212089 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Lead [Pb]
Semiconductor package structure having enhanced thermal dissipation characteristics
#7802Semiconductor package substrate and semiconductor package having the same
#7803Modular bonding pad structure and method
#7804Electronic assemblies and systems with filled no-flow underfill
#7805Producing thin integrated semiconductor devices
#7806Semiconductor integrated circuit device
#7807Stack structure of circuit board with semiconductor component embedded therein
#7808Stackable multi-chip package system
#7809Semiconductor package structure
#7810Au-Ag based alloy wire for semiconductor package
#7811Lead frame and method of manufacturing the same and semiconductor device
#7812Leadframe IC packages having top and bottom integrated heat spreaders
#7813Self-aligned wafer level integration system
#7814Semiconductor device and method for manufacturing the same
#7815Semiconductor device with reduced parasitic inductance
#7816Light-emitting device manufacturing method and light-emitting device
#7817Method for producing a chip-substrate connection
#7818Spring connector for making electrical contact at semiconductor scales
#7819Barrier layer for fine-pitch mask-based substrate bumping
#7820Fabrication method of semiconductor device
#7821Separation method of semiconductor device
#7822Non-cyanide gold electroplating for fine-line gold traces and gold pads
#7823Interconnect structure and formation for package stacking of molded plastic area array package
#7824Semiconductor component with connecting elements and method for producing the same
#7825Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates
#7826Top layers of metal for high performance IC's
#7827Top layers of metal for high performance IC's
#7828Top layers of metal for high performance IC's
#7829Top layers of metal for high performance IC's
#7830Top layers of metal for high performance IC's
#7831Top layers of metal for high performance IC's
#7832Top layers of metal for high performance IC's
#7833Top layers of metal for high performance IC's
#7834Top layers of metal for high performance IC's
#7835Top layers of metal for high performance IC's
#7836Method of wire bonding over active area of a semiconductor circuit
#7837Semiconductor device
#7838Semiconductor package, chip carrier structure thereof, and method for fabricating the chip carrier
#7839SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME
#7840METHOD FOR FABRICATING A MODULE HAVING AN ELECTRICAL CONTACT-CONNECTION
#7841Highly efficient both-side-cooled discrete power package, especially basic element for innovative power modules
#7842Semiconductor device and method for manufacturing the same
#7843Method and apparatus for depositing coplanar microelectronic interconnectors using a compliant mold
#7844Conductive adhesive composition
#7845Electronic components with plurality of contoured microelectronic spring contacts
#7846Method of providing solder bumps using reflow in a forming gas atmosphere
#7847Methodology to control underfill fillet size, flow-out and bleed in flip chips (FC), chip scale packages (CSP) and ball grid arrays (BGA)
#7848Temporary chip attach using injection molded solder
#7849METHOD FOR PROCESSING AN INTEGRATED CIRCUIT
#7850Heat sink electronic package having compliant pedestal
#7851Ultrasound Transducer and Method for Implementing High Aspect Ration Bumps for Flip-Chip Two Dimensional Arrays
#7852Integrated circuit package and multi-layer lead frame utilized
#7853Metallization layer for a power semiconductor device
#7854INTEGRATED CIRCUIT HAVING PADS AND INPUT/OUTPUT (I/O) CELLS
#7855Dual-sided chip attached modules
#7856Semiconductor device including electrically conductive bump and method of manufacturing the same
#7857Manufacturing a bump electrode with roughened face
#7858Dual MOSFET package
#7859Semiconductor device and method of manufacturing the same
#7860No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement
#7861Integrated circuit package system with different mold locking features
#7862Wafer level semiconductor chip packages and methods of making the same
#7863Electronic component having a semiconductor power device
#7864Flip chip MLP with folded heat sink
#7865Copper straps
#7866Dual side cooling integrated power device module and methods of manufacture
#7867Top layers of metal for high performance IC's
#7868Methods and apparatus having an integrated circuit attached to fused silica
#7869Method for manufacturing an electronics module
#7870Method and apparatus for locating and/or forming bumps
#7871Method for forming a semiconductor on insulator structure
#7872Micro-package, multi-stack micro-package, and manufacturing method therefor
#7873Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
#7874Method of manufacturing a semiconductor device
#7875Super high density module with integrated wafer level packages
#7876Method for fabricating semiconductor package with multi-layer die contact and external contact
