Composite carbon nanotube-based structures and methods for removing heat from solid-state devices

Light-emitting diode and fabrication method thereof

Semiconductor composite device, method for manufacturing the semiconductor composite device, LED head that employs the semiconductor composite device, and image forming apparatus that employs the LED head

Manufacturing method of light emitting diode

Light Emitting Device, Light Emitting Device Package Structure, and Method of Manufacturing the Light Emitting Device Package Structure

Method of manufacturing a module

Process for manufacturing a module

Conformal shielding process using process gases

FIELD BARRIER STRUCTURES WITHIN A CONFORMAL SHIELD

Integrated circuit package system with dual side connection

Light emitting device package

Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source

Semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode

Multi-light emitting diode package

Semiconductor Display Device and Method for Manufacturing The Same

Conformal shielding process using flush structures

CONFORMAL SHIELDING EMPLOYING SEGMENT BUILDUP

Heat sink formed with conformal shield

Semiconductor device including a stress buffer

APPARATUSES AND METHODS FOR FORMING ELECTRONIC ASSEMBLIES

INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH MAGNETIC FILM

Thin double-sided package substrate and manufacture method thereof

Electronic component package and method of manufacturing the same, and electronic component device

Semiconductor module

SEMICONDUCTOR PACKAGE STRUCTURES

Image sensor module with a three-dimensional die-stacking structure

PROCESS FOR PREPARING A BONDING TYPE SEMICONDUCTOR SUBSTRATE

Plastic electronic component package

Electronic circuit package

High thermal conductivity substrate for a semiconductor device

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE PRODUCT

Light emitting diode package with a heat sink support ring and having multiple molding resins, wherein secondary molding resin with higher hardness than primary molding resin and which covers primary molding resin that covers LED die

Module comprising radiation-emitting semiconductor bodies

METHOD OF BONDING A SOLDER TYPE LIGHT EMITTING DIODE CHIP

Electronic Module and Chip Card With Indicator Light

OPTICAL COUPLING DEVICE

SURFACE-MOUNT TYPE CRYSTAL OSCILLATOR

Light emitting device and fabrication method thereof and light emitting system using the same

Light emitting device and manufacturing method of the same

Assembling lighting elements onto a substrate

Semiconductor device

Side-emission type semiconductor light-emitting device and manufacturing method thereof

Semiconductor device

Method for manufacturing light reflecting metal wall

METHODS FOR FORMING PACKAGE STRUCTURES

Mounting Assembly for Optoelectronic Devices

Light Emitting Diode Module

POWER SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, LEAD FRAME MEMBER, AND METHOD OF MAKING POWER SEMICONDUCTOR DEVICE

Soldering method for semiconductor optical device, and semiconductor optical device

Method of manufacturing a semiconductor device having an insulating protective film covering at least a portion of a tile-shaped element

Semiconductor device package with multi-chips and method of the same

Semiconductor device, LED print head and image-forming apparatus using same, and method of manufacturing semiconductor device

High Density Nanotube Devices

Substrate with feedthrough and method for producing the same

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Bidirectional multiplexed RF isolator

Housing for an electronic circuit and method for sealing the housing

Method transparent member, optical device using transparent member and method of manufacturing optical device

Semiconductor device and method for producing the same

Light-emitting element package and light source apparatus using the same

Printed wiring board and method for manufacturing printed wiring board

PACKAGING METHOD TO MANUFACTURE PACKAGE FOR A HIGH-POWER LIGHT EMITTING DIODE

Connecting microsized devices using ablative films

Ultra-thin chip packaging

Semiconductor device with power noise suppression

Semiconductor light emitting device packages and methods

PACKAGE FOR A HIGH-POWER LIGHT EMITTING DIODE

Light-emitting diode apparatus

LIGHT-EMITTING DIODE AND METHOD FOR PRODUCING IT

Side-emitting LED package and method of manufacturing the same

Method of manufacturing light emitting device

SUPPORTING FRAME FOR DIODES

Light-emitting element including a fusion-bonding portion on contact electrodes

SEMICONDUCTOR DEVICE INCLUDING WIRING SUBSTRATE HAVING ELEMENT MOUNTING SURFACE COATED BY RESIN LAYER

Semiconductor device package having multi-chips with side-by-side configuration and method of the same

