Copper bump structures having sidewall protection layers

ELECTRICALLY CONNECTING ROUTES OF SEMICONDUCTOR CHIP PACKAGE CONSOLIDATED IN DIE-ATTACHMENT

NO LEAD PACKAGE WITH HEAT SPREADER

Semiconductor device equipped with bonding wires and manufacturing method of semiconductor device equipped with bonding wires

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, WIRING BOARD AND MANUFACTURING METHOD THEREOF, SEMICONDUCTOR PACKAGE, AND ELECTRONIC APPARATUS

SEMICONDUCTOR CHIP WITH THROUGH ELECTRODES AND METHOD FOR MANUFACTURING THE SAME

Semiconductor package

Passive integrated circuit

Semiconductor device and method of forming RF FEM with IC filter and IPD filter over substrate

ELECTROSTATIC DISCHARGE PROTECTION SCHEME FOR SEMICONDUCTOR DEVICE STACKING PROCESS

Wafer level processing method and structure to manufacture semiconductor chip

SEMICONDUCTOR SENSOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR SENSOR DEVICE, PACKAGE, METHOD OF MANUFACTURING PACKAGE, MODULE, METHOD OF MANUFACTURING MODULE, AND ELECTRONIC DEVICE

Electronic device, resonator, oscillator and method for manufacturing electronic device

MULTILAYER PRINTED WIRING BOARD

Double-sided integrated circuit chips

POST-DISPENSE VACUUM OVEN FOR REDUCING UNDERFILL VOIDS DURING IC ASSEMBLY

Semiconductor device, and manufacturing method therefor

Method for Making Die Assemblies

Use of device assembly for a generalization of three-dimensional metal interconnect technologies

Method of repairing a display assembled on a substrate

Method for producing a matrix of individual electronic components and matrix produced thereby

Interconnect structure

Millimeter wave multi-layer packaging including an RFIC cavity and a radiating cavity therein

Surface mountable device

High-frequency module including a conductor with a slot therein and a conductive wire crossing over the slot and physically contacting the conductor

Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes

Component having a through-contact

Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die

Semiconductor device

ULTRA-LOW POWER SWNT INTERCONNECTS FOR SUB-THRESHOLD CIRCUITS

Multi-chip package with pillar connection

Semiconductor device

Integrated circuit packaging system with multipart conductive pillars and method of manufacture thereof

Semiconductor Structure

Cu pillar bump with non-metal sidewall spacer and metal top cap

Integrated circuit apparatus, systems, and methods

Apparatus for thermally enhanced semiconductor package

Integrated circuit package system with package stacking and method of manufacture thereof

Pad configurations for an electronic package assembly

Semiconductor component and method of manufacture

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INCREASED CONNECTIVITY AND METHOD OF MANUFACTURE THEREOF

Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure

Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die

Shielded stacked integrated circuit packaging system and method of manufacture thereof

Integrated circuit packaging system with magnetic film and method of manufacture thereof

Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor chip

Semiconductor device

Chip package

Small low-profile optical proximity sensor

WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

Manufacturing method of semiconductor device

SEMICONDUCTOR PACKAGE PROCESS WITH IMPROVED DIE ATTACH METHOD FOR ULTRATHIN CHIPS

Semiconductor package and method of forming the same

Semiconductor wafer with electrically connected contact and test areas

PACKAGING METHOD OF SEMICONDUCTOR DEVICE

Integrated battery and IC

Solder joints with enhanced electromigration resistance

3D semiconductor device

Method for manufacturing a semiconductor component and structure therefor

ELECTRONIC DEVICE HAVING ELECTRICALLY GROUNDED HEAT SINK AND METHOD OF MANUFACTURING THE SAME

Data storage device

Inductive circuit arrangement

Current control using thermally matched resistors

METHOD OF MAKING MICROELECTRONIC PACKAGE USING INTEGRATED HEAT SPREADER STIFFENER PANEL AND MICROELECTRONIC PACKAGE FORMED ACCORDING TO THE METHOD

