Munich
Germany
14
2017-07-06
The entities that hold a legal rights for patent applications filed by inventor Ossimitz Peter:
Peter Ossimitz from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Multi-level chip interconnect
#2 | 2017-01-26Semiconductor chip having a dense arrangement of contact terminals
#3 | 2016-08-04Semiconductor device having a chip under package
#4 | 2015-06-04Integrated IC package
#5 | 2015-03-05Overmolded substrate-chip arrangement with heat sink
#6 | 2015-01-22Circuitry and method for monitoring a power supply of an electronic device
#7 | 2014-11-13Chip arrangement, and method for forming a chip arrangement
#8 | 2014-09-18Method for manufacturing a semiconductor chip with each contact pad having a pad cell associated therewith
#9 | 2014-07-24Method of manufacturing and testing a chip package
#10 | 2014-07-24Chip package having terminal pads of different form factors
#11 | 2013-08-15Semiconductor chip comprising a plurality of contact pads and a plurality of associated pad cells
#12 | 2012-09-20Device for releasably receiving a semiconductor chip
#13 | 2008-01-17Semiconductor memory component having a diverting circuit
#14 | 2007-03-08Rewiring substrate strip with several semiconductor component positions
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