Optoelectronic device

Semiconductor Module Having Low Thermal Load

Micro universal serial bus (USB) memory package

Patterned light-emitting devices

Light emitting diode package

Molding methods to manufacture single-chip chip-on-board USB device

Method for manufacturing semiconductor device

Light-emitting diode arrangement for a high-power light-emitting diode and method for producing a light-emitting diode arrangement

Integrated circuit and method for writing information

Backlight module including at least one luminescence element, and method of fabricating the same

Method for producing a lens mold

Semiconductor device having an element mounted on a substrate and an electrical component connected to the element

Thermal improvement for hotspots on dies in integrated circuit packages

Solid state light sheet and bare die semiconductor circuits with series connected bare die circuit elements

Computer systems having an interposer including a flexible material

Piezoelectric oscillator and method of manufacturing the same

High-efficiency, overvoltage-protected, light-emitting semiconductor device

Light emitting diodes including transparent oxide layers

Method of Dissipating heat, Packaging and Shaping for Light Emitting Diodes

Video signal line drive circuit, and display device having the circuit

Self assembly of elements for displays

Stacked package electronic device

Light-emitting device manufacturing method and light-emitting device

Semiconductor component with connecting elements and method for producing the same

Package for storing light emitting element and method for producing package for storing light emitting element

Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body

PACKAGED DEVICES AND METHODS FOR FORMING PACKAGED DEVICES

Manufacturing method of resin-molding type semiconductor device, and wiring board therefor

VERTICAL LED WITH EUTECTIC LAYER

Semiconductor light-emitting element, manufacturing method and mounting method of the same and light-emitting device

Light emitting device with a porous alumina reflector made of aggregation of alumina particles

Semiconductor light emitting device and a method for producing the same

Flip chip type LED lighting device manufacturing method

Method of making a radio frequency identification (RFID) tag

Systems and methods for high density multi-component modules

SEMICONDUCTOR PACKAGE STRUCTURES HAVING HEAT DISSIPATIVE ELEMENT DIRECTLY CONNECTED TO INTERNAL CIRCUIT AND METHODS OF FABRICATING THE SAME

Light emitting diode package with direct leadframe heat dissipation

Led package and method for producing the same

Semiconductor device

Semiconductor device using semiconductor chip

Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode

LED package and method for producing the same

LED package and method for producing the same

High-Power LED Chip Packaging Structure And Fabrication Method Thereof

Electronic component device

Stacked semiconductor device

Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode

Light emitting devices suitable for flip-chip bonding

LED package and method for producing the same

LED package and method for producing the same

Surface-mountable optoelectronic component

Chip scale surface mount package for semiconductor device and process of fabricating the same

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Methods and materials useful for chip stacking, chip and wafer bonding

Fabrication method of semiconductor integrated circuit device

Article and assembly for magnetically directed self assembly

Systems for providing conducting pad and fabrication method thereof

Luminescent Light Source, Method for Manufacturing the Same, and Light-Emitting Apparatus

Ball grid array housing having a cooling foil

High-performance semiconductor package

CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING BUMPS

Semiconductor layer, process for forming the same, and semiconductor light emitting device

Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out

Solder layer and electronic device bonding substrate and submount using the same

Method of forming a semiconductor device having bonding pad of the second chip thinner than bonding pad of the first chip

Separation method for cutting semiconductor package assemblage for separation into semiconductor packages

Method of manufacturing display device using LED chips formed in a porous template

Semiconductor device

Semiconductor light emitting apparatus and its manufacturing method

Light-emitting-diode chip comprising a sequence of GAN-based epitaxial layers which emit radiation and a method for producing the same

Light emitting diode lamp

METHOD FOR MOUNTING AN ELECTRONIC PART ON A SUBSTRATE USING A LIQUID CONTAINING METAL PARTICLES

Semiconductor device

Wiring member, resin-coated metal part and resin-sealed semiconductor device, and manufacturing method for the resin-coated metal part and the resin-sealed semiconductor device

Combined board level EMI shielding and thermal management

Optical device and method for manufacturing the same

Semiconductor device with semiconductor device components embedded in plastic package compound

Semiconductor device and semiconductor module therewith

Gallium nitride material devices including conductive regions and methods associated with the same

Power surface mount light emitting die package

Method of resin sealing electronic part

Semiconductor device and method of manufacturing semiconductor device

Light emitting device including adhesion layer

Electronic circuit, a semiconductor device and a mounting substrate

Optoelectric composite substrate and electronic apparatus

Electronic device and method of manufacturing the same

Economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules

LED mounting module, LED module, manufacturing method of LED mounting module, and manufacturing method of LED module

Semiconductor component with semiconductor chip and adhesive film, and method for its production

Semiconductor device

LED Illumination Apparatus and Card-Type LED Illumination Source

Wire bonding apparatus, record medium storing bonding control program, and bonding method

Method for producing a surface-mountable semiconductor component

Nanoscale metal paste for interconnect and method of use

LED indicator casing, LED indicator, and LED indicator joint member comprising hanger members

