Chip package and method for forming the same

Semiconductor element and display device provided with the same

3DIC Architecture with Die Inside Interposer

Conductive pillar structure for semiconductor substrate and method of manufacture

Electronic device package and method for fabricating the same

Lead free solder interconnections for integrated circuits

Microelectronic devices with through-substrate interconnects and associated methods of manufacturing

Electronic device package and fabrication method thereof

Semiconductor module, method for fabricating the semiconductor module, and mobile apparatus

3D IC architecture with interposer and interconnect structure for bonding dies

Pillar structure having a non-planar surface for semiconductor devices

Semiconductor device and semiconductor assembly with lead-free solder

Solder interconnect with non-wettable sidewall pillars and methods of manufacture

Manufacturing of a device including a semiconductor chip

Package structure

Systems and Methods Providing Arrangements of Vias

Surface Preparation of Die for Improved Bonding Strength

Image sensor package with trench insulator and fabrication method thereof

Semiconductor package of a flipped MOSFET and its manufacturing method

LEAD FRAME FOR SEMICONDUCTOR DIE

Semiconductor device and method of manufacturing the same

Stacked-die electronics package with planar and three-dimensional inductor elements

Micro-fluidic injection molded solder (IMS)

Electronic device and method of manufacturing the same

Method and apparatus for interconnect layout in an integrated circuit

Method to form solder deposits on substrates

Method for manufacturing an electronic device

Method of making semiconductor package with improved standoff

Semiconductor device

Edge connect wafer level stacking

Semiconductor device and method of forming cavity adjacent to sensitive region of semiconductor die using wafer-level underfill material

Semiconductor device and its manufacture method

Integrated circuits having TSVs including metal gettering dielectric liners

Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate

Solder bump interconnect

Integrated circuit packaging system having dual sided connection and method of manufacture thereof

Semiconductor module and portable apparatus provided with semiconductor module

Recessed semiconductor substrates and associated techniques

Protruding TSV tips for enhanced heat dissipation for IC devices

Semiconductor Device and Bump Formation Process

Multi-direction design for bump pad structures

Stress buffer structures in a mounting structure of a semiconductor device

T-shaped post for semiconductor devices

Semiconductor device with surface electrodes

Method of forming thin profile WLCSP with vertical interconnect over package footprint

Semiconductor device and method of forming air gap adjacent to stress sensitive region of the die

GAAS INTEGRATED CIRCUIT DEVICE AND METHOD OF ATTACHING SAME

TECHNIQUES AND CONFIGURATIONS FOR RECESSED SEMICONDUCTOR SUBSTRATES

SEMICONDUCTOR DEVICE WITH A VARIABLE INTEGRATED CIRCUIT CHIP BUMP PITCH

Semiconductor package structure

Gallium nitride power devices using island topography

RFID tags and processes for producing RFID tags

Apparatus for manufacturing bonding structure, bonding structure and method of fabricating the same

Stable electroless fine pitch interconnect plating

Semiconductor device and a method of manufacturing the same

Electronic device and manufacturing method of the same

Manufacturing method of semiconductor device

Integrated semiconductor substrate structure using incompatible processes

Packaging method involving rearrangement of dice

Packaging method involving rearrangement of dice

Array-molded package-on-package having redistribution lines

Dual carrier for joining IC die or wafers to TSV wafers

Method of manufacturing stacked semiconductor package

PACKAGE FOR SYNCHRONOUS RECTIFIER MODULE

ELECTRONIC CIRCUIT DEVICE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE

Electronic Assemblies without Solder and Methods for their Manufacture

High frequency semiconductor device

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

Integrated circuit packaging system with conductive pillars and method of manufacture thereof

SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD

Etched recess package on package system

Microelectromechanical systems embedded in a substrate

Co-axial restraint for connectors within flip-chip packages

Multi-tiered integrated circuit package

Integrated circuit package-in-package system with wire-in-film encapsulant and method for manufacturing thereof

