Active optical alignment and attachment thereto of an optical component with an optical element formed on a planar lightwave circuit

Active optical alignment and attachment thereto of a semiconductor optical component with an optical element formed on a planar lightwave circuit

Light-radiating semiconductor component with a luminescene conversion element

Led chip mounting structure and image reader having same

Semiconductor chip package

NANO IC packaging

Semiconductor heat-dissipating substrate, and manufacturing method and package therefor

Manufacturing method for semiconductor device, semiconductor device and semiconductor chip

Semiconductor light emitting apparatus and its manufacturing method

Light emitting device and fabrication method thereof and light emitting system using the same

Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device

Electronic device and method of manufacture the same

Process of vapor depositing glass layers for wafer-level hermetic encapsulation of electronic modules

Light emitting apparatus provided with fluorescent substance and semiconductor light emitting device, and method of manufacturing the same

Light emitting diode arrays with improved light extraction

Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device

Light-emitting diode array having an adhesive layer

Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same

Method of manufacturing electronic component mounting body, electronic component mounting body, and electro-optical device

Light emitting element

Surface mount multi-channel optocoupler

Method for manufacturing semiconductor device

Method for attaching a semiconductor chip in a plastic encapsulant, optoelectronic semiconductor component and method for the production thereof

Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices

HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

Surface-mountable semiconductor component and method for producing it

Method for the connection of two wafers, and a wafer arrangement

Device for contacting patterned electrodes on porous substrates

Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module

Manufacturing method of semiconductor device

LED illumination apparatus and card-type LED illumination source

Display devices and integrated circuits

System and method for attenuating electromagnetic interference

Semiconductor device and method of manufacturing the same

Method of manufacturing substrate joint body, substrate joint body and electrooptical device

Package structure with a retarding structure and method of making same

Process for producing optical semiconductor device

Manufacturing and testing of electrostatic discharge protection circuits

Apparatus and method for attaching a heat sink to an integrated circuit module

Package array and package unit of flip chip LED

High power LED package

Element arrangement method

Apparatuses and methods for forming assemblies

Submount and semiconductor device

Testable electrostatic discharge protection circuits

Semiconductor light emitting device and method for manufacturing same

High power light emitting diode

Transferring semiconductor crystal from a substrate to a resin

Flip-chip light emitting diode device without sub-mount

Light emitting diodes including barrier layers/sublayers

Light emitting device

Light-emitting diode

Ultrasonic bonding apparatus and method

Methods of fabrication of package assemblies for optically interactive electronic devices

Electronic component, method of manufacturing the electronic component, and electronic apparatus

Apparatus for encapsulating a multi-chip substrate array

Interconnect system without through-holes

Packaged acoustic and electromagnetic transducer chips

Packaged acoustic and electromagnetic transducer chips

Semiconductor light emitting device and method for manufacturing same

Semiconductor relay apparatus and wiring board fabrication method

Transferring semiconductor crystal from a substrate to a resin

Method and apparatus for fabricating self-assembling microstructures

Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods

Apparatus and method for die attachment

Light emitting diodes for high AC voltage operation and general lighting

Liquid crystal display device with a spacer and method of fabricating the same

Optical semiconductor device having a lead frame and electronic equipment using same

Lead frame for semiconductor package and method of fabricating semiconductor package

Alloying method using laser irradiation for a light emitting device

Method for alloying a wiring portion for a image display device

Alloying method, and wiring forming method, display device forming method, and image display unit fabricating method

Method of manufacturing a display panel

Curable epoxy compositions, methods and articles made therefrom

BUMPING PROCESS OF LIGHT EMITTING DIODE

Bumping process of light emitting diode

Alloy method using laser irradiation

Wafer packaging process of packaging light emitting diode

Method for coating metal surfaces and substrate having a coated metal surface

Light-emitting structures

Optically interactive device package array

Quad flat non-leaded package comprising a semiconductor device

Bulk-shaped lens, light-emitting unit, and lighting equipment

Light-emitting semiconductor device with a built-in overvoltage protector

Active matrix substrate, method of manufacturing the same, and display device

Active matrix substrate display device

HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD OF THE SAME

Flip chip assemblies and lamps of high power GaN LEDs, wafer level flip chip package process, and method of fabricating the same

