Stacked integrated circuit packages that include monolithic conductive vias

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

BUMPED CHIP WITH DISPLACEMENT OF GOLD BUMPS

Semiconductor device including a reduced stress configuration for metal pillars

Flip chip with interposer

Less expensive high power plastic surface mount package

Semiconductor packing having offset stack structure

Semiconductor memory device and semiconductor memory card

Semiconductor device including semiconductor chip mounted on lead frame

Pre-molded, clip-bonded multi-die semiconductor package

Chip package and manufacturing method thereof

Semiconductor device and manufacturing method thereof

POWER SEMICONDUCTOR MODULE

Method of manufacturing a multilayer printed wiring board

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

Combined diode, lead assembly incorporating an expansion joint

Semiconductor package with passivation island for reducing stress on solder bumps

SEMICONDUCTOR DEVICE

METHOD OF PRODUCING SEMICONDUCTOR DEVICE PROVIDED WITH FLIP-CHIP MOUNTED SEMICONDUCTOR ELEMENT

Direct die attach utilizing heated bond head

Single-layer component package

FUNCTIONAL-DEVICE-EMBEDDED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC EQUIPMENT

Anisotropic conductive material, connected structure, and production method thereof

Semiconductor device and manufacturing method thereof

Semiconductor package system with cavity substrate and manufacturing method therefor

Hybrid Semiconductor Chip Package

Semiconductor electronic component and semiconductor device using the same

Wafer level package using stud bump coated with solder

APPARATUS FOR USE IN SEMICONDUCTOR WAFER PROCESSING FOR LATERALLY DISPLACING INDIVIDUAL SEMICONDUCTOR DEVICES AWAY FROM ONE ANOTHER

SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND WIRING BOARD

Electronic Device and Manufacturing Method for Electronic Device

APPLICATION OF A SELF-ASSEMBLED MONOLAYER AS AN OXIDE INHIBITOR

Optoelectronic device having a multi-layer solder and manufacturing method thereof

Methods of Forming Integrated Circuit Contact Pads Using Electroless Plating of Diffusion Barrier Layers

Solder joint flip chip interconnection having relief structure

Semiconductor substrates with unitary vias and via terminals, and associated systems and methods

Electric power semiconductor device

Semiconductor package, semiconductor module, and method for fabricating the semiconductor package

Through-silicon via structures providing reduced solder spreading and methods of fabricating the same

Semiconductor package with a metal post

Semiconductor device and method of manufacturing the same

IC die having TSV and wafer level underfill and stacked IC devices comprising a workpiece solder connected to the TSV

Stackable semiconductor assemblies and methods of manufacturing such assemblies

Thermally improved semiconductor QFN/SON package

Semiconductor package with embedded spiral inductor

Chip Module for Installing in Sensor Chip Cards for Fluidic Applications and Method for Producing a Chip Module of This Type

Self-assembly of components

ELECTRIC CONTACT AND METHOD FOR PRODUCING THE SAME AND CONNECTOR USING THE ELECTRIC CONTACTS

Dicing/die bonding film

Electronic device and method for fabricating the same

Bonding apparatus and bonding method

PACKAGE, AND FABRICATION METHOD FOR THE PACKAGE

Electrical Component

Semiconductor device, manufacturing method thereof, and manufacturing method of semiconductor module

Semiconductor die package including multiple dies and a common node structure

Semiconductor device and method of manufacturing the same

Semiconductor device with improved resin configuration

Packaging systems and methods

Bond pad connection to redistribution lines having tapered profiles

Backside connection to TSVs having redistribution lines

Interconnect structures and methods

Forming solder balls on substrates

Bonding apparatus and bonding method

Selective solder stop

METHOD AND APPARATUS FOR WAFER BONDING

Arrangement for hermetically sealing components, and method for the production thereof

Semiconductor power conversion apparatus and method of manufacturing the same

LITHOGRAPHIC CONTACT ELEMENTS

Semiconductor device and method of manufacturing the same

Module having a stacked passive element and method of forming the same

Mounting method using dilatancy fluid

Semiconductor device and method of bonding wires between semiconductor chip and wiring substrate

Electronic component, a semiconductor wafer and a method for producing an electronic component

Semiconductor package having bump ball

Carbon nanotube-reinforced solder caps, and chip packages and systems containing same

