Eung Jae KIM

City:

Daegu

Country:

South Korea

Published Applications:

Last publication date:

2016-10-27

Top Assignees for applications by Eung Jae KIM

The entities that hold a legal rights for patent applications filed by inventor KIM Eung Jae:

Eung Jae KIM from Daegu, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

CORE FOR REVERSE REFLOW, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

LEAD-FREE SOLDER HAVING LOW MELTING POINT

SOLDER BALL FOR FLUXLESS BONDING, METHOD OF MANUFACTURING THE SAME, AND METHOD OF FORMING SOLDER BUMP

Solder balls and semiconductor device employing the same

METAL BALL FABRICATING APPARATUS

InventorID:

1087119 ⎘