Light emitting apparatus

Wafer level hermetic sealing method

Light-radiating semiconductor component with a luminescence conversion element

Light emitting diodes packaged for high temperature operation

Methods of fabricating nanostructures and nanowires and devices fabricated therefrom

Device transferring method

Device transferring method

Device transferring method

Display unit

Reduced size semiconductor package with stacked dies

Semiconductor device using LED chip

Light-emitting diode chip package body and packaging method thereof

Device transferring method, and device arraying method and image display unit fabricating method using the same

Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier

Surface mount type semiconductor device and lead frame structure thereof

Light emission device

LED substrate

Semiconductor device and manufacturing method thereof

Solderless connection in LED module

LED package die having a small footprint

Electrical connection of components

Method of manufacturing a semiconductor device

Package structure for semiconductor

High power light emitting diode package and fabrication method thereof

Process for producing optical semiconductor device

LED package assembly with datum reference feature

Opto-electronic assembly having an encapsulant with at least two different functional zones

Nitride semiconductor light emitting device

P and N contact pad layout designs of GaN based LEDs for flip chip packaging

Photocurable adhesive compositions, reaction products of which have low halide ion content

Package for mounting an optical element and a method of manufacturing the same

Method of making semiconductor device

Light-emitting diode package structure

Light-emitting diode

Light-radiating semiconductor component with a luminescence conversion element

Carrier layer for a semiconductor layer sequence and method for producing semiconductor chips

Optical display systems and methods

Plural leds mounted within a central cutout of a surrounding circular reflective electrode

Light emitting device

Method of manufacturing an electronic device

Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus

Electronic device and method of manufacturing same

Circuit module

Light emitting diode lamp

Illumination assembly

Light source apparatus with light-emitting chip which generates light and heat

Method for mounting semiconductor chip and semiconductor chip-mounted board

Diode housing

Large-area nanoenabled macroelectronic substrates and uses therefor

LED lamp having heat dissipating portion

Opto-electronic element with a metallized carrier

Techniques for packaging multiple device components

Encapsulated lead having step configuration

Semiconductor device with semiconductor chip and rewiring layer and method for producing the same

Method of forming wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment

Package structure with a retarding structure and method of making same

Support body for semiconductor element, method for manufacturing the same and semiconductor device

Semiconductor device, electronic card and pad rearrangement substrate

Semiconductor device, electronic card and pad rearrangement substrate

Thin film light emitting diode

Flip-chip light emitting diode package structure

Electrode structure, and semiconductor light-emitting device having the same

Semiconductor device, LED print head and image-forming apparatus using same, and method of manufacturing semiconductor device

Method of manufacturing a semiconductor device

LED with good heat-dissipating capability

Semiconductor element, semiconductor device, method for manufacturing semiconductor element, method for manufacturing semiconductor device, and electronic apparatus

Large-area nonenabled macroelectronic substrates and uses therefor

Optical device and production method thereof

Method for producing a multichip module and multichip module

Semiconductor radiation emitter package

High power light emitting diode device

Light-emitting diode chip package body and packaging method thereof

Optical device and production method thereof

Light-emitting device and process for producing thereof

SnAgAu solder bumps, method of manufacturing the same, and method of bonding light emitting device using the same

Electronic component mounting apparatus and electronic component mounting method

Method of manufacturing a semiconductor device

Method and apparatus for a dual substrate package

Castellated chip-scale packages and methods for fabricating the same

Method of manufacturing electronic component, method of manufacturing electro-optical device, electronic component, and electro-optical device