Metallic bump structure without under bump metallurgy and manufacturing method thereof

SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF THE SAME

Dual or multiple row package

Module having a stacked passive element and method of forming the same

THIN FOIL FOR USE IN PACKAGING INTEGRATED CIRCUITS

Multilayer circuit board and method for manufacturing the same

Thermosetting die-bonding film

MEMORY MODULE

Circuit device and method of manufacturing the same

Adhesive tape and semiconductor device using the same

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR MODULE

Window BGA semiconductor package

Microelectronic package with carbon nanotubes interconnect and method of making same

Insulation covering structure for a semiconductor element with a single die dimension and a manufacturing method thereof

Semiconductor device assemblies, electronic devices including the same and assembly methods

Semiconductor package having ink-jet type dam and method of manufacturing the same

Lead frame and method of manufacturing the same

Device including a power semiconductor chip electrically coupled to a leadframe via a metallic layer

Device including two mounting surfaces

On-chip RF shields with front side redistribution lines

Packaging technology

Lock and key through-via method for wafer level 3 D integration and structures produced

Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same

Glass thick film embedded passive material

Device and method for making a semiconductor device including bonding two bonding partners

Wiring board with built-in electronic component and method for manufacturing the same

ADHESIVE FOR ELECTRONIC COMPONENTS

Method of forming electrode connecting portion

Method and apparatus for fabricating self-assembling microstructures

Protecting sidewalls of semiconductor chips using insulation films

Connection by fitting together two soldered inserts

Wire bonding structure and manufacturing method thereof

Method of forming a wafer level package with RDL interconnection over encapsulant between bump and semiconductor die

Multiple die structure and method of forming a connection between first and second dies in same

Method of manufacturing an electronic system

High-Electrical-Current Wafer Level Packaging, High-Electrical-Current WLP Electronic Devices, and Methods of Manufacture Thereof

Stacking package structure with chip embedded inside and die having through silicon via and method of the same

Semiconductor device for battery power voltage control

Semiconductor device and manufacturing method of a semiconductor device

Integrated circuit packaging system having planar interconnect

Low cost die placement

Semiconductor package system with die support pad

Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same

Method of electrically connecting a shielding layer to ground through a conductive via disposed in peripheral region around semiconductor die

Solder ball printing apparatus

Electronic component mounting structure

Connecting terminal, semiconductor package using connecting terminal and method for manufacturing semiconductor package

Substrate of window ball grid array package

Apparatus to manufacture a semiconductor package having a buffer disposed adjacent to a process unit of the apparatus

Method for the Production of a Windshield Wiping Concentrate in the Form of Tablets, Windshield Wiping Concentrate, and Corresponding Presentation

Method of manufacturing a semiconductor device

Castellation wafer level packaging of integrated circuit chips

Semiconductor device and a method of manufacturing the same

Fabrication method of package structure with simplified encapsulation structure and simplified wiring

MODULE INCLUDING A STABLE SOLDER JOINT

Semiconductor package and method using isolated Vplane to accommodate high speed circuitry ground isolation

Solder joint flip chip interconnection

Methods of forming solder connections and structure thereof

METHOD OF WIREBONDING THAT UTILIZES A GAS FLOW WITHIN A CAPILLARY FROM WHICH A WIRE IS PLAYED OUT

Power semiconductor module including a multilayer substrate

PACKAGING STRUCTURE, PACKAGING METHOD AND PHOTOSENSITIVE DEVICE

Bond pad structures and semiconductor devices using the same

Semiconductor package

Method of manufacturing a semiconductor device

Stacked Semiconductor Chips with Through Substrate Vias

Process for making contact with and housing integrated circuits

Electronic component mounting apparatus and electronic component mounting method

CONDUCTIVE PARTICLE, ADHESIVE COMPOSITION, CIRCUIT-CONNECTING MATERIAL, CIRCUIT-CONNECTING STRUCTURE, AND METHOD FOR CONNECTION OF CIRCUIT MEMBER

Method of manufacturing a semiconductor device

Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers

Method of fabicating a microelectronic die having a curved surface

Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device

Electronic module with a conductive-pattern layer and a method of manufacturing same

Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic component

Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods

SEMICONDUCTOR DEVICE HAVING AN INTERLAYER INSULATING FILM WIRING LAMINATED STRUCTURE SECTION AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device