Semiconductor module

Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same

Substrate and method for manufacturing the same

Detector system and detector subassembly

Electronic component assembly with composite material carrier

Semiconductor light-emitting device

Joining method and device produced by this method and joining unit

Inkjet printed wirebonds, encapsulant and shielding

Semiconductor device and manufacturing method thereof

SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND DUAL BUILD-UP LAYERS OVER BOTH SIDE-SURFACES FOR WLP AND METHOD OF THE SAME

Semiconductor device and method of manufacturing the same

Semiconductor chip comprising a directional coupler having a specific main line and sub-line arrangement

Light emitting diode lamp with low thermal resistance

APPARATUSES AND METHODS FOR FORMING SMART LABELS

Method for manufacturing a semiconductor device

Light emitting diode package with metal reflective layer and method of manufacturing the same

Light emitting device and method for manufacturing the same

Semiconductor device package having multi-chips with side-by-side configuration and method of the same

Semiconductor light emitting device

Light emitting device and method for manufacturing the same

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MULTI-CHIPS PACKAGE AND METHOD OF FORMING THE SAME

OPTOELECTRONIC DEVICE ALIGNMENT IN AN OPTOELECTRONIC PACKAGE

Submount for diode with single bottom electrode

Semiconductor light emitting device and multiple lead frame for semiconductor light emitting device

Method of opening reservoir of containment device

Electronic device, package having the same, and electronic apparatus

Light emitting device with light emitting cells arrayed

Structure of semiconductor device package and method of the same

Light emitting devices having a roughened reflective bond pad and methods of fabricating light emitting devices having roughened reflective bond pads

Substrate based unmolded package

Planar multi semiconductor chip package and method of manufacturing the same

IC card and method of manufacturing the same

Nickel tin bonding system with barrier layer for semiconductor wafers and devices

Solder layer and device bonding substrate using the same and method for manufacturing such a substrate

CHIP CARD MODULE AND METHOD OF PRODUCING A CHIP CARD MODULE

SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME, AND POWER CONVERSION APPARATUS INCORPORATING THIS SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT

Collective substrate, semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode

LED devices having lenses and methods of making same

Method for manufacturing a circuit board structure

Package board and method for manufacturing thereof

Method of assembling semiconductor devices with LEDS

Semiconductor device package with multi-chips and method of the same

SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND CONNECTING THROUGH-HOLE AND METHOD OF THE SAME

Semiconductor device package with multi-chips and method of the same

Phosphor production method

Panel, semiconductor device and method for the production thereof

Surface-mount type optical semiconductor device and method for manufacturing the same

Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices

Semiconductor device and manufacturing method thereof

Method of LED packaging on transparent flexible film

Semiconductor device including semiconductor elements and method of producing semiconductor device

Optical device and method for manufacturing optical device, and camera module and endoscope module equipped with optical device

Hybrid module and method of manufacturing the same

Semiconductor light-emitting device

LED chip package structure with a plurality of thick guiding pins and a method for manufacturing the same

Optical device and a method of manufacturing an optical device having a photoelectric conversion element and an optical adjustment element

Light-emitting diode chip package body and packaging method thereof

Diode housing

Method of manufacturing a printed wiring board lead frame package

Integrated circuit package system with leads having multiple sides exposed

Electro optical device and electronic apparatus

Electronic components produced by a method of separating two layers of material from one another

CERAMIC PACKAGE FOR LED

Dual molded multi-chip package system

Semiconductor device package having pseudo chips

Manufacturing method of chip package

Stackable integrated circuit package system with recess

Mountable integrated circuit package-in-package system with adhesive spacing structures

Bridge stack integrated circuit package-on-package system

Multi-chips package and method of forming the same

Structure of super thin chip scale package and method of the same

Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics

Lens compression molded over LED die

Bonding method and bonding material using metal particle

Method for integrating pre-fabricated chip structures into functional electronic systems

