Daniel Sobieski

City:

Phoenix, Arizona

Country:

United States

Published Applications:

Last publication date:

2018-08-23

Top Assignees for applications by Daniel Sobieski

The entities that hold a legal rights for patent applications filed by inventor Sobieski Daniel:

Daniel Sobieski from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Inorganic interposer for multi-chip packaging

ELECTRONIC PACKAGE AND METHOD FORMING AN ELECTRICAL PACKAGE

ELECTRONIC PACKAGE AND METHOD FORMING AN ELECTRICAL PACKAGE

InventorID:

1815806 ⎘