Semiconductor chip capable of increased number of pads in limited region and semiconductor package using the same

Adhesive tape, connected structure and semiconductor package

Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers

Integrated capacitors in package-level structures, processes of making same, and systems containing same

Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit

Method for producing an LTCC substrate

Microstructure Apparatus and Method for Manufacturing Microstructure Apparatus

Electrically conductive structure on a semiconductor substrate formed from printing

Semiconductor package structures

Thermosetting die-bonding film

Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages

Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages

PROCESS AND PASTE FOR CONTACTING METAL SURFACES

Packaging substrate with embedded semiconductor component and method for fabricating the same

Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same

Wafer level compliant packages for rear-face illuminated solid state image sensors

Electronic component mounting structure and method for manufacturing the same

SEMICONDUCTOR DEVICE INCLUDING COLUMNAR ELECTRODES HAVING PLANAR SIZE GREATER THAN THAT OF CONNECTION PAD PORTION OF WIRING LINE, AND MANUFACTURING METHOD THEREOF

Wafer level package and method of manufacturing the same

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SAME AND METHOD OF REPAIRING SAME

Crystal structure of a solder bump of flip chip semiconductor device

Methods of forming C4 round dimple metal stud bumps for fine pitch packaging applications and structures formed thereby

SURFACE SMOOTHENED ULTRAHIGH CONDUCTIVITY COMPOSITE LID FOR IMPROVED MARKING PERMANENCY OF SEMICONDUCTOR PACKAGED DEVICES

Ball grid array package having one or more stiffeners

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method for fabricating semiconductor device

ENHANCED WIRE BOND STABILITY ON REACTIVE METAL SURFACES OF A SEMICONDUCTOR DEVICE BY ENCAPSULATION OF THE BOND STRUCTURE

Semiconductor device and method of forming the device using sacrificial carrier

3-D integrated semiconductor device comprising intermediate heat spreading capabilities

Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wire

Resin sealing type semiconductor device and method of manufacturing the same, and lead frame

Resin sealing type semiconductor device and method of manufacturing the same, and resin sealing type electronic device

WIRE BODNING PACKAGE STRUCTURE

Semiconductor system-in-a-package containing micro-layered lead frame

Molded ultra thin semiconductor die packages, systems using the same, and methods of making the same

Substrate for semiconductor package and semiconductor package having the same

Package, method of manufacturing a package and frame

Method for forming an integral electromagnetic radiation shield in an electronic package

CONTROLLING THE POROSITY OF METAL PASTES FOR PRESSURE FREE, LOW TEMPERATURE SINTERING PROCESS

METHOD FOR APPLYING AN ADHESIVE LAYER ON THIN CUT SEMICONDUCTOR CHIPS OF SEMICONDUCTOR WAFERS

Bonded structure and bonding method

Method of fabricating a high Q factor integrated circuit inductor

Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages

ADHESIVE SHEET FOR PRODUCING A SEMICONDUCTOR DEVICE, AND A METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE USING THE SAME

Integrated circuit apparatus, systems, and methods

3D integrated circuit device fabrication using interface wafer as permanent carrier

Method for fabricating semiconductor component having encapsulated through wire interconnect (TWI)

TRANSIENT LIQUID PHASE EUTECTIC BONDING

Electrical component and film composite laminated on the component and method for production

Semiconductor device having pairs of pads

SEMICONDUCTOR DEVICE

Semiconductor device bonding with stress relief connection pads

Method of forming collapse chip connection bumps on a semiconductor substrate

SEMICONDUCTOR DIE SUPPORT IN AN OFFSET DIE STACK

Semiconductor device and method of fabricating semiconductor device

Semiconductor device

ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Solder joint reliability in microelectronic packaging

CIRCUIT SUBSTRATE, AN ELECTRONIC DEVICE ARRANGEMENT AND A MANUFACTURING PROCESS FOR THE CIRCUIT SUBSTRATE

Advanced quad flat non-leaded package structure and manufacturing method thereof

Semiconductor device having a sealant layer including carbon directly contact the chip and the carrier

Electrode structure and method for forming bump

Semiconductor device and manufacturing method thereof

Methods of forming semiconductor constructions and assemblies

Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time

LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE

Through-silicon via structures including conductive protective layers

Semiconductor integrated circuit device, mounting structure of semiconductor integrated circuit device, and method for manufacturing semiconductor integrated circuit device

Semiconductor device

Method of making a sidewall-protected metallic pillar on a semiconductor substrate

MINIATURE MICROWAVE PACKAGE AND PROCESS FOR FABRICATING THE PACKAGE

Bond pad for wafer and package for CMOS imager

Semiconductor package and manufacturing method thereof

Integrated circuit package with open substrate

Method of packaging and interconnection of integrated circuits

Method for forming terminal of stacked package element and method for forming stacked package

Processes for forming photovoltaic devices

Aluminum bump bonding for fine aluminum wire

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages

Methods of making compliant semiconductor chip packages

Method of manufacturing stacked semiconductor device

Method for fabricating package structure of stacked chips

Bond pad structure and method for producing same

Enhanced reliability for semiconductor devices using dielectric encasement

Combination via and pad structure for improved solder bump electromigration characteristics

Method for forming bumps in substrates with through vias

Semiconductor device with multilayer wiring structure formed within and method of manufacturing the same

Semiconductor chip and semiconductor device

BUMP STRUCTURE FOE SEMICONDUCTOR DEVICE

Structures and methods for improving solder bump connections in semiconductor devices

Semiconductor assembly with component pads attached on die back side

Package structure

IC Package Method Capable of Decreasing IR Drop and Associated IC Apparatus

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Through wafer vias and method of making same

Through wafer vias and method of making same

Wafer level semiconductor module and method for manufacturing the same

Assembling of Electronic Members on IC Chip

Through silicon via and method of fabricating same

Radio frequency power semiconductor device comprising matrix of cavities as dielectric isolation structure

Light emitting diode package and method of manufacturing the same

Electrical connection of components

Method for manufacturing multilayer printed circuit board

Maskless Process for Solder Bump Production

Dicing die-bonding film

DICING DIE-BONDING FILM

Conductive bump, method for manufacturing the conductive bump, semiconductor device and method for manufacturing the semiconductor device

SHIELDED WIREBOND

Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding process

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Semiconductor device mounted structure and semiconductor device mounted method

Semiconductor device and manufacturing method thereof

Method for forming an etched recess package on package system

Semiconductor device, semiconductor module, method for manufacturing semiconductor device, and lead frame

Method and System for Secure Heat Sink Attachment on Semiconductor Devices with Macroscopic Uneven Surface Features

IC chip package and image display device incorporating same

Standoff height improvement for bumping technology using solder resist

Method of manufacturing a stacked semiconductor apparatus

ADHESIVE TAPE

Method of manufacturing a wafer including providing electrical conductors isolated from circuitry

STACKED DIE PACKAGE HAVING REDUCED HEIGHT AND METHOD OF MAKING SAME

Semiconductor device including a transformer on chip

Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus

Semiconductor device and method of manufacturing a semiconductor device

Semiconductor module and a method for producing an electronic circuit

UNIVERSAL SUBSTRATE FOR SEMICONDUCTOR PACKAGES AND THE PACKAGES

Semiconductor device and manufacturing method

DICING/DIE BONDING FILM

Under bump metallization for on-die capacitor

STACK TYPE SEMICONDUCTOR CHIP PACKAGE HAVING DIFFERENT TYPE OF CHIPS AND FABRICATION METHOD THEREOF

EMBEDDED CHIP SUBSTRATE AND FABRICATION METHOD THEREOF

ANISOTROPIC CONDUCTIVE TAPE AND METHOD OF MANUFACTURING IT, CONNECTED STRUCTURE AND METHOD OF CONNECTING CIRCUIT MEMBER BY USE OF THE TAPE

Multilayer printed circuit board and multilayer printed circuit board manufacturing method

Holding jig for electronic parts

LIQUID EPOXY RESIN COMPOSITION

Semiconductor device, manufacturing method and apparatus for the same

Semiconductor device having projecting electrode formed by electrolytic plating, and manufacturing method thereof

Bonding metallurgy for three-dimensional interconnect

Semiconductor device and manufacturing method thereof

Method of fabricating a chip

Magnetic self-assembly for integrated circuit packages

METHODS AND SYSTEMS FOR PACKAGING INTEGRATED CIRCUITS WITH THIN METAL CONTACTS

Printed circuit board

Apparatus and methods for through substrate via test

Stacked semiconductor chips with separate encapsulations

Semiconductor device, production method for the same, and substrate