Semiconductor package with passivation island for reducing stress on solder bumps

Semiconductor device and method of forming interconnect structure in non-active area of wafer

Integrated circuit packaging system with passive components

Method and structure for dispensing chip underfill through an opening in the chip

Integrated semiconductor substrate structure using incompatible processes

Semiconductor substrate elastomeric stack

Semiconductor device and manufacturing method of the same

Air cavity package for flip-chip

Method of manufacturing integrated circuit package system with warp-free chip

Center Conductor to Integrated Circuit for High Frequency Applications

Semiconductor package and method of reducing electromagnetic interference between devices

Low ohmic through substrate interconnection for semiconductor carriers

Semiconductor device

Bump forming method using self-assembling resin and a wall surface

Three dimensional packaging optimized for high frequency circuitry

Thermo-compression bonded electrical interconnect structure and method

Manufacturing method of semiconductor apparatus comprising alignment patterns in scribe regions

Sheet-Like Underfill Material and Semiconductor Device Manufacturing Method

Electromagnetic shield formation for integrated circuit die package

Method of manufacturing a semiconductor device

Process for making microelectronic element chips

Method of manufacturing semiconductor device

BALL FILM FOR INTEGRATED CIRCUIT FABRICATION AND TESTING

Electronic component soldering structure and electronic component soldering method

Minimizing the number of external terminals required when compensation is to be provided for signal drop in bond wire of a package in which an integrated circuit is provided

Bonding method of semiconductor and laminated structure fabricated thereby

Connecting and bonding adjacent layers with nanostructures

Thermo-compression bonded electrical interconnect structure and method

Integrated circuit, circuit system, and method of manufacturing

Redistribution layer for wafer-level chip scale package and method therefor

Method of forming low stress multi-layer metallurgical structures and high reliable lead free solder termination electrodes

Semiconductor device and method for manufacturing the same

Structure and method for fabricating flip chip devices

SEMICONDUCTOR APPARATUS AND FABRICATION METHOD THEREOF

Electronic assemblies providing active side heat pumping

MICROELECTRONIC PACKAGE AND METHOD OF FORMING SAME

Multilayer wiring substrate, method of manufacturing the same, and semiconductor device

Intergrated circuit packaging with improved die bonding

Integrated circuit package system with dual connectivity

Thermal enhanced upper and dual heat sink exposed molded leadless package

NANO-SCALE PARTICLE PASTE FOR WIRING MICROELECTRONIC DEVICES USING INK-JET PRINTING

Apparatus and method for arranging magnetic solder balls

Flip-chip component production method

Formation of circuitry with modification of feature height

Printed circuit board manufacturing method

3D IC method and device

Microelectronic package interconnect and method of fabrication thereof

Manufacturing process for a quad flat non-leaded chip package structure

MANUFACTURING PROCESS FOR A QUAD FLAT NON-LEADED CHIP PACKAGE STRUCTURE

Semiconductor connection component

Manufacturing process for a quad flat non-leaded chip package structure

Manufacturing process for a chip package structure

Manufacturing process for a chip package structure

Manufacturing process for a chip package structure

Alkali silicate glass based coating and method for applying

POSITIVE PHOTORESIST COMPOSITION, THICK FILM PHOTORESIST LAMINATE, METHOD FOR PRODUCING THICK FILM RESIST PATTERN, AND METHOD FOR PRODUCING CONNECTING TERMINAL

Packaging Method For Wideband Power Using Transmission Lines

Semiconductor chip with crack stop

Package structure for multiple die stack

Semiconductor device and method of manufacturing the same

Methods of forming nano-coatings for improved adhesion between first level interconnects and epoxy under-fills in microelectronic packages and structures formed thereby

PACKAGED INTEGRATED CIRCUIT AND METHOD OF FORMING THEREOF

Multi-chip semiconductor device

Dual-sided chip attached modules

SEMICONDUCTOR PACKAGE WITH REDUCED VOLUME AND SIGNAL TRANSFER PATH

Semiconductor package with improved size, reliability, warpage prevention, and heat dissipation and method for manufacturing the same

Semiconductor device with leadframe including a diffusion barrier

Semiconductor package and method of assembling a semiconductor package

Semiconductor device including a coupling conductor having a concave and convex

Semiconductor packaging process using through silicon vias

Semiconductor device and producing method of the same

Conductive metal structure applied to a module IC and method of manufacturing the same