Method and apparatus for manufacturing an electronic assembly, electronic assembly manufactured with the method or in the apparatus

Method for producing semiconductor components, and corresponding semiconductor component

Chip package including multiple sections for reducing chip package interaction

Package systems having interposers

Electronic device and method for connecting a die to a connection terminal

Integrated circuit package system with embedded die superstructure and method of manufacture thereof

Magnetically sintered conductive via

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Chip structure

Semiconductor device with grounding conductor film formed on upper surface of dielectric film formed above integrated circuit

Manufacturing method of semiconductor device, and mounting structure thereof

Semiconductor wafer structure and multi-chip stack structure

Semiconductor wafer structure and multi-chip stack structure

Semiconductor integrated circuit having a multi-chip structure

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POSTS AND METHOD OF MANUFACTURE THEREOF

IC HAVING DIELECTRIC POLYMERIC COATED PROTRUDING FEATURES HAVING WET ETCHED EXPOSED TIPS

Strength of micro-bump joints

Three dimensional stacked package structure

Reliable metal bumps on top of I/O pads after removal of test probe marks

Integrated circuit packaging system with dual side connection and method of manufacture thereof

Method for Fabricating a Semiconductor Chip Package and Semiconductor Chip Package

Method and system for forming a thin semiconductor device

Integrated circuit packaging system with multiple row leads and method of manufacture thereof

Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe

Semiconductor chip and semiconductor package with stack chip structure

Detector module

Dry flux bonding device and method

SOLDER JOINTS WITH ENHANCED ELECTROMIGRATION RESISTANCE

Manufacturing method for semiconductor integrated device

Method of manufacturing printed wiring board with built-in electronic component

Methods and Apparatus for Measuring Analytes Using Large Scale FET Arrays

Activation treatments in plating processes

Semiconductor test pad structures

Semiconductor integrated circuit device

Method for manufacturing antenna and method for manufacturing semiconductor device

CONVEX DIE ATTACHMENT METHOD

Semiconductor module device and driving apparatus having the same

Electrical connections for multichip modules

Chip package and method for forming the same

Substrate interconnections having different sizes

Integrated circuit and method for fabricating the same

Bump structure and fabrication method thereof

Controlling Solder Bump Profiles by Increasing Heights of Solder Resists

Substrate contact opening

Cu pillar bump with L-shaped non-metal sidewall protection structure

Integrated circuit packaging system with dual side connection and method of manufacture thereof

Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP

Package systems having interposers with interconnection structures

Optical device and method for manufacturing optical device, and camera module and endoscope module equipped with optical device

Leadless package system having external contacts

Leadless integrated circuit packaging system and method of manufacture thereof

Semiconductor system with fine pitch lead fingers and method of manufacturing thereof

Integrated circuit packaging system with isolated pads and method of manufacture thereof

Integrated circuit package system with offset stacked die

Semiconductor apparatus and power supply circuit

Electrostatic discharge (ESD) silicon controlled rectifier (SCR) structure

Semiconductor light emitting device packages and methods

Probe pad on a corner stress relief region in a semiconductor chip

Integrated circuit package system with laminate base

Semiconductor device including external connection pads and test pads

Method and apparatus of manufacturing functionally gradient material

Semiconductor chip, and semiconductor package and system each including the semiconductor chip

Method of fabricating a semiconductor device with encapsulant

Magnetic microelectronic device attachment

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

Circuitry and Method for Encapsulating the Same

Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant

Stacking integrated circuits containing serializer and deserializer blocks using through silicon via

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

Chip package

Chip package

Process for fabricating semiconductor devices and a semiconductor device comprising a chip with through-vias

Extendable network structure

Chip packaging

STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTION JOINTS

Chip package and method for forming the same

Semiconductor device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate

DIRECTING THE FLOW OF UNDERFILL MATERIALS USING MAGNETIC PARTICLES

Assembly of multi-chip modules with proximity connectors using reflowable features

Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation

Method of fabricating bump structure

Method of forming perforated opening in bottom substrate of flipchip pop assembly to reduce bleeding of underfill material

