H01L2924/10351 - CPC Classification Index

ClassID:

212416 ⎘

H01L2924/10351 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Material of the semiconductor or solid state bodies; Semiconducting materials; Compound semiconductors; III-V Indium gallium arsenide phosphide [InGaAsP]

Recent Application in this class:

20210143131

Device and Method for UBM/RDL Routing

20200083156

Dummy metal with zigzagged edges

20190393195

Device and method for UBM/RDL routing

20190122975

Dummy metal with zigzagged edges

20170338204

Device and Method for UBM/RDL Routing

20170084529

Dummy metal with zigzagged edges

20130228905

Method for manufacturing semiconductor devices having a glass substrate

20130058049

Package systems including passive electrical components

20120248631

Method for manufacturing semiconductor devices having a glass substrate

20120012994

Method for manufacturing semiconductor devices having a glass substrate