#7877SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#7878Semiconductor device having a chip stack on a rewiring plate
#7879Semiconductor device
#7880Manufacturing method of resin-molding type semiconductor device, and wiring board therefor
#7881Top layers of metal for high performance IC's
#7882Top layers of metal for high performance IC's
#7883Top layers of metal for high performance IC's
#7884Top layers of metal for high performance IC's
#7885Top layers of metal for high performance IC's
#7886Top layers of metal for high performance IC's
#7887Circuit board, method for manufacturing the same, and semiconductor device
#7888Heat sink structure for embedded chips and method for fabricating the same
#7889COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same
#7890Method of fabricating microelectronic devices
#7891THREE-DIMENSIONAL PACKAGING SCHEME FOR PACKAGE TYPES UTILIZING A SACRIFICIAL METAL BASE
#7892INTERCONNECTED IC PACKAGES WITH VERTICAL SMT PADS
#7893Integrated circuit device with semiconductor device components embedded in plastic housing composition
#7894Semiconductor device having shifted stacked chips
#7895Lead frame and semiconductor device using the same
#7896WIRE BONDING PROCESS FOR INSULATED WIRES
#7897METHOD FOR MANUFACTURING WAFER-LEVEL PACKAGES FOR FLIP CHIPS CAPABLE OF PREVENTING ADHESIVES FROM ABSORBING WATER
#7898Interconnection structure, electronic component and method of manufacturing the same
#7899Process for fabricating chip package structure
#7900Printed circuit board
#7901Semiconductor module
#7902SEMICONDUCTOR MODULE
#7903Increased interconnect density electronic package and method of fabrication
#7904Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips
#7905METHODS OF REACTIVE COMPOSITE JOINING WITH MINIMAL ESCAPE OF JOINING MATERIAL
#7906Process for forming bumps and solder bump
#7907Test pads on flash memory cards
#7908CHIP STRUCTURE AND FABRICATING PROCESS THEREOF
#7909Arrangement for welding workpieces by means of an ultrasonic device
#7910CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD
#7911ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOUND THICKNESS AND OXIDATION OF METALS AND ALLOYS
#7912Method of making a radio frequency identification (RFID) tag
#7913Method of forming stackable package
#7914Method of making wirebond electronic package with enhanced chip pad design
#7915INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME
#7916CHIP PACKAGING STRUCTURE
#7917Method for forming C4 connections on integrated circuit chips and the resulting devices
#7918Semiconductor device having a smaller electrostatic capacitance electrode
#7919Bump structure, method of forming bump structure, and semiconductor apparatus using the same
#7920Power semiconductor module as H-bridge circuit and method for producing the same
#7921SEMICONDUCTOR PACKAGE STRUCTURES HAVING HEAT DISSIPATIVE ELEMENT DIRECTLY CONNECTED TO INTERNAL CIRCUIT AND METHODS OF FABRICATING THE SAME
#7922Stackable integrated circuit structures and systems devices and methods related thereto
#7923Circuit apparatus and method of fabricating the apparatus
#7924Packaging of integrated circuits to lead frames
#7925System and method for providing a power bus in a wirebond leadframe package
#7926Semiconductor device, method for manufacturing semiconductor device, and electronic appliance having the semiconductor device
#7927Semiconductor device with via hole of uneven width
#7928Method of manufacturing semiconductor apparatus
#7929PANEL AND SEMICONDUCTOR DEVICE HAVING A STRUCTURE WITH A LOW-K DIELECTRIC
#7930Method for fabricating semiconductor package free of substrate
#7931Method for fabricating multi-chip semiconductor package
#7932Semiconductor device and method of manufacturing the semiconductor device
#7933Semiconductor die package including multiple dies and a common node structure
#7934Method for applying rewiring to a panel while compensating for position errors of semiconductor chips in component positions of the panel
#7935Surface mounting electronic component and manufacturing method thereof
#7936Semiconductor device
#7937Integrated circuit devices with stacked package interposers
#7938Power semiconductor component, power semiconductor device as well as methods for their production
#7939Semiconductor power module including epoxy resin coating
#7940Semiconductor device and method for producing the same
#7941Semiconductor device and method of manufacturing the same
#7942Hard disk drive preamp heat dissipation methods
#7943Utra-thin substrate package technology
#7944Semiconductor components having encapsulated through wire interconnects (TWI)
#7945Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of electronic device containing additional metal powder component
#7946Leadframe enhancement and method of producing a multi-row semiconductor package
#7947Package for optical device and method of manufacturing the same