Phosphor based light source component

Module part

Bare chip embedded PCB

Method for setting capillary contact position data and wire bonding apparatus using the same

Gallium nitride based III-V group compound semiconductor device and method of producing the same

Method for manufacturing a surface mount device

Hybrid multilayer substrate and method for manufacturing the same

Semiconductor module having a semiconductor chip stack and method

Semiconductor light-emitting device, lighting module, lighting device and method for manufacturing semiconductor light-emitting device

Method for manufacturing electronic device using thin film transistor with protective cap over flexible substrate

Semiconductor device, electronic apparatus comprising the same, and method for fabrication of substrate for semiconductor device used therein

PACKAGE FOR MOUNTING AN OPTICAL ELEMENT AND A METHOD OF MANUFACTURING THE SAME

Glass material for radio-frequency applications

Nonvolatile memory system

LIGHT-EMITTING DIODE PACKAGE STRUCTURE

Light emitting apparatus and light emitting method

Methods of fabricating nanostructures and nanowires and devices fabricated therefrom

Strip for integrated circuit packages having a maximized usable area

Semiconductor device package and method for manufacturing same

Methods of manufacturing light emitting diodes including barrier layers/sublayers

Arrangement and method impedance matching

Light emitting device with blue light LED and phosphor components

Electronic circuit package

Semiconductor light-emitting device and method for manufacturing the device

LED and attachment structure of LED

Semiconductor light-emitting device and method for manufacturing the device

Light emitting diode

OPTICAL STRUCTURES INCLUDING LIQUID BUMPS

Microelectronic packages and methods therefor

Techniques for packaging multiple device components

Thermal interface material and solder preforms

Semiconductor device and manufacturing method of semiconductor device

Semiconductor light emitting device, semiconductor element, and method for fabricating the semiconductor light emitting device

LED housing and fabrication method thereof

Optimized contact design for thermosonic bonding of flip-chip devices

Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film

Die attachment method for LED chip and structure thereof

Semiconductor device and manufacturing method of the same

Thermal conductive apparatus

Multicolor organic electroluminescent device formed of vertically stacked light emitting devices

Manufacturing method of optical electronic components and optical electronic components manufactured using the same

Radiation-emitting and/or radiation-receiving semiconductor component and method for the production thereof

Surface-mountable light-emitting diode structural element

High-power LED chip packaging structure and fabrication method thereof

Apparatuses and methods for forming wireless RF labels

Optical display systems and methods

OPTICAL SENSOR, INK CARTRIDGE, AND INKJET APPARATUS

Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package

Light emitting device with blue light LED and phosphor components

Flip-chip light emitting diode device without sub-mount

Optical element sealing structure, optical coupler, and optical element sealing method

Semiconductor die package using leadframe and clip and method of manufacturing

Method and device for connecting chips

Process for preparing a bonding type semiconductor substrate

Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device

LED and LED light source

Offset integrated circuit package-on-package stacking system

Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor

Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package

Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices

Semiconductor device integrated with optoelectronic components

Method of manufacturing flash memory cards

Semiconductor device package

Semiconductor device and manufacturing method thereof

Three-dimensionally integrated electronic assembly

Methods and apparatuses for fluidic self assembly

Semiconductor component of semiconductor chip size with flip-chip-like external contacts

Light emitting diode chip with reflective layer thereon

Solid state light sheet and encapsulated bare die semiconductor circuits

Nitride-based semiconductor light emitting diode

Electro-optical device, transferred chip, and transfer origin substrate

Method of producing image display unit

Circuit board structure of integrated optoelectronic component

Light-emitting devices and related systems

Method for manufacturing nitride based single crystal substrate and method for manufacturing nitride based semiconductor device

Electronic component packaging structure and method for producing the same

Hybrid module and method of manufacturing the same

Manufacturing method for semiconductor device

SEMICONDUCTORS AND METHODS OF MAKING

Microelectronic interconnect substrate and packaging techniques

Optical device package structure

Power package and fabrication method thereof

Semiconductor device and a manufacturing method of the same

Electronic device and method of manufacturing thereof

Cooling systems incorporating heat transfer meshes

Optoelectronics processing module and method for manufacturing thereof

Semiconductor device with a resin-sealed optical semiconductor element

Composite semiconductor light-emitting device

Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devices

Illumination device for providing directionally guided light

QFN/SON compatible package with SMT land pads

Semiconductor device and manufacturing method thereof, SOI substrate and display device using the same, and manufacturing method of the SOI substrate

LED reflecting plate and LED device

Image sensing device package structure

Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications

External contact material for external contacts of a semiconductor device and method of making the same

Structure of IC packaging and method forming the same

Electronic circuit module and manufacturing method thereof

Nitride-based semiconductor light-emitting device and method of manufacturing the same

Light emitting diode and method for manufacturing the same

Chip package structure and method for manufacturing bumps

Wafer-level package and IC module assembly method for the wafer-level package

Device transferring method, and device arraying method

Integrated process condition sensing wafer and data analysis system

Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device

Semiconductor packages for surface mounting and method of producing same

Insulating layer between bumps of semiconductor chip, and display panel using the same with anisotropic conductive film between semiconductor chip and substrate

