Adhesive for bonding circuit members, circuit board and process for its production

Differential pressure underfill process and equipment

CIRCUIT CONNECTION MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE, AND METHOD OF MANUFACTURING THE SAME

Circuit board with embedded component and method of manufacturing same

Multimode signaling on decoupled input/output and power channels

Liquid crystal display and fabricating method thereof

Mold and substrate for use with mold

MANUFACTURING METHOD OF SEMICONDUCTOR CHIP-EMBEDDED WIRING SUBSTRATE

Method for manufacture of inline integrated circuit system

PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES

Reduction of mechanical stress in metal stacks of sophisticated semiconductor devices during die-substrate soldering by an enhanced cool down regime

Packaging process to create wettable lead flank during board assembly

OPTO-ELECTRONIC TRANSCEIVER MODULE SYSTEM

Stacked memory and devices including the same

ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Method and System for Providing 1080P Video With 32-Bit Mobile DDR Memory

APPARATUS FOR PREDETERMINED COMPONENT PLACEMENT TO A TARGET PLATFORM

Integrated circuit package system with wire-in-film isolation barrier and method for manufacturing thereof

Semiconductor package and multichip arrangement having a polymer layer and an encapsulant

Semiconductor device with improved resin configuration

Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads

Multi-layer interconnect structure for stacked dies

Embedded semiconductive chips in reconstituted wafers, and systems containing same

SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE, AND PORTABLE APPARATUS

Dummy metal design for packaging structures

Radiate under-bump metallization structure for semiconductor devices

System in package with heat sink

Device and method for manufacturing a device

Semiconductor device packages with fan-out and with connecting elements for stacking and manufacturing methods thereof

SEMICONDUCTOR LAMINATION PACKAGE AND METHOD OF PRODUCING SEMICONDUCTOR LAMINATION PACKAGE

Granular epoxy resin composition for encapsulating semiconductor, semiconductor device using the same and method for producing semiconductor device

LEAD FRAME WITH RECESSED DIE BOND AREA

Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages

Integrated circuit devices having selectively strengthened composite interlayer insulation layers and methods of fabricating the same

Stacked chip package with redistribution lines

Method for manufacturing a semiconductor device, method for detecting a semiconductor substrate and semiconductor chip package

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method for manufacturing same

Semiconductor device and method of forming high-attenuation balanced band-pass filter

RF CMOS transistor design

Power Semiconductor Device with Low Parasitic Metal and Package Resistance

Methods and apparatus for measuring analytes using large scale FET arrays

Heat dissipation by through silicon plugs

Semiconductor package with through silicon vias

Method for manufacturing wafer scale heat slug system

Thermo-compression bonded electrical interconnect structure and method

In system reflow of low temperature eutectic bond balls

Method of making semiconductor package having redistribution layer

Die level integrated interconnect decal manufacturing method and apparatus

Electronic device wafer level scale packages and fabrication methods thereof

Chipstack package and manufacturing method thereof

Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections

SEMICONDUCTOR CHIP USED FOR EVALUATION, EVALUATION SYSTEM, AND REPAIRING METHOD THEREOF

IC PACKAGE STIFFENER WITH BEAM

Integrated circuit package component with ball conducting joints

Conformal shielding process using process gases

Voltage converter

Methods and systems for material bonding

Sacrificial material to facilitate thin die attach

Semiconductor device

Backside dummy plugs for 3D integration

Electronic device package and fabrication method thereof

Through-wafer interconnects for photoimager and memory wafers

Semiconductor chip with coil element over passivation layer

Manufacturing process and structure of through silicon via

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME

Semiconductor device provided with tin diffusion inhibiting layer, and manufacturing method of the same

Semiconductor device and method of forming a dual UBM structure for lead free bump connections

Semiconductor device and method of manufacturing the same

Integrated circuit system with stress redistribution layer and method of manufacture thereof

Wafer level integrated interconnect decal and manufacturing method thereof

Cu pillar bump with non-metal sidewall protection structure

SEMICONDUCTOR DEVICE

Method for facilitating the stacking of integrated circuits having different areas and an integrated circuit package constructed by the method