ELECTRONIC DEVICE

Printed wiring board

Manufacturing process for a Quad Flat Non-leaded chip package structure

Method for forming bumps on under bump metallurgy

Method of producing electronic apparatus

Semiconductor device

Semiconductor device having at least two terminals among the plurality of terminals electrically connected to each other while not being adjacent to one other and not being connected to internal circuit

Semiconductor device, method of manufacturing the semiconductor device, flip chip package having the semiconductor device and method of manufacturing the flip chip package

Flip chip for electrical function test and manufacturing method thereof

SEMICONDUCTOR PACKAGE AND APPARATUS USING THE SAME

Semiconductor device with non-overlapped circuits

UNDER BUMP METALLIZATION STRUCTURE HAVING A SEED LAYER FOR ELECTROLESS NICKEL DEPOSITION

Wire bond pads

Semiconductor integrated circuit device and method of fabricating the same

High strength solder joint formation method for wafer level packages and flip applications

Nail-shaped pillar for wafer-level chip-scale packaging

Post passivation structure for a semiconductor device and packaging process for same

Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structures

Semiconductor apparatus including semiconductor chip with stress material selectively provided in region of wiring layer

Electrode structure in semiconductor device and related technology

Semiconductor device and plural semiconductor elements with suppressed bending

Wafer level packaging of semiconductor chips

Fluid cooled semiconductor power module having double-sided cooling

Structure and process for electrical interconnect and thermal management

Through-chip via interconnects for stacked integrated circuit structures

Ball grid array package enhanced with a thermal and electrical connector

STACKED SEMICONDUCTOR PACKAGE WITH A REDUCED VOLUME

CO-PACKAGED HIGH-SIDE AND LOW-SIDE NMOSFETS FOR EFFICIENT DC-DC POWER CONVERSION

Integrated circuit package system employing an offset stacked configuration

Self locking and aligning clip structure for semiconductor die package

THERMALLY ENHANCED THIN SEMICONDUCTOR PACKAGE

Semiconductor assemblies and methods of manufacturing such assemblies including forming trenches in a first side of the molding material

Semiconductor element mounting substrate, semiconductor device using the same, and method for manufacturing semiconductor element mounting substrate

CONDUCTIVE BALL MOUNTING APPARATUS

Electronic component module

Method for manufacturing multilayer ceramic electronic device

Printed board with component mounting pin

Printed board with component mounting pin

Wirebond pad for semiconductor chip or wafer

Semiconductor device, substrate and semiconductor device manufacturing method

Semiconductor device and manufacturing method for the same

Semiconductor package having buss-less substrate

Semiconductor package with pad parts electrically connected to bonding pads through re-distribution layers

Flip-chip type semiconductor device

Electronic device and electronic apparatus

Multi-chip module package

Semiconductor component

Electronic component with buffer layer

Electronic device wafer level scale packages and fabrication methods thereof

CHIP ON FILM (COF) PACKAGE HAVING TEST PAD FOR TESTING ELECTRICAL FUNCTION OF CHIP AND METHOD FOR MANUFACTURING SAME

Method And Device For Enhancing Solderability

Electronic component mounting method and electronic component mounting device

PACKAGING METHOD INVOLVING REARRANGEMENT OF DICE

Amplification of HIV-1 sequences for detection of sequences associated with drug-resistance mutations

Components joining method and components joining structure

Method of manufacturing semiconductor device

Multi-substrate region-based package and method for fabricating the same

Semiconductor element and semiconductor device

Microelectronic package

Top layers of metal for high performance IC's

Integrated circuit including parylene material layer

Semiconductor device and method for mounting semiconductor chip

Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same

Semiconductor device including a first land on the wiring substrate and a second land on the sealing portion

Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices

SEMICONDUCTOR PACKAGE STRUCTURE AND LEADFRAME THEREOF

Power semiconductor device

INTEGRATED DEVICE AND CIRCUIT SYSTEM

INDIUM-SOLDER-COATED COPPER FOIL RIBBON CONDUCTOR AND METHOD OF CONNECTING THE SAME

PACKAGED INTEGRATED CIRCUITS AND METHODS TO FORM A PACKAGED INTEGRATED CIRCUIT

Fabrication method of an organic substrate having embedded active-chips

Cascode current sensor for discrete power semiconductor devices

Flip-chip package covered with tape

Near chip scale package integration process

Method of fabricating stacked assembly including plurality of stacked microelectronic elements