#7948Power semiconductor module having surface-mountable flat external contacts and method for producing the same
#7949Memory circuit system having semiconductor devices and a memory
#7950MULTI-DIE INDUCTOR
#7951MOSFET power package
#7952Semiconductor device using semiconductor chip
#7953Fill head for injection molding of solder
#7954Universal mold for injection molding of solder
#7955Tail wire cutting method and bonding apparatus
#7956Method of producing semiconductor package, apparatus for producing semiconductor package, and adhesive film
#7957Method for Electroplating and Contact Projection Arrangement
#7958Fabrication method for electronic system modules
#7959FINE PITCH MICROFABRICATED SPRING CONTACT STRUCTURE & METHOD
#7960Method of manufacturing a through electrode
#7961POP Semiconductor Device Manufacturing Method
#7962Flip-chip mounting method and bump formation method
#7963Method of wafer level chip size packaging
#7964Solder joint flip chip interconnection having relief structure
#7965Wiring board, semiconductor device using the same, and method for manufacturing wiring board
#7966Conductive structures including titanium-tungsten base layers
#7967Semiconductor device, substrate for producing semiconductor device and method of producing them
#7968Stacked semiconductor device
#7969Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device
#7970Optical display package and the method thereof
#7971Adhesive sheet, semiconductor device, and process for producing semiconductor device
#7972Etched leadframe flipchip package system
#7973Alternative flip chip in leaded molded package design and method for manufacture
#7974Low inductance bond-wireless co-package for high power density devices, especially for IGBTs and diodes
#7975Semiconductor light emitting device with first and second leads
#7976PROCESS FOR PRODUCING POWER SEMICONDUCTOR COMPONENTS USING A MARKER
#7977NOVEL UNDER-BUMP METALLIZATION FOR BOND PAD SOLDERING
#7978Method for bonding a semiconductor substrate to a metal substrate
#7979Transfer tape strap process
#7980Apparatuses and methods to enhance passivation and ILD reliability
#7981Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing
#7982Bilayer Laminated Film for Bump Formation and Method of Bump Formation
#7983Semiconductor device having heat radiation member and semiconductor chip and method for manufacturing the same
#7984Bonding Wire and Integrated Circuit Device Using the Same
#7985Semiconductor die packages using thin dies and metal substrates
#7986Chip with power and signal pads connected to power and signal lines on substrate
#7987Integrated circuit package system with wire bond pattern
#7988Hybrid flip-chip and wire-bond connection package system
#7989Semiconductor device having an adhesion promoting layer and method for producing it
#7990Methods and apparatus for a reduced inductance wirebond array
#7991Integrated circuit package system with ground ring
#7992Semiconductor package and method using isolated Vplane to accommodate high speed circuitry ground isolation
#7993Integrated circuit package system with net spacer
#7994ELECTRONIC DEVICE MOUNTING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#7995Electronic device with selective nickel palladium gold plated leadframe and method of making the same
#7996Capacitor structure of semiconductor device and method of fabricating the same
#7997Chip scale surface mount package for semiconductor device and process of fabricating the same
#7998Semiconductor device and method of manufacturing the same
#7999SEMICONDUCTOR DEVICE HAVING CARBON NANOTUBE INTERCONNECTS AND METHOD OF FABRICATION
#8000Wire bonding capillary tool having multiple outer steps
#8001Electronic device substrate and its fabrication method, and electronic device and its fabrication method
#8002Devices with microjetted polymer standoffs
#8003Multichip package system
#8004Multiple flip-chip integrated circuit package system
#8005QFN housing having optimized connecting surface geometry
#8006Semiconductor device having adhesion increasing film to prevent peeling
#8007Semiconductor device and method for manufacturing the same
#8008Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging
#8009Method for forming metal bumps
#8010Method and structure for eliminating aluminum terminal pad material in semiconductor devices
#8011Methods and materials useful for chip stacking, chip and wafer bonding
#8012Singulating surface-mountable semiconductor devices and fitting external contacts to said devices
#8013Room temperature metal direct bonding
#8014Semiconductor device fabricating method
#8015Process for fabricating a semiconductor package
#8016Method for making a wedge wedge wire loop
#8017Gold/silicon eutectic die bonding method
#8018Flexible interconnect pattern on semiconductor package
#8019Method of forming a microelectronic package using control of die and substrate differential expansions and microelectronic package formed according to the method
