Side wettable plating for semiconductor chip package

Systems and Methods for Heat Dissipation Using Thermal Conduits

Three-dimensional integrated circuits with protection layers

Chip scale package and fabrication method thereof

Package substrate for bump on trace interconnection

Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMV

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Mitigation of plating stub resonance by controlling surface roughness

Semiconductor integrated circuit device

SYSTEMS AND METHODS FOR REINFORCING CHIP PACKAGES

Flip chip package utilizing trace bump trace interconnection

Electrical contact alignment posts

High-voltage packaged device

Self-aligning structures and method for integrated chips

Integrated circuit packaging system with die paddle and method of manufacture thereof

Package-on-package with fan-out WLCSP

Semiconductor device and semiconductor circuit substrate

Semiconductor device and method for producing such a device

Three dimensional folded MEMS technology for multi-axis sensor systems

Compact semiconductor package with integrated bypass capacitor

Semiconductor package and method of testing same

DETECTION DEVICE, LIGHT-RECEIVING ELEMENT ARRAY, SEMICONDUCTOR CHIP, METHOD FOR MANUFACTURING THE SAME, AND OPTICAL SENSOR APPARATUS

Wire bonding apparatus with a textured capillary surface enabling high-speed wedge bonding of wire bonds

Printed wiring board and a method of manufacturing a printed wiring board

Single shot molding method for COB USB/EUSB devices with contact pad ribs

Electronic component mounting device and method for producing the same

Methods of operating electronic devices, and methods of providing electronic devices

Alpha particle blocking wire structure and method fabricating same

Method and system for bonding 3D semiconductor device

Method for fabrication of a semiconductor device and structure

FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE AND ITS USE

Method of manufacturing semiconductor chip

Method for manufacturing ball grid array package stacking system

Embedded wafer-level bonding approaches

Ultra-thin quad flat no-lead (QFN) package

Semiconductor device having a semiconductor chip, and method for the production thereof

Method of making an electronic device

Method and eletrostatic transfer stamp for transferring semiconductor dice using electrostatic transfer printing techniques

Circuit Device

Solder joint inspection

Integrated circuit package with voltage distributor

Integrated circuit packaging system with package-on-package and method of manufacture thereof

Semiconductor device with die stack arrangement including staggered die and efficient wire bonding

Hermetic wafer level packaging

Three-dimensional integrated circuit structure having improved power and thermal management

Chip package and fabricating method thereof

Electronic device and method for production

Integrated circuit structure incorporating a conductor layer with both top surface and sidewall passivation and a method of forming the integrated circuit structure

Method of forming a memory device

Solder interconnect on IC chip

Semiconductor device and method of designing a wiring of a semiconductor device

BALL GRID ARRAY PACKAGE

Routable array metal integrated circuit package fabricated using partial etching process

Integrated circuit packaging system with rounded interconnect

Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces

Chip having a driving integrated circuit

Microelectronic packages with nanoparticle joining

Package structure

Semiconductor element with semiconductor die and lead frames

Leadframe for IC package and method of manufacture

Laminated semiconductor wafer, laminated chip package and method of manufacturing the same

Laminated semiconductor wafer, laminated chip package and method of manufacturing the same

Semiconductor device comprising a passive component of capacitors and process for fabrication

Semiconductor integrated circuit chip and layout method for the same

Surface mounted LED structure and packaging method of integrating functional circuits on a silicon

Optical connection through single assembly overhang flip chip optics die with micro structure alignment

Semiconductor device having Si-substrate and process to form the same

Substrate bonding system and method of modifying the same

Arrangement for energy conditioning

Substrate processing method, semiconductor chip manufacturing method, and resin-adhesive-layer-backed semiconductor chip manufacturing method

Method of manufacturing circuit device

Reworkable underfills for ceramic MCM C4 protection

Method and apparatus for manufacturing three-dimensional integrated circuit

Method for forming terminal of stacked package element and method for forming stacked package

Forming low stress joints using thermal compress bonding

FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE, AND DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE

Micro-machined structure production using encapsulation

Integrated circuits with phase change devices

Method for improving the adhesion between silver surfaces and resin materials

Package-to-package stacking by using interposer with traces, and or standoffs and solder balls

SURFACE-MOUNTED SHIELDED MULTICOMPONENT ASSEMBLY

Stacked interconnect heat sink

Tiered integrated circuit assembly and a method for manufacturing the same

Microelectronic elements with post-assembly planarization

Circuit device and method of manufacturing the same

ELECTRONIC COMPONENT ASSEMBLY HAVING PROFILED ENCAPSULATED BONDS

Semiconductor device and method of forming RDL wider than contact pad along first axis and narrower than contact pad along second axis

Semiconductor device with conductive vias between saw streets

Semiconductor device and method of conforming conductive vias between insulating layers in saw streets

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

Active chip on carrier or laminated chip having microelectronic element embedded therein

Non-lithographic formation of three-dimensional conductive elements

Methods of forming semiconductor elements using micro-abrasive particle stream

Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices

Integrated circuit package with open substrate and method of manufacturing thereof