WAFER LEVEL PACKAGING WITH HEAT DISSIPATION

Encapsulated semiconductor chip with external contact pads and manufacturing method thereof

Integrated circuit packaging system with leads and method of manufacture thereof

Integrated circuit packaging system with an intermediate pad and method of manufacture thereof

Integrated circuit packaging system with encapsulation and method of manufacture thereof

Integrated circuit packaging system with interconnect and method of manufacture thereof

Integrated circuit packaging system with stacking option and method of manufacture thereof

Integrated circuit packages

Integrated circuit protruding pad package system and method for manufacturing thereof

Integrated circuit packaging system with leadframe and method of manufacture thereof

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Integrated circuit packaging system with encapsulation and method of manufacture thereof

Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors

Semiconductor apparatus, method of manufacturing semiconductor apparatus, method of designing semiconductor apparatus, and electronic apparatus

Manufacturing method of electronic device package, electronic device package, and oscillator

Method for fabrication of a semiconductor device and structure

Integrated circuit having a semiconductor substrate with barrier layer

Method for fabrication of a semiconductor device and structure

Micro-fluidic injection molded solder (IMS)

Method of attaching die to circuit board with an intermediate interposer

Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Methods and apparatus for measuring analytes using large scale FET arrays

CONTACT STRUCTURE HAVING A COMPLIANT BUMP AND A TESTING AREA AND MANUFACTURING METHOD FOR THE SAME

Tape residue-free bump area after wafer back grinding

Semiconductor device, manufacturing method of semiconductor device, and RFID tag

Fabrication method for integrated circuit chip component, multi-chip module, and their integration structure

Semiconductor fabrication method and system

Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making the same

Methods for protecting a die surface with photocurable materials

Electronic circuit module component and method of manufacturing electronic circuit module component

Memory system topologies including a buffer device and an integrated circuit memory device

Molded power-supply module with bridge inductor over other components

Electronic assembly with detachable components

Coupling heat sink to integrated circuit chip with thermal interface material

Electric power conversion apparatus

System-in-package using embedded-die coreless substrates, and processes of forming same

Method of creating spiral inductor having high Q value

Secure Anti-Tamper Integrated Layer Security Device Comprising Nano-Structures

MULTI-FUNCTION CARD DEVICE

Packaged electronic device having metal comprising self-healing die attach material

Embedded die with protective interposer

Electronic device having interconnections, openings, and pads having greater width than the openings

Enhanced WLP for superior temp cycling, drop test and high current applications

Under-Bump Metallization Structure for Semiconductor Devices

Integrated circuit packaging system with bump contact on package leads and method of manufacture thereof

Chip package and method for forming the same

Integrated circuit package system with package stacking and method of manufacture thereof

Stacked dual chip package and method of fabrication

Integrated circuit packaging system with lead frame and method of manufacture thereof

Semiconductor chip with a rounded corner

Alignment structures for integrated-circuit packaging

Semiconductor device

Power MOS transistor device and switch apparatus comprising the same

Power MOS transistor device

Semiconductor substrate and semiconductor chip

ROOM TEMPERATURE DIRECT METAL-METAL BONDING

Die stacking with an annular via having a recessed socket

Conformal shielding employing segment buildup

Multi-chip module with multi-level interposer

Silicon nitride passivation layer for covering high aspect ratio features

Method of fabricating a capillary-flow underfill compositions

Method of manufacture of integrated circuit packaging system with multi-tier conductive interconnects

Pin-type chip tooling

Electronic assembly with detachable components

Distributed semiconductor device methods, apparatus, and systems

CIRCUIT BOARD WITH ANCHORED UNDERFILL

Electronic assembly with detachable components

Electronic assembly with detachable components

Coreless multi-layer circuit substrate with minimized pad capacitance

Method of sensing magnitude of current through semiconductor power device

ELECTROSTATIC CHUCK

Integrated circuit packaging system with via and method of manufacture thereof

Chip package and method for forming the same

Methods of forming semiconductor chip underfill anchors

Process for fabricating electronic components using liquid injection molding

Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces

Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation

Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die

Semiconductor device and method of forming conductive vias through interconnect structures and encapsulant of WLCSP

