isolator circuit
#7541Substrate structure integrated with passive components
#7542Multi-die DC-DC buck power converter with efficient packaging
#7543Methods for providing and using grid array packages
#7544Microelectronic device connection structure
#7545Semiconductor device and its wiring method
#7546Semiconductor device and its wiring method
#7547Semiconductor device
#7548Semiconductor device with interface peeling preventing rewiring layer
#7549Solder bumps in flip-chip technologies
#7550Semiconductor device and manufacturing method for the same
#7551Contact structure having a compliant bump and a testing area
#7552Substrate and process for semiconductor flip chip package
#7553Semiconductor device having bumps in a same row for staggered probing
#7554Solder connector structure and method
#7555Substrate structure integrated with passive components
#7556Package structure having semiconductor chip embedded therein and method for fabricating the same
#7557Contact device for use in a power semiconductor module or in a disc-type thyristor
#7558Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture
#7559Array-Processed Stacked Semiconductor Packages
#7560Semiconductor device
#7561Fabrication method and structure of PCB assembly, and tool for assembly thereof
#7562Bonding apparatus
#7563Method for self-assembling microstructures
#7564Bonding apparatus and method for cleaning tip of a bonding tool
#7565ELECTRONIC PACKAGE WITH OPTIMIZED LAMINATION PROCESS
#7566Method of designing semiconductor integrated circuit, designing apparatus, semiconductor integrated circuit system, semiconductor integrated circuit mounting substrate, package and semiconductor integrated circuit
#7567Single chip USB packages by various assembly methods
#7568Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device
#7569Structure of image sensor module and a method for manufacturing of wafer level package
#7570Method to build robust mechanical structures on substrate surfaces
#7571SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
#7572Flip chip mounting process and flip chip assembly
#7573SEMICONDUCTOR CHIP
#7574Semiconductor integrated circuit device
#7575Semiconductor device with reduced contact resistance
#7576Electronic component of VQFN design and method for producing the same
#7577Flip-chip semiconductor package and chip carrier for preventing corner delamination
#7578Semiconductor chip and method for manufacturing same, electrode structure of semiconductor chip and method for forming same, and semiconductor device
#7579Compliant Bumps for Integrated Circuits Using Carbon Nanotubes
#7580Chip having two groups of chip contacts
#7581Semiconductor device and manufacturing method therefor
#7582Electronic circuit in a package-on-package configuration and method for producing the same
#7583Pillar Bump Package Technology
#7584Chip package structure and manufacturing method thereof
#7585Surface mount multichip devices
#7586Chip package structure
#7587Interconnect structure for semiconductor package
#7588Structure of image sensor module and a method for manufacturing of wafer level package
#7589Semiconductor module with a power semiconductor chip and a passive component and method for producing the same
#7590Power semiconductor apparatus
#7591Methods and apparatus for packaging integrated circuit devices
#7592Semiconductor device and an information management system therefor
#7593Device With Mounted Electronic Parts, Method Of Producing The Same, Protection Circuit Module Of Secondary Battery, And Battery Package
#7594Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof
#7595Automatic level adjustment for die bonder
#7596Conductive adhesive rework method
#7597Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices
#7598Integrated circuit mount system with solder mask pad
#7599Method for manufacturing a semiconductor wiring base that includes a wiring base with wiring extending inside and outside of a mounting region
#7600Packaging structure with protective layers and packaging method thereof
#7601Chip scale package (CSP) assembly apparatus and method
#7602Diffusion soldered semiconductor device
#7603CIRCULAR WIRE-BOND PAD, PACKAGE MADE THEREWITH, AND METHOD OF ASSEMBLING SAME
#7604Transformer coils for providing voltage isolation
#7605Method for producing a dielectric layer for an electronic component
#7606ESD protection circuit for semiconductor device
#7607Semiconductor chip structure
#7608Method for producing chip packages, and chip package produced in this way
#7609Chip structure with redistribution traces
#7610Semiconductor device, mounting construction of a semiconductor device, and method of manufacturing the semiconductor device with the mounting construction
#7611Semiconductor device and method of producing the same
#7612Semiconductor device having an electrode pad, a bump provided above the electrode pad and a bump foundation layer therebetween
#7613Semiconductor device, electro-optical device, and method for manufacturing semiconductor device
#7614Method of manufacturing semiconductor device
#7615Methods and apparatus for packaging integrated circuit devices
#7616Semiconductor package and fabrication method thereof
#7617Semiconductor device
#7618CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF
#7619Semiconductor Package Having Improved Adhesion and Solderability
#7620Integrated circuit package system employing an exposed thermally conductive coating
#7621Semiconductor device and method of manufacturing the same
#7622Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#7623Electronic parts packaging structure and method of manufacturing the same
#7624Sheet Peeling Apparatus and Peeling Method