Semiconductor apparatus having through vias configured to isolate power supplied to a memory chip from data signals supplied to the memory chip

Semiconductor package structure and forming method thereof

CONDUCTIVE STRUCTURE FOR A SEMICONDUCTOR INTEGRATED CIRCUIT

Semiconductor device and method of forming stress relief layer between die and interconnect structure

Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Doping minor elements into metal bumps

Package-on-package structures with reduced bump bridging

Multi-die stacking using bumps with different sizes

Reducing delamination between an underfill and a buffer layer in a bond structure

Semiconductor device and method of forming RDL over contact pad with high alignment tolerance or reduced interconnect pitch

Method and package for circuit chip packaging

Lid for an electrical hardware component

Mold design and semiconductor package

Microelectronic elements having metallic pads overlying vias

Integrated circuit packaging system with island terminals and method of manufacture thereof

Integrated circuit packaging system with island terminals and embedded paddle and method of manufacture thereof

BONDING STRUCTURE AND METHOD

Semiconductor device and method of manufacturing the same

Method of assembling shielded integrated circuit device

Method of chip package build-up

Thermal compress bonding

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF, AND CONDUCTIVE FOIL PROVIDED WITH INSULATING LAYER

COATING AND ELECTRONIC COMPONENT

Substrate processing method, semiconductor chip manufacturing method, and resin-adhesive-layer-backed semiconductor chip manufacturing method

Low noise high thermal conductivity mixed signal package

System and method for multi-chip module die extraction and replacement

Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame

Integrated circuit stacked package precursors and stacked packaged devices and systems therefrom

PCB-mounted integrated circuits

Circuit board, high frequency module, and radar apparatus

Method for manufacturing semiconductor devices having a metallisation layer

Semiconductor and a method of manufacturing the same

Integrated structures of high performance active devices and passive devices

Methods of forming bonded semiconductor structures using a temporary carrier having a weakened ion implant region for subsequent separation along the weakened region

Methods of forming bonded semiconductor structures

Conductive lines and pads and method of manufacturing thereof

Semiconductor device having an interconnect structure with TSV using encapsulant for structural support

Conductive sidewall for microbumps

Recessed pillar structure

Semiconductor device and heat sink with 3-dimensional thermal conductivity

Die package including substrate with molded device

Semiconductor package having exterior plating films formed over surfaces of outer leads

Integrated shielding for a package-on-package system

Semiconductor device and method of forming protective layer over exposed surfaces of semiconductor die

Chip package and method for forming the same

Methods of forming semiconductor chip underfill anchors

Substrate stand-offs for semiconductor devices

System comprising a semiconductor device and structure

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS

Submount

THERMAL FLEX CONTACT CARRIERS #2

Package member assembly, method for manufacturing the package member assembly, package member, and method for manufacturing piezoelectric resonator device using the package member

Integrated circuit/printed circuit board substrate structure and communications

Solder bump with inner core pillar in semiconductor package

Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protection layer

UBM Etching Methods

Semiconductor substrates with unitary vias and via terminals, and associated systems and methods

Method of forming metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compounds

Misalignment correction for embedded microelectronic die applications

Method of manufacturing semiconductor device

System-in-a-package based flash memory card

Packaged microelectronic imagers and methods of packaging microelectronic imagers

Module and portable terminal

Electric circuit device, electric circuit module, and power converter

SEMICONDUCTOR DEVICE

Multi-layer via structure

Backside processing of semiconductor devices

Methods, devices, and materials for metallization

Chip Fanning Out Method and Chip-on-Film Device

Method of forming Cu pillar capped by barrier layer

Method of forming semiconductor die

Conductive pillar for semiconductor substrate and method of manufacture

High density chip stacked package, package-on-package and method of fabricating the same

System-in-a-package based flash memory card

Method for reducing chip warpage

Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereof

Multi-chip package module and a doped polysilicon trench for isolation and connection

IN-STREET DIE-TO-DIE INTERCONNECTS

Protecting bond pad for subsequent processing

Apparatus for integrated circuit packaging

Semiconductor device having a capacitor

Optical-semiconductor device and method for manufacturing the same

Multipath soldered thermal interface between a chip and its heat sink

Wiring Substrate and Method for Manufacturing Wiring Substrate

Electronic assemblies without solder and methods for their manufacture

Multilayered printed circuit board and method for manufacturing the same

WIRING BOARD AND LIQUID CRYSTAL DISPLAY DEVICE

Method of manufacturing printed wiring board

Method of manufacturing a flexible electronic product

Stress detection within an integrated circuit having through silicon vias

Method for manufacture of integrated circuit package system with protected conductive layers for pads

Thermally enhanced semiconductor package

Stacked die package

Electro-static discharge protection for die of a multi-chip module

GALVANIC ISOLATION TRANSFORMER

Semiconductor device for DC-DC converter including high side and low side semiconductor switches

Resin composition for encapsulating semiconductor and semiconductor device

Wafer stacked package waving bertical heat emission path and method of fabricating the same