Fabrication for electroplating thick metal pads

SEMICONDUCTOR DICE HAVING BACK SIDE REDISTRIBUTION LAYER ACCESSED USING THROUGH-SILICON VIAS, METHODS

Light emitting diode package with direct leadframe heat dissipation

Integrated circuit package system with offset stacked die and method of manufacture thereof

Semiconductor device and manufacturing method of the same

METHOD FOR FABRICATING A CIRCUIT

Stacked semiconductor chips having double adhesive insulating layer interposed therebetween

Method of Manufacturing a Semiconductor Packages and Packages Made

Semiconductor device with lead frame including conductor plates arranged three-dimensionally

Method of fabricating a shielded stacked integrated circuit package system

Plastic electronic component package

Light-radiating semiconductor component with a luminescence conversion element

Semiconductor light emitting device, light emitting module, lighting apparatus, display element and manufacturing method of semiconductor light emitting device

Compact light conversion device and light source with high thermal conductivity wavelength conversion material

Light source module, light source apparatus and liquid crystal display

MICROBALL MOUNTING METHOD AND MOUNTING DEVICE

Integrated circuit package system with thermo-mechanical interlocking substrates

Flip chip type LED lighting device manufacturing method

GaOsemiconductor device

Light emitting device with blue light LED and phosphor components

Lighting equipment

Solder Bump/Under Bump Metallurgy Structure for High Temperature Applications

Semiconductor device with hollow structure

Electrical/optical integration scheme using direct copper bonding

Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device

Single Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices

Double Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices

Substrate for mounting light-emitting element and light-emitting element module

Glass for semiconductor encapsulation and outer tube for semiconductor encapsulation, and semiconductor electronic parts

Support body for semiconductor element, method for manufacturing the same and semiconductor device

Thin film light emitting diode

Light emitting device having a mirror portion

Stacked structures and methods of fabricating stacked structures

Bonding structures and methods of forming bonding structures

Semiconductor device and a method of manufacturing the same

HEAT SPREADER FOR AN ELECTRICAL DEVICE

Flip-chip packaging structure for light emitting diode and method thereof

Spread spectrum isolator

Substrate for mounting IC chip, substrate for motherboard, device for optical communication, manufacturing method of substrate for mounting IC chip, and manufacturing method of substrate for motherboard

Light source using large area LEDs

Semiconductor device and method for manufacturing same

Method of packaging a device having a multi-contact elastomer connector contact area and device thereof

Wafer level package with die receiving cavity and method of the same

Method of packaging a device having a tangible element and device thereof

Laser lift-off of sapphire from a nitride flip-chip

Replaceable through-hole high flux LED lamp

Light-emitting diode chip package body and packaging method thereof

Wiring substrate, method of manufacturing wiring substrate, and electronic apparatus

Light-emitting diode chip package body and packaging method thereof

Circuit device and method of manufacturing the same

Light-emitting diode chip package body and packaging method thereof

Light-emitting diode chip package body and packaging method thereof

Light-emitting device

Light-emitting devices and related systems

Light emitting diode, optical semiconductor device, epoxy resin composition and phosphor suited for optical semiconductor device, and method for manufacturing the same

Single chip USB packages with swivel cover

Luminous device with heat pipe and method of manufacturing heat pipe lead for luminous device

Packaging for high power integrated circuits

Single chip USB packages with contact-pins cover

LED PACKAGE AND MANUFACTURING METHOD THEREOF

Light emitting chip package and manufacturing method thereof

Methods of fabricating nanostructures and nanowires and devices fabricated therefrom

Nitride phosphor and production process thereof, and light emitting device

Light emitting device package and manufacture method of light emitting device package

Bonding and probing pad structures

Semiconductor device

Stacked structures and methods of fabricating stacked structures

Device transfer method and display apparatus

Electronic device including a nickel-palladium alloy layer

Light source having LED and frame structure

LED lighting apparatus with transparent flexible circuit structure

Method of making a light emitting device having a molded encapsulant

Semiconductor module, method for manufacturing the semiconductor module and portable device carrying the same