#7625Methods and systems for laser assisted wirebonding
#7626Quad flat no-lead (QFN) chip package assembly apparatus and method
#7627Compressible films surrounding solder connectors
#7628Structure of high performance combo chip and processing method
#7629Integrated circuit package, panel and methods of manufacturing the same
#7630Semiconductor device with electrode pad having probe mark
#7631Electronic device with EMI screen and packing process thereof
#7632Multilayer printed circuit board
#7633Power semiconductor module with connection elements electrically insulated from one another
#7634Thermally conductive composite and uses for microelectronic packaging
#7635Misalignment detection devices
#7636Copper bonding compatible bond pad structure and method
#7637Semiconductor package including dummy board and method of fabricating the same
#7638Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
#7639Method for bonding wafers to produce stacked integrated circuits
#7640Solderability Improvement Method for Leaded Semiconductor Package
#7641Superfine-circuit semiconductor package structure
#7642Flip chip package including a non-planar heat spreader and method of making the same
#7643Semiconductor constructions and assemblies, and electronic systems
#7644SEMICONDUCTOR PACKAGE
#7645Integrated circuit package system with ground bonds
#7646Composite multi-layer substrate and module using the substrate
#7647Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board
#7648Electronic module with switching functions and method for producing the same
#7649Multi-chip semiconductor connector assemblies
#7650Flip chip package and method of fabricating the same
#7651Chip package structure and fabricating method thereof
#7652Method of Manufacturing a Semiconductor Device
#7653Semiconductor device
#7654Bond and method for bonding two contact surfaces
#7655Method for production of a semiconductor component
#7656Bonding pad structure and method for making the same
#7657Method of providing mixed size solder bumps on a substrate using a solder delivery head
#7658Method of providing solder bumps of mixed sizes on a substrate using solder transfer in two stages
#7659Semiconductor package substrate for flip chip packaging
#7660Method of providing solder bumps of mixed sizes on a substrate using a sorting mask and bumped substrate formed according to the method
#7661Nickel tin bonding system for semiconductor wafers and devices
#7662Vibration-Assisted Method for Underfilling Flip-Chip Electronic Devices
#7663Semiconductor device and method of manufacturing the semiconductor device
#7664Tapered die-side bumps
#7665Semiconductor device
#7666Stack package having pattern die redistribution
#7667Multiple-dies semiconductor device with redistributed layer pads
#7668Integrated circuit (IC) chip and method for fabricating the same
#7669Semiconductor Device and Manufacturing Method Thereof, Semiconductor Package, and Electronic Apparatus
#7670IC chip, antenna, and manufacturing method of the IC chip and the antenna
#7671Chip stack, chip stack package, and method of forming chip stack and chip stack package
#7672Flexible joint methodology to attach a die on an organic substrate
#7673Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages
#7674Exposed top side copper leadframe manufacturing
#7675Method of fabricating an integrated circuit with etched ring and die paddle
#7676System Comprising an Electrical Component and an Electrical Connecting Lead for Said Component, and Method for the Production of Said System
#7677Solid state image pickup device, method for manufacturing the same, semiconductor device and method for manufacturing the same
#7678Bonding apparatus of semiconductor package
#7679COMPLIANT ELECTRICAL CONTACTS
#7680Circuit-connecting material and circuit terminal connected structure and connecting method
#7681Capping of metal interconnects in integrated circuit electronic devices
#7682Die configurations and methods of manufacture
#7683Method of manufacturing a semiconductor device
#7684Manufacturing method for a leadless multi-chip electronic module
#7685Method for bonding semiconductor chip
#7686Au bonding wire for semiconductor device
#7687BONDING MATERIALS HAVING PARTICLE WITH ANISOTROPIC SHAPE
#7688Die package and probe card structures and fabrication methods
#7689Use of a die-attach composition for high power semiconductors, method for attaching same to a printed circuit board and semiconductor device manufactured thereby
#7690SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#7691Semiconductor Module Having Low Thermal Load
#7692RF power transistor having an encapsulated chip package
#7693Semiconductor apparatus with decoupling capacitor
#7694Semiconductor package including connector disposed in troughhole
#7695Semiconductor device, and life prediction circuit and life prediction method for semiconductor device
#7696Micro universal serial bus (USB) memory package
#7697Semiconductor device, manufacturing method and apparatus for the same
#7698Molding methods to manufacture single-chip chip-on-board USB device
#7699Top layers of metal for high performance IC's
#7700Top layers of metal for high performance IC's
#7701Microelectronic assembly with back side metallization and method for forming the same
#7702Manufacturing method of semiconductor device
#7703Interposer containing bypass capacitors for reducing voltage noise in an IC device
#7704Integrated circuit (IC) package stacking and IC packages formed by same
#7705Multilayer bonding ribbon
#7706SEMICONDUCTOR DEVICE HAVING WIRE LOOP AND METHOD AND APPARATUS FOR MANUFACTURING THE SEMICONDUCTOR DEVICE