Method of stacking flip-chip on wire-bonded chip

Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip

Semiconductor device

SEMICONDUCTOR DEVICE

Packaged semiconductor product and method for manufacture thereof

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

Semiconductor device and a method of manufacturing the same

Semiconductor device

NON-DIRECT BOND COPPER ISOLATED LATERAL WIDE BAND GAP SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT PACKAGE, METHOD FOR PRODUCING THE SAME AND INTERPOSER

PRESSURE BONDING APPARATUS AND METHOD

Enhanced magnetic self-assembly using integrated micromagnets

Polishing solution for CMP, and method for polishing substrate using the polishing solution for CMP

Stable Gold Bump Solder Connections

Wafer-level semiconductor device packages with three-dimensional fan-out and manufacturing methods thereof

Signal transmission arrangement

Multilayer printed circuit board

Semiconductor device and manufacturing method thereof

Wiring substrate and semiconductor apparatus including the wiring substrate

Semiconductor integrated circuit

Post passivation interconnection schemes on top of the IC chips

Stacked semiconductor components having conductive interconnects

SEMICONDUCTOR PACKAGE

Chip package and fabrication method thereof

PACKAGE ASSEMBLY HAVING A SEMICONDUCTOR SUBSTRATE

Integrated void fill for through silicon via

3D chip stack having encapsulated chip-in-chip

Semiconductor device and manufacturing method thereof

Method and structure to reduce soft error rate susceptibility in semiconductor structures

METHOD OF FORMING AN EM PROTECTED SEMICONDUCTOR DIE

Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material

ELEMENT MOUNTING BOARD, SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, METHOD FOR FABRICATING THE ELEMENT MOUNTING BOARD, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

Arrangement for energy conditioning

Method and system for drug delivery to the eye

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor device manufacturing method

IC chip, antenna, and manufacturing method of the IC chip and the antenna

Reworkable electronic device assembly and method

Circuit substrate and display device

System and Method To Embed A Wireless Communication Device Into Semiconductor Packages

Laser optical path detection

Semiconductor device and power source device

Dual Interconnection in Stacked Memory and Controller Module

Method for providing and connecting two contact areas of a semiconductor component or a substrate, and a substrate having two such connected contact areas

Through-silicon via formed with a post passivation interconnect structure

Grid array connection device and method

SEMICONDUCTOR DEVICE

Wiring substrate, manufacturing method thereof, and semiconductor package

Attaching passive components to a semiconductor package

Chip package and fabrication method thereof

Solder Pillars in Flip Chip Assembly

Microelectronic devices

Semiconductor package

Semiconductor package with single sided substrate design and manufacturing methods thereof

Semiconductor package system with fine pitch lead fingers and method of manufacturing thereof

Method for establishing and closing a trench of a semiconductor component

Chip package and fabrication method thereof

Semiconductor device having backside redistribution layers

Wireless Communication Device for Remote Authenticity Verification of Semiconductor Chips, Multi-Chip Modules and Derivative Products

Semiconductor device including a DC-DC converter having a metal plate

Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing same

System and Method To Embed A Wireless Communication Device Into Semiconductor Packages, including Chip-Scale Packages and 3D Semiconductor Packages

System and Method To Embed A Wireless Communication Device Into Semiconductor Packages

Wireless Communication Device for Remote Authenticity Verification of Semiconductor Chips, Multi-Chip Modules and Derivative Products

Nanotube modified solder thermal intermediate structure, systems, and methods

Bond pad connection to redistribution lines having tapered profiles

Flexible interposer for stacking semiconductor chips and connecting same to substrate

Semiconductor package having buss-less substrate

Method for Fabricating Array-Molded Package-on-Package

Method of manufacturing semiconductor device

METHOD OF PACKAGING SEMICONDUCTOR DEVICE

Method for attaching optical components onto silicon-based integrated circuits

Apparatus and method for predetermined component placement to a target platform

ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Integrated circuit micro-module

Electronic device substrate, electronic device, method of manufacturing electronic device substrate, method of manufacturing electronic device, and electronic apparatus

Electroless plating of porous and non-porous nickel layers, and gold layer in semiconductor device

