John Heck

HYBRID-BONDED IC DIE HAVING TOPOGRAPHIC SURFACE FEATURES

HYBRID III-V SILICON OPTICAL DEVICES WITH OXIDE-BASED CURRENT CONFINEMENT

SILICON PHOTONIC INTEGRATED CIRCUITS WITH ENHANCED THERMAL ISOLATION OF HEATER ELEMENTS

SILICON PHOTONIC INTEGRATED CIRCUITS WITH LOCALIZED THICK BURIED INSULATOR

V-GROOVE FIBER STOP

OPTICAL COHERENT RECEIVER ON A CHIP

MULTI-LAYER SILICON PHOTONICS APPARATUS

INTEGRATED OPTICAL PHASE CHANGE MATERIALS FOR RECONFIGURABLE OPTICS IN GLASS CORES

VERTICAL PN JUNCTION PHOTONICS MODULATORS WITH BACKSIDE CONTACTS AND LOW TEMPERATURE OPERATION

VERTICAL THROUGH-SILICON WAVEGUIDE FABRICATION METHOD AND TOPOLOGIES

HYBRID BONDING WITH PHOTONIC INTEGRATED CIRCUITS FOR HIGH BANDWIDTH RETICLE STITCHING OF RETICLE SIZED INTEGRATED CIRCUIT DIES

LENS WITH ALIGNMENT FACETS

PHOTONIC INTEGRATED CIRCUIT TO GLASS SUBSTRATE ALIGNMENT THROUGH DUAL CYLINDRICAL LENS

PHOTONIC INTEGRATED CIRCUIT TO GLASS SUBSTRATE ALIGNMENT THROUGH INTEGRATED CYLINDRICAL LENS AND WAVEGUIDE STRUCTURE

HYBRID LASER WITH AMORPHOUS BONDING LAYER

OPTICAL COUPLER

HYBRID LASER ARCHITECTURE WITH ASYMMETRIC METAL SHUNT

Silicon photonic integrated circuits on substrates with structured insulators having specific thicknesses in separate zones

III-N multichip modules and methods of fabrication

Embedded three-dimensional electrode capacitor

III-N multichip modules and methods of fabrication

Heating of Thermo-Optic Device

Optical coherent receiver on a chip

Silicon photonic integrated lens compatible with wafer processing

Multi-layer silicon photonics apparatus

Metasurface devices for display and photonics devices

Integrated photonic transceiver

Mechanisms for refractive index tuning semiconductor photonic devices

Semiconductor photonic devices using phase change materials

Optical device including buried optical waveguides and output couplers

Multi-mode interference (MMI) based laser devices for heterogeneous platforms

Reflow compatible optical packaging

Metasurface devices for display and photonics devices

Optical receiver employing a metasurface collection lens having concentric belts or rings

POLYMER OPTICAL COUPLER

Low power, high resolution solid state LIDAR circuit having a modulator to modulate a bit sequence onto a carrier frequency of a received optical signal

OPTICAL ISO-MODULATOR

Feedback controlled closed loop on-chip isolator

On-chip optical isolator

Low power, high resolution solid state LIDAR circuit

Monolithic physically displaceable optical waveguides

Opto-mechanical inertial sensor

Inverted 45° mirror for photonic integrated circuits

Solid state LIDAR circuit with waveguides tunable to separate phase offsets

Apparatus, method and system for spectrometry with a displaceable waveguide structure

MEMS apparatus with a movable waveguide section

On-chip diffraction grating prepared by crystallographic wet-etch

Optomechanical inertial sensor

Optomechanical sensor for accelerometry and gyroscopy

HYBRID INTEGRATION OF GROUP III-V SEMICONDUCTOR DEVICES ON SILICON

CMOS-compatible gold-free contacts

Inverted 45 degree mirror for photonic integrated circuits

Vertical mirror in a silicon photonic circuit

Integrated silicon optomechanical gyroscopes (OMGs)

Semiconductor substrate for an optical receiver

Seek scan probe (SSP) cantilever to mover wafer bond stop

On-chip diffraction grating prepared by crystallographic wet-etch

Hybrid III-V silicon laser formed by direct bonding

Method and structure combining vertical and angled facets in silicon photonic waveguides

Apparatus, method and system for providing reflection of an optical signal

Wafer-level In-P Si bonding for silicon photonic apparatus

Seek-scan probe (SSP) memory with sharp probe tips formed at CMOS-compatible temperatures

Vertical mirror in a silicon photonic circuit

Microfluidic molecular-flow fractionator and bioreactor with integrated active/passive diffusion barrier

Method for forming MEMS devices having low contact resistance and devices obtained thereof

Protection layers for media protection during fabrication of probe memory device

PACKAGE WITH INTEGRATED MAGNETS FOR ELECTROMAGNETICALLY-ACTUATED PROBE-STORAGE DEVICE

PROCESS FOR FABRICATING HIGH DENSITY STORAGE DEVICE WITH HIGH-TEMPERATURE MEDIA

Forming a cantilever assembly for vertical and lateral movement

Inertial switch using fully released and enclosed conductive contact bridge

METHOD OF INTEGRATING MEMS STRUCTURES AND CMOS STRUCTURES USING OXIDE FUSION BONDING

Seek-scan probe (SSP) memory with sharp probe tips formed at CMOS-compatible temperatures

Self sealed MEMS device

ELECTRICALLY-ISOLATED INTERCONNECTS AND SEAL RINGS IN PACKAGES USING A SOLDER PREFORM

Self-packaging MEMS device

Transient liquid phase bonding method

Microelectronic package having multiple conductive paths through an opening in a support substrate

Electrically-isolated interconnects and seal rings in packages using a solder preform

Ultra-low voltage capable zipper switch

Through-wafer vias and surface metallization for coupling thereto

Low inductance via structures

Reactive nano-layer material for MEMS packaging

Module integrating MEMS and passive components

Temperature resistant hermetic sealing formed at low temperatures for MEMS packages

Composite beam microelectromechanical system switch

Microfabricated hot wire vacuum sensor

Microfluid molecular-flow fractionator and bioreactor with integrated active/passive diffusion barrier