Leadless package for high current devices

Direct contact leadless package

Stacked-die package for battery power management

Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die

Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die

Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die

Bonding wire profile for minimizing vibration fatigue failure

Semiconductor Device with Circuit for Reduced Parasitic Inductance

WAFER LEVEL INTEGRATION MODULE WITH INTERCONNECTS

Probe pad with indentation

MAGNETIC PARTICLE ATTACHMENT MATERIAL

Method for interconnecting electrical device to a module

Method and apparatus for rapid thermal processing and bonding of materials using RF and microwaves

Magnetic attachment structure

Forming interconnect structures using pre-ink-printed sheets

PATTERNED CONTACT

Fuel gauge circuit and battery pack

Semiconductor device

IC Chip Coating Material and Vacuum Fluorescent Display Device Using Same

Integrated circuit with supply line intra-chip clock interface and methods for use therewith

Stacked die assembly having reduced stress electrical interconnects

Semiconductor device and method of forming channels in back surface of FO-WLCSP for heat dissipation

Semiconductor Components Having Conductive Vias With Aligned Back Side Conductors

Stacked semiconductor package and method for manufacturing the same

Wafer level package and methods of fabricating the same

Semiconductor device for preventing crack in pad region and fabricating method thereof

Integrated circuit packaging system having a cavity

Selecting chips within a stacked semiconductor package using through-electrodes

SEMICONDUCTOR DEVICE WITH CONNECTION PADS PROVIDED WITH INSERTS

Semiconductor package and method of manufacturing same

IC CHIP AND IC CHIP MANUFACTURING METHOD THEREOF

Die backside standoff structures for semiconductor devices

IC package with capacitors disposed on an interposal layer

SYSTEM FOR DISPENSING SOFT SOLDER FOR MOUNTING SEMICONDUCTOR CHIPS USING MULTIPLE SOLDER WIRES

Apparatus for applying solder to semiconductor chips using decals with aperatures present therein

Dual capillary IC wirebonding

Hermetic wafer-to-wafer bonding with electrical interconnection

HERMETIC WAFER-TO-WAFER BONDING WITH ELECTRICAL INTERCONNECTION

Biocompatible Bonding Method

Gold-tin etch using combination of halogen plasma and wet etch

Method of manufacturing an electronic component

Isolating wire bonding in integrated electrical components

Nanotube based vapor chamber for die level cooling

Stackable layer containing ball grid array package

LASER ABLATION ALTERNATIVE TO LOW COST LEADFRAME PROCESS

Nonvolatile semiconductor memory device

CIRCUIT CONNECTION MATERIAL, AND CONNECTION STRUCTURE OF CIRCUIT MEMBER AND CONNECTION METHOD OF CIRCUIT MEMBER USING THE CIRCUIT CONNECTION MATERIAL

Semiconductor device and manufacturing method thereof

Build-up package for integrated circuit devices, and methods of making same

Wire bond interconnection and method of manufacture thereof

TCE compensation for package substrates for reduced die warpage assembly

Through-substrate vias with improved connections

Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus

Electronic elements and devices with trench under bond pad feature

Selective die electrical insulation by additive process

Semiconductor device having trench-isolated element formation region

Laser etch via formation

INTEGRATED CIRCUIT PACKAGE STRUCTURE AND METHOD

INTEGRATED-CIRCUIT ATTACHMENT STRUCTURE WITH SOLDER BALLS AND PINS

WAFER LEVEL CHIP SCALE PACKAGE WITH ANNULAR REINFORCEMENT STRUCTURE

Semiconductor chip with post-passivation scheme formed over passivation layer

Cu pillar bump with non-metal sidewall protection structure

Circuit board with built-in semiconductor chip and method of manufacturing the same

Integrated circuit packaging system with package-on-package and method of manufacture thereof