#7707Resin Paste For Die Bonding And Its Use
#7708Top layers of metal for high performance IC's
#7709Embedded chip package structure
#7710INTEGRATED INDUCTORS AND COMPLIANT INTERCONNECTS FOR SEMICONDUCTOR PACKAGING
#7711Top layers of metal for high performance IC's
#7712Top layers of metal for high performance IC's
#7713Top layers of metal for high performance IC's
#7714Top layers of metal for high performance IC's
#7715Top layers of metal for high performance IC's
#7716Top layers of metal for high performance IC's
#7717Top layers of metal for high performance IC's
#7718Top layers of metal for high performance IC's
#7719Top layers of metal for high performance IC's
#7720Top layers of metal for high performance IC's
#7721Top layers of metal for high performance IC's
#7722Method for manufacturing an electronic component and corresponding electronic component
#7723Structure and method for producing multiple size interconnections
#7724Electronic component, semiconductor device employing same, and method for manufacturing electronic component
#7725Semiconductor device having semiconductor element with back electrode on insulating substrate
#7726Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same
#7727Electrically conductive connection, electronic component and method for their production
#7728Semiconductor package having dimpled plate interconnections
#7729Stacking structure of chip package
#7730Surface mounting structure and packaging method thereof
#7731Thermal improvement for hotspots on dies in integrated circuit packages
#7732Bond wireless power module with double-sided single device cooling and immersion bath cooling
#7733IC chip package, and image display apparatus using same
#7734Multi-chip stacked package with reduced thickness
#7735Top layers of metal for high performance IC's
#7736METHODS OF FORMING SOLDER CONNECTIONS AND STRUCTURE THEREOF
#7737Methods of forming solder connections and structure thereof
#7738Substrate treating method and method of manufacturing semiconductor apparatus
#7739Fabrication method of semiconductor integrated circuit device
#7740Semiconductor package and method of assembling the same
#7741Method of fixing curved circuit board and wire bonding apparatus
#7742Computer systems having an interposer including a flexible material
#7743Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component
#7744Chip and flat panel display apparatus comprising the same
#7745Method for producing sheet with IC tags, apparatus for producing sheet with IC tags, sheet with IC tags, method for fixing IC chips, apparatus for fixing IC chips, and IC tag
#7746Electronics package and associated method
#7747Electronic circuit arrangement
#7748Top layers of metal for high performance IC's
#7749Top layers of metal for high performance IC's
#7750Top layers of metal for high performance IC's
#7751Top layers of metal for high performance IC's
#7752Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
#7753Semiconductor device having improved contacts
#7754Top layers of metal for high performance IC's
#7755Wiring board and method for manufacturing the same, and semiconductor device
#7756Method of making thermally enhanced substrate-base package
#7757Mounting integrated circuit dies for high frequency signal isolation
#7758Semiconductor device package utilizing proud interconnect material
#7759Semiconductor device and method for producing the semiconductor device
#7760Power semiconductor device connected in distinct layers of plastic
#7761Semiconductor device
#7762Electronic Part And Method Of Producing The Same
#7763Semiconductor integrated circuit device, and method of designing and manufacturing the same
#7764Method for fabricating flip-chip semiconductor package with lead frame as chip carrier
#7765Semiconductor device with improved high current performance
#7766Semiconductor device
#7767Interconnections resistant to wicking
#7768Package structure and lead frame using the same
#7769Methods and apparatus for a semiconductor device package with improved thermal performance
#7770Semiconductor package structure
#7771Device clamp for reducing oxidation in wire bonding
#7772SEMICONDUCTOR HAVING A BONDING WIRE AND PROCESS
#7773Assembly and method of assembling by soldering an object and a support
#7774HIGHLY COMPLIANT PLATE FOR WAFER BONDING
#7775Resonating conductive traces and methods of using same for bonding components
#7776Top layers of metal for high performance IC's
#7777Top layers of metal for high performance IC's
#7778Top layers of metal for high performance IC's
#7779Top layers of metal for high performance IC's
#7780Method of forming semiconductor packaged device
#7781Method of Dissipating heat, Packaging and Shaping for Light Emitting Diodes
#7782METHOD OF FORMING A TRACE EMBEDDED PACKAGE
#7783Backages with buried electrical feedthroughs
#7784On-chip inductor using redistribution layer and dual-layer passivation
#7785Stacked contact bump
#7786METHOD FOR FORMING INTERCONNECTS ON THIN WAFERS
#7787Semiconductor package and method for fabricating the same
#7788Encapsulated electronic device
#7789Semiconductor device
#7790Top layers of metal for high performance IC's
#7791Top layers of metal for high performance IC's
#7792Top layers of metal for high performance IC's
#7793Top layers of metal for high performance IC's
#7794Top layers of metal for high performance IC's
#7795Top layers of metal for high performance IC's
#7796Top layers of metal for high performance IC's
#7797Top layers of metal for high performance IC's
#7798Interlayer dielectric and pre-applied die attach adhesive materials
#7799Top layers of metal for high performance IC's
#7800Semiconductor circuit arrangement