METHODS AND APPARATUS TO SUPPORT AN OVERHANGING REGION OF A STACKED DIE

Power semiconductor component with metal contact layer and production method therefor

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Electronic element that includes multilayered bonding interface between first electrode having aluminum-containing surface and second electrode composed of metal nanoparticle sintered body

Power semiconductor module

Method for fabricating a semiconductor and semiconductor package

WIRING SUBSTRATE AND DISPLAY DEVICE INCLUDING THE SAME

Power semiconductor module with sealing device for sealing to a substrate carrier and method for manufacturing it

Semiconductor package having buried post in encapsulant and method of manufacturing the same

Leadframe-based semiconductor package

Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member

Semiconductor device with semiconductor chip and method for producing it

Semiconductor package with a reduced volume and thickness and capable of high speed operation and method for fabricating the same

INTERCONNECT ASSEMBLIES AND METHODS

Apparatus and method for bonding silicon wafer to conductive substrate

Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same

Method and apparatus for flip-chip bonding

Substrate and manufacturing method of the same, and semiconductor device and manufacturing method of the same

Output control device, and AC/DC power source device, circuit device, LED backlight circuit device, and switching DC/DC converter device each using output control device

Semiconductor device manufacturing method

Semiconductor device and method of providing common voltage bus and wire bondable redistribution

Method and structure to reduce cracking in flip chip underfill

Semiconductor stack package having wiring extension part which has hole for wiring

SEMICONDUCTOR DEVICE

Die stacking apparatus and method

Semiconductor devices including a through-substrate conductive member with an exposed end and methods of manufacturing such semiconductor devices

Small area, robust silicon via structure and process

Semiconductor chip package and method for designing the same

Semiconductor device having a stacked bump to reduce kirkendall voids and or cracks and method of manufacturing

SOLDER BUMP ON A SEMICONDUCTOR SUBSTRATE

SEMICONDUCTOR CHIP WITH SOLDER BUMP AND METHOD OF FABRICATING THE SAME

Under Bump Routing Layer Method and Apparatus

Conductor bump method and apparatus

Power semiconductor module with connecting devices

TFCC (TM) and SWCC (TM) thermal flex contact carriers

INTEGRATED CIRCUIT WITH INTERCONNECTED FRONTSIDE CONTACT AND BACKSIDE CONTACT

Method of manufacturing a contact arrangement between a microelectronic component and a carrier

Rearrangement sheet, semiconductor device and method of manufacturing thereof

WAFER-LEVEL ACA FLIP CHIP PACKAGE USING DOUBLE-LAYERED ACA/NCA

Soldering method for mounting semiconductor device on wiring board to ensure invariable gap therebetween, and soldering apparatus therefor

INTERCONNECT STRUCTURE

Semiconductor die package with internal bypass capacitors

Method of manufacturing an electronic part mounting structure

Flip chip package structure and method for manufacturing the same

CHIP-TO-CHIP PACKAGE AND PROCESS THEREOF

Semiconductor package having a stacked wafer level package and method for fabricating the same

Electrical connections for multichip modules

Semiconductor device having external connection terminals and method of manufacturing the same

Semiconductor package and method for manufacturing the same for decreasing number of processes

SEMICONDUCTOR PACKAGE HAVING AN IMPROVED CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Crosstalk-free WLCSP structure for high frequency application

Electronic device and method of manufacturing same

Method for manufacturing and making planar contact with an electronic apparatus, and correspondingly manufactured apparatus

Thin plastic leadless package with exposed metal die paddle

Thin semiconductor die packages and associated systems and methods

Sensor package

Semiconductor device

Light emitting device and method of manufacturing the same

Method and apparatus for loading solder balls

Apparatus and method of mounting conductive ball

Electronic component-embedded board and method of manufacturing the same

Methods of attaching a die to a substrate

Assembly substrate and method of manufacturing the same

Electronic component-embedded board and method of manufacturing the same

ALIGNMENT OF OPTICAL ELEMENT AND SOLAR CELL

THERMAL SPRAY FOR SOLAR CONCENTRATOR FABRICATION

Isolated conformal shielding

Apparatus and method for producing semiconductor modules

Flip chip mounting method and bump forming method

Method and apparatus for fabricating integrated circuit device using self-organizing function

Under bump metal film comprising a stress relaxation layer and a diffusion-resistant layer