Isolated wire bond in integrated electrical components

Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue

Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof

Probe pad on a corner stress relief region in a semiconductor chip

Semiconductor device

Method for embedding a component in a base

Preventing breakage of long metal signal conductors on semiconductor substrates

Magnetic intermetallic compound interconnect

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE CONTAINING STACKED SEMICONDUCTOR CHIPS

Method of forming nanoscale three-dimensional patterns in a porous material

METHOD OF ASSEMBLING SEMICONDUCTOR DEVICES INCLUDING SAW SINGULATION

Electromagnetic interference shielding on semiconductor devices

Die package

Resin composition for encapsulating semiconductor, method for producing semiconductor device and semiconductor device

Power switch component having improved temperature distribution

Semiconductor device

Semiconductor device and method of forming adjacent channel and DAM material around die attach area of substrate to control outward flow of underfill material

Wafer level semiconductor package and fabrication method thereof

Semiconductor device having double side electrode structure

Stacked semiconductor device

Semiconductor integrated circuit

Electronic device package and method of manufacture

Flip chip interconnection structure

Three-dimensional stacked substrate arrangements

Integrated circuits with multiple I/O regions

Cu pillar bump with electrolytic metal sidewall protection

Semiconductor method of forming bump on substrate to prevent ELK ILD delamination during reflow process

Integrated circuit package system with contoured encapsulation and method for manufacturing thereof

Quad flat non-leaded semiconductor package and fabrication method thereof

Integrated circuit including bond wire directly bonded to pad

Semiconductor device and method of forming openings in thermally-conductive frame of FO-WLCSP to dissipate heat and reduce package height

THROUGH-SUBSTRATE VIA AND FABRICATION METHOD THEREOF

Semiconductor device connection

Semiconductor package structure and package process

Device for protecting an electronic integrated circuit housing against physical or chemical ingression

Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same

Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods

Method for manufacturing integrated circuit package system with under paddle leadfingers

Integrated circuit packaging system with mountable inward and outward interconnects and method of manufacture thereof

FILM ADHESIVE AND ANISOTROPIC CONDUCTIVE ADHESIVE

Dicing tape-integrated film for semiconductor back surface

Semiconductor device and method of forming conductive vias with trench in saw street

Package-on-package system with through vias and method of manufacture thereof

Integrated method for high-density interconnection of electronic components through stretchable interconnects

Stack package having flexible conductors

Integrated Circuit Package Having Under-Bump Metallization

TSVs with different sizes in interposers for bonding dies

Conductive feature for semiconductor substrate and method of manufacture

Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant

Semiconductor device and method of wafer level package integration

Wafer level die integration and method therefor

Routing layer for mitigating stress in a semiconductor die

Die structure and die connecting method

CHIP STRUCTURE, CHIP BONDING STRUCTURE USING THE SAME, AND MANUFACTURING METHOD THEREOF

Method for fabricating bump structure without UBM undercut

Semiconductor device having multiple semiconductor elements

Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tape

Chip package structure and method of making the same

Forming functionalized carrier structures with coreless packages

Ultra high speed signal transmission/reception

Apparatus with a multi-layer coating and method of forming the same

Circuit board with notched stiffener frame

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Controlling warping in integrated circuit devices

Inverse chip connector

Electrode-connecting structure, conductive adhesive used for the same, and electronic apparatus

METHOD AND APPARATUS FOR FABRICATING INTEGRATED CIRCUIT DEVICE USING SELF-ORGANIZING FUNCTION

Integrated circuit package in package system

Method of manufacturing semiconductor device

Dummy pattern in wafer backside routing

Dual-side interconnected CMOS for stacked integrated circuits

Semiconductor device and method of forming high routing density BOL BONL and BONP interconnect sites on substrate

Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress

Semiconductor device having stacked components

Bow-balanced 3D chip stacking

Lead frame for semiconductor device

Lead frame for semiconductor package

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Methods and apparatus for measuring analytes using large scale FET arrays

Chip package and method for forming the same

Methods and apparatus for measuring analytes using large scale FET arrays

Adhesive for bonding circuit members, circuit board and process for its production

Adhesive for bonding circuit members, circuit board and process for its production

Debond interconnect structures

Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same