Light emitting diode

Process for preparing a bonding type semiconductor substrate

Circuit carrier and production thereof

Electrical or electronic component and method of producing same

Microelectronic devices and methods for packaging microelectronic devices

Molded chip fabrication method

Light emission diode (LED)

Semiconductor light emitting device and manufacturing method for the same

Image sensor packages

Silicon platform for optical modules

Light emission device and manufacturing method thereof

Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit

Light emitting element, method of manufacturing the same, and semiconductor device having light emitting element

Receptacle and plug therefor

Memory card

Electronic module, panel having electronic modules which are to be divided up, and process for the production thereof

Semiconductor package

Nitride-based semiconductor light-emitting device and manufacturing method thereof

Light emitting element, method of manufacturing the same, and semiconductor device having light emitting element

No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance

Light emitting diode and method for producing it

Lighting device composed of a thin light emitting diode module

Inorganic thin layer, organic electroluminescence device including the same, and fabrication method thereof

Electronic devices with small functional elements supported on a carrier

Light emitting diode with high heat dissipation

Surface-mounted light-emitting diode and method

System and method for enhanced LED thermal conductivity

Package for a semiconductor light emitting device

Semiconductor light-emitting device having a semiconductor light-emitting element mounted on a substrate with anisotropically conductive adhesive interposed therebetween

Methods of processing of gallium nitride

Device transfer method and panel

Optoelectronics processing module and method for manufacturing thereof

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Ball grid array package, stacked semiconductor package and method for manufacturing the same

High-frequency semiconductor device

Light emitting element, method of manufacturing the same, and semiconductor device having light emitting element

Method of fabricating a light emitting device

Light emitting element, method of manufacturing the same, and semiconductor device having light emitting element

Light emitting element, method of manufacturing the same, and semiconductor device having light emitting element

Electromagnetic wave absorption material and an associated device

Wavelength-converting LED

Semiconductor device having a light emitting element

Semiconductor package having light sensitive chips

Semiconductor light emitting diode and semiconductor light emitting device

Light emitting diodes packaged for high temperature operation

Light-emitting diode array

Nickel bonding cap over copper metalized bondpads

Mount for semiconductor light emitting device

Semiconductor device and manufacturing method thereof

Nickel bonding cap over copper metalized bondpads

Methods of fabricating light emitting devices using mesa regions and passivation layers

Module part

Semiconductor component of semiconductor chip size with flip-chip-like external contacts, and method of producing the same

Interconnecting component

Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package

Radiation-emitting semiconductor chip, method for production thereof and radiation-emitting component

Flip-chip bonding of light emitting devices

Light-emitting semiconductor component

Method for manufacturing optical waveguide, optical waveguide device, electro-optical apparatus and electronic apparatus

Method for producing an integrated circuit with a rewiring device and corresponding integrated circuit

Radiation emitting semiconductor component with luminescent conversion element

Compound semiconductor light emitting device and its manufacturing method

Method and apparatus for self-assembly of functional blocks on a substrate facilitated by electrode pairs

Packaging method for thin integrated circuits

IC module and IC card

Die attach for light emitting diode

Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking

Semiconductor device fabrication method

Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards

Light source having blue, blue-green, orange and red LED's

Microelectronic package

Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same

Light emitting apparatus and light emitting method

Metal carrier (leadframe) for receiving and contact-connecting electrical and/or optoelectronic components

Manufacturable thin film gallium and nitrogen containing devices

Curved pillar interconnects

Display device using semiconductor light emitting device and method for manufacturing the same

Interconnect using embedded carbon nanofibers

Micro-bonding structure

Method for binding micro device to substrate

Package structure for display

Display device

Integrated multi-color light-emitting pixel arrays based devices by bonding

Bonding strategies for placement of LEDs from multiple carrier substrates

Micro device metal joint process

Printed circuit board mounting with tabs

Display device

Wire bonded electronic devices to round wire

Pick and place device with interdigitated electrodes for micro scale device

Wire bonded electronic devices to round wire

Flip chip cavity package

Molded leadframe substrate semiconductor package