Semiconductor device sealed in a resin section and method for manufacturing the same

Semiconductor device having double side electrode structure and method of producing the same

SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME

HIGH TEMPERATURE PACKAGING FOR SEMICONDUCTOR DEVICES

Semiconductor device and method for manufacturing semiconductor device

Method of manufacturing a semiconductor apparatus

SEMICONDUCTOR CHIP WITH SOLDER BUMP SUPPRESSING GROWTH OF INTER-METALLIC COMPOUND AND METHOD OF FABRICATING THE SAME

ELECTRONIC DEVICE PROVIDED WITH WIRING BOARD, METHOD FOR MANUFACTURING SUCH ELECTRONIC DEVICE AND WIRING BOARD FOR SUCH ELECTRONIC DEVICE

INTERCONNECT JOINT

Weldable contact and method for the production thereof

Semiconductor chip bonding apparatus

Wafer processing method

Method of manufacturing a semiconductor device having an intermetallic terminal pad and solder junction structure

DOUBLE ENCAPSULATED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor assembly

Test structures for electrically detecting back end of the line failures and methods of making and using the same

Method to test the measurement accuracy of at least one magnetic field sensor using a semiconductor chip having a measurement coil

Semiconductor module, and hybrid vehicle drive device including the same

Solder cap application process on copper bump using solder powder film

Semiconductor chip package and method of manufacturing the same

Flip-chip package structure, and the substrate and the chip thereof

Stacked semiconductor device and semiconductor memory device

Integrated circuit package system with wire-in-film isolation barrier

Three-dimensional die-stacking package structure

Semiconductor package with reduced length interconnect and manufacturing method thereof

Method for manufacturing a circuit board structure, and a circuit board structure

Semiconductor device

SEMICONDUCTOR DEVICE PACKAGE WITH BUMP OVERLYING A POLYMER LAYER

Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers

Microelectronic package element and method of fabricating thereof

Interconnects for packaged semiconductor devices and methods for manufacturing such devices

Packaged semiconductor assemblies and methods for manufacturing such assemblies

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

Lead frame, semiconductor package including the lead frame and method of forming the lead frame

Flip-Chip Packaging with Stud Bumps

Manufacturing process and structure of through silicon via

Method and apparatus for placing conductive balls

Film substrate, fabrication method thereof, and image display substrate

Method of fabricating chip package

Die-wafer package and method of fabricating same

Power semiconductor package

Layout of dummy patterns

Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus

Semiconductor device suitable for a stacked structure

COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT

Stackable microelectronic device carriers, stacked device carriers and methods of making the same

Semiconductor device having through electrode and method of fabricating the same

Power semiconductor substrates with metal contact layer and method of manufacture thereof

Chip package

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF THE SAME

Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing Method

Semiconductor device with welded leads and method of manufacturing the same

Semiconductor switching module

Semiconductor package system with patterned mask over thermal relief

Chip embedded substrate and method of producing the same

Ultra-Thin Wafer-Level Contact Grid Array

Integrated circuit package system with flex bump

Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package

Semiconductor device and method for manufacturing thereof

Conductor ball mounting apparatus, conductor ball mounting method, mask used for mounting conductor ball, and mask manufacturing method

Heating device, reflow device, heating method, and bump forming method

ELECTRONIC APPARATUS

Capacitor device and method of manufacturing the same

Method of Creating Molds of Variable Solder Volumes for Flip Attach

Adhesive composition and adhesive sheet

Method of fabricating a two-sided die in a four-sided leadframe based package

METHOD OF MULTI-CHIP PACKAGING IN A TSOP PACKAGE

Semiconductor device and manufacturing method therefor

Mount Board and Electronic Device

Method of manufacturing a module

Process for manufacturing a module

Conformal shielding process using process gases

FIELD BARRIER STRUCTURES WITHIN A CONFORMAL SHIELD

Circuit board with an attached die and intermediate interposer

Packaging system with hollow package and method for the same

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS

Integrated circuit package system with overhang die

ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SHEET, AND SEMICONDUCTOR DEVICE OBTAINED BY THE METHOD

Semiconductor device and wire bonding method

Semiconductor package and trenched semiconductor power device using the same

Semiconductor Package and Method for Producing Same

STACK PACKAGE THAT PREVENTS WARPING AND CRACKING OF A WAFER AND SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THE SAME