Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same

Fabrication method of light emitting diode package

Method of manufacturing vertical cavity surface emitting laser

Light emitting device package

Wire bonded semiconductor device having low inductance and noise

Composite electronic component

Semiconductor device with a rewiring level and method for producing the same

Surface-mountable light-emitting diode light source and method of producing a light-emitting diode light source

High heat dissipating LED having a porous material layer

RGB thermal isolation substrate

Method of making a multi-chip electronic package having laminate carrier

Method of repairing an image display unit

Method for manufacture of transparent devices having light emitting diodes (LED)

Transparent LED display and method for manufacture thereof

Method of surface treatment of group III nitride crystal film, group III nitride crystal substrate, group III nitride crystal substrate with epitaxial layer, and semiconductor device

Semiconductor chip having a soldering layer sequence, and process for soldering a semiconductor chip

Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture

Light unit display

Non-cavity semiconductor packages

Semiconductor light-emitting device and its manufacturing method

Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same

Multiple-wavelength light emitting diode and its light emitting chip structure

Light emitting device with excellent heat resistance and light resistance

Compact light emitting device package with enhanced heat dissipation and method for making the package

Manipulation of objects with fluid droplets

Resin-encapsulated type semiconductor packages, and production method and apparatus therefor

Fluidic heterogeneous microsystems assembly and packaging

Method of assembling displays on substrates

Self assembling display with substrate

Electronic component mounting package and package assembled substrate

Semiconductor device having bonding pad of the first chip thicker than bonding pad of the second chip

Electronic component mounting package and package assembled substrate

IC card and method of manufacturing the same

Semiconductor device and method of manufacturing the same

LED lamp apparatus and manufacturing method thereof

Methods for the electronic, homogeneous assembly and fabrication of devices

Semiconductor structure with RF element

Semiconductor device and manufacturing method thereof

Light emitting diode package with protective function against electrostatic discharge

Semiconductor light source for illuminating a physical space including a 3-dimensional lead frame

Large-area nanoenabled macroelectronic substrates and uses therefor

LED device with flip chip structure

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Light source apparatus

Method, device and system for bonding a semiconductor element

Preparation of semiconductor device

Patterned light-emitting devices

Optical semiconductor device, electronic device, and method for producing optical semiconductor device

Current regulator having a transistor and a measuring resistor

Self assembly of elements for displays

Apparatus and method for predetermined component placement to a target platform

Printed wiring board and method for manufacturing the same

Device mounting substrate and image display device

Wafer bonding of thinned electronic materials and circuits to high performance substrate

Semiconductor device and a manufacturing method of the same

Hybrid module and production method for same, and hybrid circuit device

Nano memory, light, energy, antenna and strand-based systems and methods

Bi-curvature lens for light emitting diodes and photo detectors

Semiconductor device including a semiconductor chip with signal contact areas and supply contact areas, and method for producing the semiconductor device

Semiconductor device, method for designing the same and recording medium that can be read by computer in which program for designing semiconductor device is recorded

Surface-mountable light-emitting diode structural element

Semiconductor composite apparatus, LED, LED printhead, and image forming apparatus

Semiconductor light emitting device

Self-assembled electrical networks

System and process for manufacturing application specific printable circuits (ASPC'S) and other custom electronic devices

Semiconductor device with a number of bonding leads and method for producing the same

Electronic component with stacked semiconductor chips and method for producing the same

Semiconductor packages and methods for making and using same

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Semiconductor light emitting device

Method of making optical light engines with elevated LEDs and resulting product

LED housing and fabrication method thereof

Semiconductor device with signal wirings that pass through under the output electrode pads and dummy wirings near the peripheral portion

LED light set

High power LED housing and fabrication method thereof

Thin-film semiconductor component and production method for said component

Implantable, tissue conforming drug delivery device

Process for producing copy protection for an electronic circuit

Molded package and semiconductor device using molded package

Semiconductor device including capsule type semiconductor package and semiconductor chip in stacking manner

Ball grid array package

Interposers with flexible solder pad elements

Light emitting device and method of making the same

Semiconductor device and method of manufacturing thereof

Sealed-by-resin type semiconductor device

LED package frame and LED package having the same

Light receiving or light emitting modular sheet and process for producing the same

Light emitting diode

Electronic device manufacture

Wafer level electro-optical semiconductor manufacture fabrication mechanism and a method for the same

LED package structure and mass production method of making the same

Semiconductor device

Surface mount semiconductor device

Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source

Packaging designs for LEDs

Packaging designs for LEDs

Card type LED illumination source

Semiconductor device and display module using same

Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof

LED PACKAGING METHOD AND PACKAGE STRUCTURE

Leadframe-based housing, leadframe strip, surface-mounted optoelectronic-component, and production method