PRE-PROCESSING TO REDUCE WAFER LEVEL WARPAGE

Leadframe based multi terminal IC package

Electronic device, relay member, and mounting substrate, and method for manufacturing the electronic device

Package having spaced apart heat sink

Semiconductor device and method of forming insulating layer around semiconductor die

High power semiconductor device for wireless applications and method of forming a high power semiconductor device

Semiconductor devices and methods for forming patterned radiation blocking on a semiconductor device

Integrated circuit package for semiconductior devices with improved electric resistance and inductance

Electronic circuit device

Methods and devices for fabricating and assembling printable semiconductor elements

Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the same

Carrier system with multi-tier conductive posts and method of manufacture thereof

Enhanced integrated circuit package

CONNECTING PAD PRODUCING METHOD

Method for singulating electronic components from a substrate

INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING SAME WITH AN INTERPOSER SUBSTRATE

Semiconductor package and semiconductor device

Method for fabricating circuit component

Multi-surface IC packaging structures

Through Silicon via Bridge Interconnect

Dummy wafers in 3DIC package assemblies

METHOD FOR FORMING A DOUBLE EMBOSSING STRUCTURE

Bump-on-lead flip chip interconnection

Flip chip package maintaining alignment during soldering

MULTI-CHIP INTEGRATED CIRCUIT

Semiconductor package with embedded die and its methods of fabrication

Stacked semiconductor chips with separate encapsulations

Semiconductor device and method of forming package-on-package structure electrically interconnected through TSV in WLCSP

Thin package system with external terminals and method of manufacture thereof

Stacked semiconductor packages

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF

Integrated circuit package stacking system with shielding and method of manufacture thereof

Chip package and method for fabricating the same

Stacked semiconductor package having discrete components

MANUFACTURING METHOD OF ELECTRONIC DEVICE PACKAGE, ELECTRONIC DEVICE PACKAGE, AND OSCILLATOR

Semiconductor device

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Printed wiring board

ELECTRO DEVICE EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURNG METHOD THEREOF

Nanotube Materials for Thermal Management of Electronic Components

Microelectronic workpieces with stand-off projections and methods for manufacturing microelectronic devices using such workpieces

Semiconductor device with copper wirebond sites and methods of making same

SEMICONDUCTOR POWER DEVICE HAVING A STACKED DISCRETE INDUCTOR STRUCTURE

Rigid-backed, membrane-based chip tooling

Assembled multi-component electronic apparatus using alignment and reference marks

High-density integrated circuit module structure

Carbon nanotubes for the selective transfer of heat from electronics

High Frequency Power Supply Module Having High Efficiency and High Current

Methods of forming a metal pattern and semiconductor device structure

Semiconductor die having a redistribution layer

3D semiconductor package interposer with die cavity

SEMICONDUCTOR DEVICE HAVING BUCKET-SHAPED UNDER-BUMP METALLIZATION AND METHOD OF FORMING SAME

CHIP PACKAGE

Stackable electronic package and method of fabricating same

Semiconductor package and manufacturing method thereof

Thermal vias in an integrated circuit package with an embedded die

Integrated circuit packaging system with exposed conductor and method of manufacture thereof

Integrated circuit packaging system with encapsulation connector and method of manufacture thereof

Semiconductor chip and film and TAB package comprising the chip and film

Microwave circuit package

Semiconductor substrate, package and device

Semiconductor device and method for manufacturing the same

Semiconductor device having IPD structure with smooth conductive layer and bottom-side conductive layer

Chip package and fabrication method thereof

ULTRA THIN FLIP-CHIP BACKSIDE DEVICE SENSOR PACKAGE

Method for placing a component onto a target platform by an apparatus using a probe

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

Metal interconnect structure with a side wall spacer that protects an ARC layer and a bond pad from corrosion and method of forming the metal interconnect structure

Assessing metal stack integrity in sophisticated semiconductor devices by mechanically stressing die contacts