#8020Functional blocks for assembly
#8021Fabrication method of semiconductor integrated circuit device
#8022Article and assembly for magnetically directed self assembly
#8023Method of correcting bonding coordinates using reference bond pads
#8024Flip chip bonding structure
#8025Power module
#8026Carbon nanotube via interconnect
#8027Isolating chip-to-chip contact
#8028Semiconductor device with guard rings that are formed in each of the plural wiring layers
#8029Semiconductor chip comprising a metal coating structure and associated production method
#8030Semiconductor device and manufacturing method thereof
#8031Power semiconductor component with a power semiconductor chip and method for producing the same
#8032Semiconductor chip having fine pitch bumps and bumps thereon
#8033Interconnect structure with stress buffering ability and the manufacturing method thereof
#8034Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices
#8035Method for fabricating chip package structure
#8036Semiconductor device including a DC-DC converter
#8037Folding chip planar stack package
#8038Grounding structure of semiconductor device including a conductive paste
#8039CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING BUMPS
#8040Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
#8041Method and arrangement for forming a microelectronic package
#8042Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out
#8043Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium
#8044Solder layer and electronic device bonding substrate and submount using the same
#8045Connecting device for electronic components
#8046Multilayer printed circuit board
#8047Heat conduction from an embedded component
#8048HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
#8049SYSTEM AND METHOD FOR ADHERING LARGE SEMICONDUCTOR APPLICATIONS TO PCB
#8050Resin Paste for Die Bonding
#8051Method of forming a semiconductor device having bonding pad of the second chip thinner than bonding pad of the first chip
#8052PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
#8053Single passivation layer scheme for forming a fuse
#8054Separation method for cutting semiconductor package assemblage for separation into semiconductor packages
#8055Die bonding
#8056INDIUM FEATURES ON MULTI-CONTACT CHIPS
#8057Conductor composition, a mounting substrate and a mounting structure utilizing the composition
#8058SEMICONDUCTOR DEVICE WITH SOLDERABLE LOOP CONTACTS
#8059On-die bond wires system and method for enhancing routability of a redistribution layer
#8060Semiconductor device and fabrication process thereof
#8061Structure and method to improve current-carrying capabilities of C4 joints
#8062Chip package
#8063Method for precision assembly of integrated circuit chip packages
#8064Semiconductor components with through wire interconnects
#8065Electronic component having exposed surfaces
#8066Semiconductor devices and electrical parts manufacturing using metal coated wires
#8067Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same
#8068Semiconductor device and manufacturing method of a semiconductor device
#8069Semiconductor integrated circuit device
#8070Semiconductor component having test pads and method and apparatus for testing same
#8071Electronic component and its manufacturing method
#8072Accelerated B-Stage curing process for thermosetting resins and FBGA assembly process utilizing the accelerated B-Stage curing process
#8073Adhesion tape and method for mounting a chip onto a substrate
#8074Power transistor and power semiconductor device
#8075Method for forming metal bumps
#8076Method for manufacturing bump of wafer level package
#8077Manufacturing method of a semiconductor device
#8078Manufacturing method of semiconductor device
#8079Semiconductor component having test pads and method and apparatus for testing same
#8080Method for producing semiconductor components
#8081Flip-chip type semiconductor device
#8082Low thermal resistance assembly for flip chip applications
#8083Semiconductor device
#8084Aluminum bump bonding for fine aluminum wire
#8085Device having a contacting structure
#8086Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same
#8087Heat-radiating tape carrier package and method for manufacturing the same
#8088METHOD FOR MOUNTING AN ELECTRONIC PART ON A SUBSTRATE USING A LIQUID CONTAINING METAL PARTICLES
#8089Multichip module with improved system carrier
#8090Semiconductor package with heat spreader
#8091Semiconductor device
#8092Semiconductor device
#8093Chip-scale package
#8094Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink
#8095Connecting a plurality of bond pads and/or inner leads with a single bond wire
#8096Chip Package Structure
#8097Chip package and wafer treating method for making adhesive chips
#8098Semiconductor chip assembly
#8099Chip packaging structure for improving reliability
#8100Vertical semiconductor power switch, electronic component and methods of producing the same