Leonberg
Germany
21
2026-04-09
The entities that hold a legal rights for patent applications filed by inventor SCHEURLE Andreas:
Andreas SCHEURLE from Leonberg, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
MICROSTRUCTURED IC CHIP
#2 | 2025-12-25MICROMECHANICAL PRESSURE SENSOR HAVING AT LEAST TWO MEMBRANES FOR DETERMINING A PRESSURE VALUE, AND CORRESPONDING METHOD
#3 | 2024-11-07MEMBRANE SENSOR FOR COMPENSATING FOR AN ACCELERATION, AND METHOD FOR GENERATING A COMPENSATED SENSOR SIGNAL
#4 | 2023-11-23SENSOR DEVICE AND METHOD FOR DETECTING THE INTERNAL PRESSURE AND/OR A CHANGE IN THE INTERNAL PRESSURE IN A GAS-TIGHT INTERNAL VOLUME OF A HOUSING COMPONENT
#5 | 2023-11-09PRODUCTION METHOD FOR A MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE OR MICROPHONE DEVICE
#6 | 2023-10-26METHOD FOR MANUFACTURING A MICROMECHANICAL SENSOR
#7 | 2023-09-28MICROMECHANICAL COMPONENT
#8 | 2023-08-03MICROMECHANICAL COMPONENT AND MANUFACTURING METHOD FOR A MICROMECHANICAL COMPONENT FOR A SENSOR OR MICROPHONE DEVICE
#9 | 2022-12-15Micromechanical component for a sensor device or microphone device
#10 | 2022-03-17Production method for a micromechanical component
#11 | 2021-11-18MICROMECHANICAL COMPONENT FOR A SENSOR OR MICROPHONE DEVICE
#12 | 2021-07-15Micromechanical component for a sensor device or microphone device
#13 | 2020-05-07Bonding pad layer system, gas sensor and method for manufacturing a gas sensor
#14 | 2018-04-26Method for producing a micromechanical component
#15 | 2016-05-19Rocker device for a micromechanical Z-sensor
#16 | 2015-08-20Rocker device for a micromechanical Z sensor
#17 | 2013-08-08Micromechanical component and method for the manufacture of same
#18 | 2013-03-14METHOD FOR PRODUCING A CAPPING WAFER FOR A SENSOR
#19 | 2012-10-04Micromechanical system and corresponding manufacturing method
#20 | 2011-01-20Method for producing a capping wafer for a sensor
#21 | 2010-11-25METHOD FOR MANUFACTURING MEMS STRUCTURES
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