Electronic packages with fine particle wetting and non-wetting zones

Semiconductor device having elastic solder bump to prevent disconnection

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Semiconductor device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor package and method of manufacturing the same

Method for stacking serially-connected integrated circuits and multi-chip device made from same

Semiconductor device having embedded integrated passive devices electrically interconnected using conductive pillars

Wafer level stack die package

High voltage devices and methods of forming the high voltage devices

Lead, wiring member, package component, metal component with resin, resin-encapsulated semiconductor device, and methods for producing the same

Flip-chip mounting method and bump formation method

INTEGRATED DEVICE

Acrylic insulating adhesive

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Method of manufacturing semiconductor device

Flip chip package containing novel underfill materials

INTEGRATED CIRCUITS HAVING LEAD CONTACTS AND LEADLESS CONTACT PADS CONNECTED TO A SURFACE OF A PRINTED WIRING BOARD, AND METHODS FOR CONNECTING THE SAME

Patch on interposer through PGA interconnect structures

VOLTAGE CONVERTER WITH INTEGRATED SCHOTTKY DEVICE AND SYSTEMS INCLUDING SAME

Inductive relayed coupling circuit between substrates

Quad flat no lead (QFN) package

Patch on interposer assembly and structures formed thereby

Integrated circuit packaging system having planar interconnect and method for manufacture thereof

Semiconductor module

Methods for forming through-substrate conductor filled vias, and electronic assemblies formed using such methods

INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING SAME

PAD STRUCTURE AND INTEGRATED CIRCUIT CHIP WITH SUCH PAD STRUCTURE

Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip

CARBON NANOTUBE-BASED FILLER FOR INTEGRATED CIRCUITS

Modified chip attach process

Semiconductor device and method for manufacturing the same

PACKAGE SUBSTRATE AND METHOD OF FABRICATING THE SAME

METHOD FOR MANUFACTURING A FAN-OUT EMBEDDED PANEL LEVEL PACKAGE

Semiconductor package having chip using copper process

Self repairing IC package design

Recessed and embedded die coreless package

Semiconductor device package having a semiconductor chip on wiring board connected to plurality of leads including power MOSFETs

Semiconductor device

INTERPOSER AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Circular shield of a circuit-substrate laminated module and electronic apparatus

Manufacturing method of semiconductor device and semiconductor device

Chip package

Integrated circuit device and electronic instrument

METHOD AND SYSTEM FOR TRACING DIE AT UNIT LEVEL

Method of repairing probe pads

Circuit board and its wire bonding structure

Structure of circuit board and method for fabricating the same

Manufacturing method of semiconductor device

Overcoming laminate warpage and misalignment in flip-chip packages

Method of manufacturing semiconductor device

Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

METHOD AND MAGNETIC TRANSFER STAMP FOR TRANSFERRING SEMICONDUCTOR DICE USING MAGNETIC TRANSFER PRINTING TECHNIQUES

DIE ADHESIVE FILM, REEL FOR DIE ADHESIVE FILM, MOUNTING APPARATUS AND ELECTRONIC DEVICE COMPRISING THE SAME

Apparatus and method for embedding components in small-form-factor, system-on-packages

Systems employing a stacked semiconductor package

Apparatus and method for embedding components in small-form-factor, system-on-packages

Integrated circuit with inductive bond wires

Silicone resin composition and a cured product thereof

Hybrid integrated circuit device

Wafer-level stack package and method of fabricating the same

Wafer level surface passivation of stackable integrated circuit chips

Metal plugged substrates with no adhesive between metal and polyimide

Multiple surface finishes for microelectronic package substrates

Contact-based encapsulation

Lead frame land grid array with routing connector trace under unit

Semiconductor component of semiconductor chip size with flip-chip-like external contacts

Through mold via polymer block package

Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier

Pre-soldered leadless package

Structures and methods to reduce maximum current density in a solder ball

Apparatus and method for embedding components in small-form-factor, system-on-packages