METHOD FOR PRODUCING FLEXIBLE INTEGRATED CIRCUITS WHICH MAY BE PROVIDED CONTIGUOUSLY

Method of making a light emitting device

Module with a shielding and/or heat dissipating element

Modified gold-tin system with increased melting temperature for wafer bonding

Memory card

LAMINATED CIRCUIT BOARD AND ITS MANUFACTURING METHOD, AND MANUFACTURING METHOD FOR MODULE USING THE LAMINATED CIRCUIT BOARD AND ITS MANUFACTURING APPARATUS

Method of actuating implanted medical device

Structure of high performance combo chip and processing method

Structure of high performance combo chip and processing method

Optical semiconductor device and method of manufacturing thereof

Semiconductor device and method for fabricating the same

Bonding wire and bond using a bonding wire

Underfill for light emitting device

Method of manufacturing a semiconductor device

Component embedded printed circuit board

Semiconductor device and manufacturing method thereof

Semiconductor device, substrate for producing semiconductor device and method of producing them

Stackable packages for three-dimensional packaging of semiconductor dice

LED with phosphor tile and overmolded phosphor in lens

Semiconductor die package using leadframe and clip and method of manufacturing

Methods of forming semiconductor light emitting device packages by liquid injection molding

Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards

BUMP STRUCTURES AND PACKAGED STRUCTURES THEREOF

Integrated circuit package and system interface

Semiconductor light-emitting device and light-emitting display therewith

Apparatus, system and method for use in mounting electronic elements

LED of side view type and the method for manufacturing the same

Light unit display

Light emitting device

Light-Emitting Device, Light-Emitting Module, Display Unit, Lighting Unit and Method for Manufacturing Light-Emitting Device

Web process interconnect in electronic assemblies

Light emitting diode package

Surface Mount Light Emitting Chip Package

Light emitting device package and method for manufacturing the same

Method of assembling displays on substrates

Optoelectronic module

Multiplexed RF isolator

BI-CURVATURE LENS FOR LIGHT EMITTING DIODES AND PHOTO DETECTORS

Light emitting device, manufacturing method for light emitting device, illumination device using light emitting device, and projector

LIGHT-EMITTING STRUCTURES

Integrated circuit package-on-package stacking system

Solid state device

Multiplexed RF isolator circuit

Multi-die DC-DC buck power converter with efficient packaging

Semiconductor device and manufacturing method for the same

BOND FINGER ON VIA SUBSTRATE, PROCESS OF MAKING SAME, PACKAGE MADE THEREBY, AND METHOD OF ASSEMBLING SAME

Semiconductor package having passive component and semiconductor memory module including the same

Light emitting diode package having multiple molding resins on a light emitting diode die

Package for housing light-emitting element and method for manufacturing package for housing light-emitting element

Method for self-assembling microstructures

Method of designing semiconductor integrated circuit, designing apparatus, semiconductor integrated circuit system, semiconductor integrated circuit mounting substrate, package and semiconductor integrated circuit

Semiconductor device encapsulated by silicone resin composition, and silicone resin tablet for encapsulating semiconductor device

Single chip USB packages by various assembly methods

Semiconductor device and manufacturing method therefor

Integrated circuit package system with laminate base

Device, method of manufacturing device, board, method of manufacturing board, mounting structure, mounting method, LED display, LED backlight and electronic device

Method and apparatus for microstructure assembly

System and method of attenuating electromagnetic interference with a grounded top film

CIRCULAR WIRE-BOND PAD, PACKAGE MADE THEREWITH, AND METHOD OF ASSEMBLING SAME

Transformer coils for providing voltage isolation

Integrated circuit module

Semiconductor device, electronic card and pad rearrangement substrate

Semiconductor device

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Resin Composition For Fuel Cell Member And Fuel Cell Member

Structure of high performance combo chip and processing method

LED decorative lighting structure

Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board

Semiconductor device

Nickel tin bonding system for semiconductor wafers and devices

Illumination Device and Display Device Using Illumination Device

Solid state image pickup device, method for manufacturing the same, semiconductor device and method for manufacturing the same

Flip chip type LED lighting device manufacturing method

Optoelectronic device