Internal packaging of a semiconductor device mounted on die pads

METHOD AND SYSTEM FOR ALIGNMENT OF INTEGRATED CIRCUITS

BUMPLESS BUILD-UP LAYER PACKAGE DESIGN WITH AN INTERPOSER

Structure and process for the formation of TSVs

Semiconductor package and method of fabricating the same

Ball grid array with improved single-ended and differential signal performance

Semiconductor package and method of forming similar structure for top and bottom bonding pads

Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP

DOUBLE MOLDED CHIP SCALE PACKAGE

Package for high power devices

Semiconductor device with exposed thermal conductivity part

Multi-chip package with thermal frame and method of assembling

Semiconductor package with an embedded printed circuit board and stacked die

Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device

Printed circuit board manufacturing method

METHODS OF FORMING THROUGH-SILICON VIA STRUCTURES INCLUDING CONDUCTIVE PROTECTIVE LAYERS

Thermally and electrically enhanced ball grid array package

Contact spring application to semiconductor devices

Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor package

Integrated voltage regulator with embedded passive device(s) for a stacked IC

Wafer level package (WLP) device having bump assemblies including a barrier metal

Mold compounds in improved embedded-die coreless substrates, and processes of forming same

Embedded chip-on-chip package and package-on-package comprising same

Electronic package with stacked semiconductor chips

Testing die-to-die bonding and rework

Switching power supply device, switching power supply circuit, and electrical equipment

Wafer Level Packaging Using Blade Molding

Semiconductor integrated circuit device

Electronic device comprising a nanotube-based interface connection layer, and manufacturing method thereof

Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer

Electrical interconnect for an integrated circuit package and method of making same

Corrugated die edge for stacked die semiconductor package

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MOLDED INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF

Method and system for thin multi chip stack package with film on wire and copper wire

Semiconductor device and method of forming RDL along sloped side surface of semiconductor die for z-direction interconnect

Semiconductor packaging system with multipart conductive pillars and method of manufacture thereof

Embedded 3D interposer structure

Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure

PACKAGE FOR A WIRELESS ENABLED INTEGRATED CIRCUIT

Semiconductor device with the leads projected from sealing body

Semiconductor device attached to island having protrusion

Integrated circuit package system with package stand-off and method of manufacture thereof

Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe

Semiconductor device with heat spreader

Laminated semiconductor substrate, laminated chip package and method of manufacturing the same

DIE PACKAGE AND A METHOD FOR MANUFACTURING THE DIE PACKAGE

Boost converter with integrated high power discrete FET and low voltage controller

Wafer scale package for high power devices

PORTABLE MEMORY DEVICES

Electronic devices with yielding substrates

Multiple patterning wiring board, wiring board and electronic apparatus

Metal coating for indium bump bonding

Occam process for components having variations in part dimensions

Method for manufacturing a multilayered circuit board

Method of manufacturing printed circuit board including electronic component embedded therein

Manufacturing method for semiconductor devices

Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof

Stacked package and method of manufacturing the same

Interconnection in multi-chip with interposers and bridges

Methods of making a semiconductor device

Method for transferring functional regions, LED array, LED printer head, and LED printer

Electrical microfilament to circuit interface

Accurate millimeter-wave antennas and related structures

Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system

Three-dimensional semiconductor integrated circuit

MOLDED BEAM FOR OPTOELECTRONIC SENSOR CHIP SUBSTRATE

Integrated circuit packaging system with leadframe and method of manufacture thereof

Electronic modules and methods for forming the same

Pop precursor with interposer for top package bond pad pitch compensation

Semiconductor chip having staggered arrangement of bonding pads

Packaged semiconductor device having improved locking properties

Electrode pad having a recessed portion

Semiconductor device and manufacturing method thereof

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Devices with covering layer and filler

Multi-chip stack package structure

Multi-chip stack package structure

Multi-chip stack package structure

Semiconductor device

Method of manufacturing an electronic device with a package locking system

Integrated circuit system with recessed through silicon via pads and method of manufacture thereof

Tungsten stiffener for flexible substrate assembly

Plasma treatment for semiconductor devices

Semiconductor device and method of forming dam material around periphery of die to reduce warpage

Semiconductor Device

Finger sensor including encapsulating layer over sensing area and related methods

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLIP CHIP MOUNTING AND METHOD OF MANUFACTURE THEREOF

Semiconductor package with interconnect layers

SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

Seal ring structure in semiconductor devices

Combined packaged power semiconductor device

Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus

LED module having a platform with a central recession

Large-scale X-ray detectors and methods of manufacturing the same

Method for testing a contact structure

INTEGRATED CIRCUIT PACKAGE SYSTEM FOR PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF

Package substrate

Thermally enhanced electronic package

Protection circuit

Lateral coupling enabled topside only dual-side testing of TSV die attached to package substrate

Chip package structure

Semiconductor device

Semiconductor device and method of forming flipchip interconnection structure with bump on partial pad

Semiconductor integrated circuit device and method of manufacturing the same

Thermally enhanced electronic package utilizing carbon nanocapsules and method of manufacturing the same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME