Gary E. DICKERSON

City:

Gloucester, Massachusetts

Country:

United States

Published Applications:

Last publication date:

2023-06-15

Top Assignees for applications by Gary E. DICKERSON

The entities that hold a legal rights for patent applications filed by inventor DICKERSON Gary E.:

Applied Materials, Inc. 5 Santa Clara, CA United States
VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC. 4 Gloucester, MA United States

Recent patent applications by DICKERSON Gary E.

Gary E. DICKERSON from Gloucester, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-06-15

US20230187222A1

Electricity

Adapting electrical, mechanical, and thermal properties of package substrates

#2 | 2017-09-21

US20170271181A1

Electricity

Method and apparatus for reducing radiation induced change in semiconductor structures

#3 | 2017-06-01

US20170154776A1

Electricity

3D material modification for advanced processing

#4 | 2016-09-22

US20160276227A1

Electricity

Method and apparatus for reducing radiation induced change in semiconductor structures

#5 | 2016-06-09

US20160163546A1

Electricity

3D material modification for advanced processing

#6 | 2015-09-10

US20150255243A1

Electricity

GRAZING ANGLE PLASMA PROCESSING FOR MODIFYING A SUBSTRATE SURFACE

#7 | 2012-12-13

US20120316069A1

Electricity

Superconducting fault current limiter recovery system

#8 | 2012-04-26

US20120097868A1

Electricity

Modulating implantation for improved workpiece splitting

#9 | 2010-04-22

US20100098851A1

Chemistry; metallurgy

TECHNIQUES FOR ATOMIC LAYER DEPOSITION

#10 | 2009-08-13

US20090200494A1

Electricity

TECHNIQUES FOR COLD IMPLANTATION OF CARBON-CONTAINING SPECIES

InventorID:

1284827 ⎘