METHODS FOR MEMORY PROGRAMMING DURING PRODUCT ASSEMBLY

Calibration standards and methods of their fabrication and use

Method of manufacturing semiconductor device

Method for manufacturing a semiconductor structure

METHOD OF PRODUCING ELECTRICAL COMPONENT, ELECTRICAL COMPONENT PRODUCTION DEVICE, AND PHOTOSENSITIVE RESIST

Integrated chip package structure using organic substrate and method of manufacturing the same

Electronic component

CIRCUIT SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE

Impedance transformer, integrated circuit device, amplifier, and communicator module

Current sensors and methods

Semiconductor circuit and switching power supply apparatus

Wireless communication system

Circuit component with conductive layer structure

IC die including RDL capture pads with notch having bonding connectors or its UBM pad over the notch

Device including an encapsulated semiconductor chip and manufacturing method thereof

Wirebondless wafer level package with plated bumps and interconnects

System and Method for Improving Reliability of Integrated Circuit Packages

Chip structure

Semiconductor device and method of forming IPD in fan-out level chip scale package

Two-shelf interconnect

Thermal interface material design for enhanced thermal performance and improved package structural integrity

Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier

Reducing susceptibility to electrostatic discharge damage during die-to-die bonding for 3-D packaged integrated circuits

Power device packages having thermal electric modules using peltier effect and methods of fabricating the same

Semiconductor integrated circuit and method for manufacturing the same

CIRCUIT MODULE, ELECTRONIC DEVICE INCLUDING THE SAME, AND CIRCUIT MODULE MANUFACTURING METHOD

Device having wire bond and redistribution layer

Integrated circuit packaging system with shield and method of manufacture thereof

Semiconductor Device and Method of Forming 3D Inductor from Prefabricated Pillar Frame

Micro-optical device packaging system

Method and apparatus providing an imager module with a permanent carrier

Semiconductor device and manufacturing method of the same

Semiconductor device

Semiconductor device and penetrating electrode testing method

Method for the removal of surface oxides by electron attachment

Printed wiring board and method for manufacturing same

Adaptive patterning for panelized packaging

Configurable IC's with dual carry chains

Phosphorous-Containing Flame Retardant Epoxy Resin Composition, Prepreg and Laminate Thereof

Method and System for Wafer-Level Planarization of a Die-to-Wafer System

Laser annealing for 3-D chip integration

Method for making via interconnection

Flip chip mounting method and bump forming method

Direct IMS (injection molded solder) without a mask for forming solder bumps on substrates

Semiconductor device and process for fabricating the same

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Selective removal of gold from a lead frame

Integrated circuit packaging system and method of manufacture thereof

Semiconductor package

Wiring board and liquid crystal display device

RFID integrated circuit with integrated antenna structure

Semiconductor device

METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE

Method and apparatus providing integrated circuit having redistribution layer with recessed connectors

Lead frame ball grid array with traces under die

Method of improving adhesion of bond pad over pad metallization with a neighboring passivation layer by depositing a palladium layer

Semiconductor chip, electrode structure therefor and method for forming same

Method of fabricating a conductive post on an electrode

Wafer-level packaged device having self-assembled resilient leads

Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device

Semiconductor device and electronic device

Integrated circuit package with enlarged die paddle

Method for manufacturing semiconductor device

Chip package and method for forming the same

Light-emitting diode (LED) package systems

III-nitride power device with solderable front metal

Flux-free chip to wafer joint serial thermal processor arrangement

Method of Magnetically Driven Simultaneous Assembly

Stacking package structure with chip embedded inside and die having through silicon via and method of the same

Solder bump structure for flip chip semiconductor devices and method of manufacturing therefore

FLIP-CHIP ASSEMBLY WITH ORGANIC CHIP CARRIER HAVING MUSHROOM-PLATED SOLDER RESIST OPENING

Semiconductor device and a method of manufacturing the same

Asymmetric Front/Back Solder Mask

Polymer matrices for polymer solder hybrid materials

ADHESIVE FILM AND PROCESS FOR PREPARING THE SAME AS WELL AS ADHESIVE SHEET AND SEMICONDUCTOR DEVICE

Unique Package Structure