Andreas Augustin

Electronic Devices with Adjustable Received Sample Bit Width

PATCH ANTENNAS STITCHED TO SYSTEMS IN PACKAGES AND METHODS OF ASSEMBLING SAME

Antenna with graded dielectirc and method of making the same

Resonant LC tank package and method of manufacture

Single metal cavity antenna in package connected to an integrated transceiver front-end

Package integrated cavity resonator antenna

Semiconductor packages, and methods for forming semiconductor packages

Semiconductor inductors

Patch antennas stitched to systems in packages and methods of assembling same

Magnetic coils in locally thinned silicon bridges and methods of assembling same

THROUGH-SILICON VIA PILLARS FOR CONNECTING DICE AND METHODS OF ASSEMBLING SAME

Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory

Component magnetic shielding for microelectronic devices

Resonant LC tank package and method of manufacture

Antenna with graded dielectirc and method of making the same

Techniques for data compression

Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory

Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)

Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)

Wireless in-chip and chip to chip communication

Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)

Stress buffer layer for integrated microelectromechanical systems (MEMS)

Stress buffer layer for integrated microelectromechanical systems (MEMS)

Chip arrangement and method for manufacturing a chip arrangement

Chip arrangements