Blue LED with phosphor layer for producing white light and different phosphor in outer lens for reducing color temperature

LED package and fabrication method thereof

Semiconductor module

Optical semiconductor device and method of manufacturing the same

Diode housing

Printable semiconductor structures and related methods of making and assembling

LED package having recess in heat conducting part

LIGHT-EMITTING MODULE AND LIGHT-EMITTING UNIT

Self assembling display with substrate

Electrical interconnect structures for integrated circuits and methods of manufacturing the same

Integrated circuit chip and integrated device

LED package structure and manufacturing method, and LED array module

METHOD FOR PRODUCING A CHIP ARRANGEMENT, A CHIP ARRANGEMENT AND A MULTICHIP DEVICE

Device, system and electric element

Semiconductor device and method of manufacturing the same

Light emitting diode device having advanced light extraction efficiency and preparation method thereof

Semiconductor device and manufacturing method thereof

Electrically connecting substrate with electrical device

Semiconductor device and manufacturing method thereof

Method for fabricating a light-emitting device

Micro-optics on optoelectronics

Package structure for a semiconductor device incorporating enhanced solder bump structure

Method of providing an optoelectronic element with a non-protruding lens

Light-emitting device

Method for self-assembling microstructures

Packaging method for circuit board

Apparatuses and methods for forming assemblies

Lighting device

Method of interconnecting terminals and method of mounting semiconductor devices

Low profile stacked semiconductor chip package

Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same

Circuit device and method of manufacturing the same

Mounting and adhesive layer for semiconductor components

Multi-chip device and method for producing a multi-chip device

Semiconductor device and a method of manufacturing the same

Alignment using fiducial features

Semiconductor device

Packaging of SMD light emitting diodes

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same

LED structure for flip-chip package and method thereof

Light-emitting device and light source apparatus using the same

Power semiconductor module

Light emitting diode device using electrically conductive interconnection section

Light emitting diode package with metal reflective layer and method of manufacturing the same

Semiconductor light emitting device, light emitting module, lighting apparatus, display element and manufacturing method of semiconductor light emitting device

Wiring board, method for manufacturing same, and semiconductor package

ELECTRONICALLY FUNCTIONING DEVICE MODULE, INPUT DEVICE HAVING THE ELECTRONICALLY FUNCTIONING DEVICE MODULE, AND ELECTRONIC EQUIPMENT HAVING THE INPUT DEVICE

Method of removing the growth substrate of a semiconductor light emitting device

Wiring substrate and bonding pad composition

LED package, manufacturing method thereof, and LED array module using the same

Wafer-level chip scale packaging for LED comprising carrier substrate with thermally conductive through holes and fill channels

Method of manufacturing a substrate-free flip chip light emitting diode

Nickel bonding cap over copper metalized bondpads

Driver IC package with improved heat dissipation

Superimposed displays

Method of wafer-level packaging using low-aspect ratio through-wafer holes

Side-emitting LED package and method of manufacturing the same

Light emitting device, method for making the same, and nitride semiconductor substrate

Biomarkers sensing

Curable silicone rubber composition and semiconductor device

Method of assembling semiconductor devices with LEDs

Light emitting device having a layer of photonic crystals and a region of diffusing material and method for fabricating the device

Optical element

Method for mounting an electronic part on a substrate using a liquid containing metal particles

Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device

Microelectronic device with integrated energy source

Light emitting apparatus and method of manufacturing the same

Semiconductor light emitting element and semiconductor light emitting device

Self assembly of elements for displays

Soldering method for semiconductor optical device, and semiconductor optical device

Substrate for mounting IC chip, substrate for motherboard, device for optical communication, manufacturing method of substrate for mounting IC chip, and manufacturing method of substrate for motherboard

Wafer level electro-optical simiconductor manufacture fabrication mechanism and a method for the same

Semiconductor device

System-in-a-package based flash memory card

Solid element device and method for manufacturing the same

Base structure for light emitting device and light emitting device using the same

Array-type modularized light-emitting diode structure and a method for packaging the structure

Light emitting device package and method for manufacturing the same

NANO IC

Screen mask

Electrical/optical integration scheme using direct copper bonding

Wafer-level electro-optical semiconductor manufacture fabrication method

Offset integrated circuit package-on-package stacking system

Phosphor with laminated coating, its manufacture method and light emitting device using the same

Light emitting element mounting frame and light emitting device

Radiation emitting semiconductor component with luminescent conversion element

Semiconductor apparatus, print head, and image forming apparatus

Electrode structure, and semiconductor light-emitting device having the same

Method for making a flat-top pad

Transparent member, optical device using transparent member and method of manufacturing optical device

Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings

Package for receiving electronic parts, and electronic device and mounting structure thereof

Semiconductor device with substrate having penetrating hole having a protrusion

Semiconductor light-emitting device and method for manufacturing the device

Solid-state imaging device and manufacturing method thereof

Semiconductor device with semiconductor chip and rewiring layer and method for producing the same