Semiconductor light emitting device mounting substrates including a conductive lead extending therein

LED assembly having overmolded lens on treated leadframe and method therefor

Light-emitting diode, backlight device and method of manufacturing the light-emitting diode

Semiconductor light emitting device

Systems and methods for producing white-light emitting diodes

Semiconductor apparatus and manufacturing method

Surface mount LED

NANO IC packaging

Communication systems incorporating control meshes

High power light emitting diode device

Diode housing

Light-emitting diode lamp and light-emitting diode display device

Electronic device including a substrate structure and a process for forming the same

Cooling systems incorporating heat transfer meshes

Method of marking a low profile packaged semiconductor device

Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the same

Thermally controlled fluidic self-assembly

Leadframe and packaged light emitting diode

LED array package structure and method thereof

Package for a high-frequency electronic device

Semiconductor die positioning system and a method of bonding a semiconductor die to a substrate

Packaged electronic devices, and method for making same

Semiconductor device with a guard-ring structure and a field plate formed of polycrystalline silicon film embedded in an insulating film

Illumination assembly and method of making same

Light emitting diodes including pedestals

Methods of using sonication to couple a heat sink to a heat-generating component

Electrical or electronic component and method of producing same

Compact system module with built-in thermoelectric cooling

Light-emitting diode flash module with enhanced spectral emission

Electronic component with a housing package

Semiconductor light emitting device and method for manufacturing the same

Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device

Semiconductor device, its manufacturing method, and radio communication device

Semiconductor package, memory card including the same, and mold for fabricating the memory card

Light emitting device package

Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials

Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material

Light emitting diode chip with large heat dispensing and illuminating area

Light emitting element

Insulating substrate and semiconductor device having a thermally sprayed circuit pattern

Techniques for microchannel cooling

Manipulation of micrometer-sized electronic objects with liquid droplets

Overmolded lens over LED die

Molded lens over LED die

LED device and method for manufacturing the same

Semiconductor apparatus

Multilayered lead frame for a semiconductor light-emitting device

Package Structure of a Surface Mount Device Light Emitting Diode

Semiconductor light emitting device capable of increasing its brightness

Fabricating surface mountable semiconductor components with leadframe strips

Illumination assembly using circuitized strips

Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head

High-powered light emitting device with improved thermal properties

Vertical protecting element formed in semiconductor substrate and semiconductor device using the same

Flip chip type LED lighting device manufacturing method

Semiconductor light-emitting device, lighting module and lighting apparatus

Methods of manufacturing interposers with flexible solder pad elements

LED with self aligned bond pad

Electronic component comprising external surface contacts and a method for producing the same

Semiconductor module, process for producing the same, and film interposer

Semiconductor device and a method for manufacturing of the same

Low thermal resistance LED package

Circuit carrier and production thereof

Packaging method for an electronic element

Electronic flash, imaging device and method for producing a flash of light having a wavelength spectrum in the visible range and the infrared range using a fluorescent material

Semiconductor HBT MMIC device and semiconductor module

Flip-chip electrode light-emitting element formed by multilayer coatings

Method of manufacturing an LED

Inspection method of bonded status of ball in wire bonding

Transparent member, optical device using transparent member and method of manufacturing optical device

Bonding structure, actuator device and liquid-jet head

SMD(surface mount device)-type light emitting diode with high heat dissipation efficiency and high power

Method for forming an electrode

Semiconductor device and electronic apparatus

Semiconductor package including light emitter and IC

Method for manufacturing a GaN based LED of a black hole structure

Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package

Semiconductor device comprising light-emitting element and light-receiving element, and manufacturing method therefor

Migration-proof light-emitting semiconductor device and method of fabrication

Self-reflowing printed circuit board and application methods

Methods of assembly for a semiconductor light emitting device package

Stacked die module and techniques for forming a stacked die module

Electronic component-mounted structure, method for mounting electronic component, electro-optical device, and electronic apparatus

Semiconductor device

Thermally controlled fluidic self-assembly

Semiconductor composite device, LED head that employs the semiconductor composite device, and image forming apparatus that employs the LED head

Light emitting device and method of producing same

Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit

Submount for light emitting diode and its manufacturing method

Optical semiconductor device, method for fabricating the same, lead frame and electronic equipment

IC card and method of manufacturing the same

Method of clearing electrical contact pads in thin film sealed OLED devices

Method for producing semiconductor chips using thin film technology, and semiconductor chip using thin film technology