Window ball grid array (BGA) semiconductor packages

Integrated circuit package with embedded components

Semiconductor chip device with solder diffusion protection

Stackable circuit structures and methods of fabrication thereof

METHOD FOR STACKING DIE IN THIN, SMALL-OUTLINE PACKAGE

Active plastic bridge chips

Integrated circuit packaging system with embedded interconnect and method of manufacture thereof

Leadframe circuit and method therefor

Integrated Circuit Comprising Light Absorbing Adhesive

Integrated circuit packaging system with package stacking and method of manufacture thereof

Integrated circuit package system employing device stacking

METHOD OF VERTICALLY MOUNTING AN INTEGRATED CIRCUIT

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME

Solder in cavity interconnection technology

Boron nitride agglomerated powder and devices comprising the powder

Substrate for integrated circuit devices including multi-layer glass core and methods of making the same

Printed wiring board and method for manufacturing printed wiring board

Flow sensors having nanoscale coating for corrosion resistance

Semiconductor processing methods

Method for low stress flip-chip assembly of fine-pitch semiconductor devices

Semiconductor connection component

Vertically packaged MOSFET and IC power devices as integrated module using 3D interconnected laminates

Electrical coupling of wafer structures

Method of room temperature covalent bonding

Thermal matching in semiconductor devices using heat distribution structures

DETECTION CIRCUITRY FOR DETECTING BONDING CONDITIONS ON BOND PADS

Integrated circuit packaging system with bond wire pads and method of manufacture thereof

Multilayer wiring substrate mounted with electronic component and method for manufacturing the same

Integrated circuit packaging system with a stackable package and method of manufacture thereof

Semiconductor device and electronic device

Substrate for electronic device, stack for electronic device, electronice device, and method for manufacturing the same

Semiconductor devices including voltage switchable materials for over-voltage protection

Ball grid array package enhanced with a thermal and electrical connector

Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip

High-density inter-package connections for ultra-thin package-on-package structures, and processes of forming same

Electronic device package and method for fabricating the same

Semiconductor device and method of forming PiP with inner known good die interconnected with conductive bumps

Module package with embedded substrate and leadframe

Integrated circuit packaging system with interconnect and method of manufacture thereof

Chip assembly with chip-scale packaging

Integrated circuit packaging system with stacking interconnect and method of manufacture thereof

Integrated circuit packaging system with package stacking and method of manufacture thereof

Printed circuit board having embedded dies and method of forming same

Semiconductor device, substrate and semiconductor device manufacturing method

Semiconductor die package including IC driver and bridge

Panel based lead frame packaging method and device

DAP GROUND BOND ENHANCEMENT

Integrated circuit packaging system with dual row lead-frame having top and bottom terminals and method of manufacture thereof

Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof

Tie bar and mold cavity bar arrangements for multiple leadframe stack package

Semiconductor device and manufacturing method thereof

Integrated circuit packaging system with shielded package and method of manufacture thereof

Structure for inhibiting back end of line damage from dicing and chip packaging interaction failures

Integrated circuit with pads connected by an under-bump metallization and method for production thereof

Heat conduction for chip stacks and 3-D circuits

Semiconductor device and method of manufacturing the same

Printed wiring board and method for manufacturing the same

Method for inhibiting growth of nickel-copper-tin intermetallic layer in solder joints

Method for manufacturing an electronic assembly

Method for manufacturing a semiconductor apparatus having a through-hole interconnection

Method for manufacturing semiconductor device

Semiconductor Device with Improved Contacts

Method for manufacturing lamination type semiconductor integrated device

Systems and methods for reducing contact to gate shorts

Method for manufacturing semiconductor device

CONNECTION STRUCTURE FOR CHIP-ON-GLASS DRIVER IC AND CONNECTION METHOD THEREFOR

Stacked inductor-electronic package assembly and technique for manufacturing same

Low profile computer processor retention device

Manufacture method for IC process with TOP and TOP-1 metal layers thickened and stacked inductor manufactured by this method

SEMICONDUCTOR DEVICE WITH FILTER CIRCUIT

Semiconductor device

Manufacturing method for electronic device having IC chip and antenna electrically connected by bridging plate

Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices

SEMICONDUCTOR DEVICE