212203 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Silicides composed of metals from groups of the periodic table being a combination of two or more materials provided in the groups -
Reduced expansion thermal compression bonding process bond head
#2Devices having inhomogeneous silicide schottky barrier contacts
#3Methods for bonding a die and a substrate
#4Semiconductor devices that include a die bonded to a substrate with a gold interface layer
#5Die bonding a semiconductor device