Process for producing a product having a structured surface

Thermally controlled fluidic self-assembly method and support

Semiconductor chip stack structure and method for forming the same

Light-emitting device and glass seal member therefor

Light emitting diode (LED) packaging

Solid state device and light-emitting element

Method for assembling micro-components to binding sites

Methods for packaging a plurality of semiconductor dice using a flowable dielectric material

Ultra-thin ohmic contacts for p-type nitride light emitting devices

Semiconductor device having laminated structure

Semiconductor and method for producing a semiconductor

Light-emitting diode

Semiconductor light emitting apparatus

High power light emitting diode package

Light emitting devices for liquid crystal displays

Method of manufacturing printed wiring board

Method for transferring a semiconductor body from a growth substrate to a support material

Method to build a wirebond probe card in a many at a time fashion

Nitride phosphor and production process thereof, and light emitting device

Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device

Stretchable semiconductor elements and stretchable electrical circuits

High frequency module and manufacturing method thereof

Flip-chips on flex substrates, flip-chip and wire-bonded chip stacks, and methods of assembling same

Substrate for light emitting diodes

Method for connecting substrate and composite element

Package structure for light emitting diode and method thereof

Semiconductor device with semiconductor components connected to one another

Package structure for light emitting diode and method thereof

Bonding structure, wire bonding method, actuator device and liquid jet head

Optical or electronic module and method for its production

Integrated radio front-end module with embedded circuit elements

Surface-emitting type device and method for manufacturing the same

Stacked chip electronic package having laminate carrier and method of making same

Interposer with flexible solder pad elements and methods of manufacturing the same

Semiconductor light-emitting device and method of manufacturing the same

Light emitting devices having a reflective bond pad and methods of fabricating light emitting devices having reflective bond pads

Semiconductor device and its manufacturing method

Housing for an electronic component

Substrate for mounting IC chip

Method for producing a component comprising a conductor structure that is suitable for use at high frequencies

Surface-mountable light-emitting diode and/or photodiode and method for the production thereof

Mounting semiconductor chips

Substrate based unmolded package

Bonding pad and chip structure

Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packages

Surface mountable light emitting diode assemblies packaged for high temperature operation

Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices

Gallium nitride based III-V group compound semiconductor device and method of producing the same

Nitride-based compound semiconductor light emitting device

Stacked package electronic device

Substrate based unmolded package

In-line wire bonding on a package, and method of assembling same

Circular wire-bond pad, package made therewith, and method of assembling same

Light-emitting-diode structure and fabrication method thereof

Lamp and method of producing a lamp

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Light emitting device with blue light led and phosphor components

Package for semiconductor light emitting element and semiconductor light emitting device

Semiconductor light emitting device and semiconductor light emitting unit

PCB-based surface mount LED device with silicone-based encapsulation structure

Optical structures including liquid bumps and related methods

Light emitting diode with fluorescent material

Semiconductor device mounted on and electrically connected to circuit board

Light emitting device with transparent substrate having backside vias

LED packaging structure

Spread spectrum isolator

RF isolator for isolating voltage sensing and gate drivers

Methods for making electronic devices with small functional elements supported on a carriers

Electronic devices with small functional elements supported on a carrier

Light source device and projector

Semiconductor package, mold used in manufacturing the same, and method for manufacturing the same

Ball grid array housing having a cooling foil

LED package and method for producing the same

Apparatus and method for mounting electronic components

Semiconductor device and method for manufacturing the same

Circuit device with dummy elements

Method of manufacturing circuit device

Circuit board and semiconductor device using the same

Submount for diode with single bottom electrode

Microelectronic devices and methods for packaging microelectronic devices

Web fabrication of devices

Light emitting diodes for high AC voltage operation and general lighting

Method for integrating pre-fabricated chip structures into functional electronic systems

Semiconductor device and manufacturing method therefor

Method of forming an array of semiconductor packages

Semiconductor (LED) chip attachment

LED bonding structures and methods of fabricating LED bonding structures

Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device with electroless plating

Luminescent diode chip that is flip-chip mounted on a carrier, and method for production thereof

Electronic circuit package

Optical surface mount technology package

Integrated process condition sensing wafer and data analysis system

LED device with a vertical leadframe that is configured for surface mounting

Method for manufacturing optical electronic component

Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same

Semiconductor device using semiconductor chip

Card-type LED illumination source

Method for producing a semiconductor element

Method for producing a BGA chip module and BGA chip module

Card-type LED illumination source

Semiconductor light emitting device and fabrication method thereof

Semiconductor light emitting device

Side-emission type semiconductor light-emitting device and manufacturing method thereof

Method of transferring devices, method of arranging devices using the same, and method of manufacturing an image display system

DEVICE TRANSFER METHOD AND DISPLAY APPARATUS

Method for the production of structured layers on substrates