John U. Knickerbocker

Handler bonding and debonding for semiconductor dies

Handler bonding and debonding for semiconductor dies

Wafer level integration including design/co-design, structure process, equipment stress management and thermal management

IR assisted fan-out wafer level packaging using silicon handler

Heterogeneous miniaturization platform

Integrated wafer-level processing system

Wafer level integration including design/co-design, structure process, equipment stress management and thermal management

Handler bonding and debonding for semiconductor dies

Device layer thin-film transfer to thermally conductive substrate

Saccade and vergence tracking for distance auto focus adjustment

Double layer release temporary bond and debond processes and systems

Molten solder injection head with vacuum filter and differential gauge system

Smart pellet for sample testing

VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING

Device layer thin-film transfer to thermally conductive substrate

Handler bonding and debonding for semiconductor dies

IR assisted fan-out wafer level packaging using silicon handler

System for continuous monitoring of body sounds

Handler bonding and debonding for semiconductor dies

Handler bonding and debonding for semiconductor dies

Microchip substance delivery devices

Heterogeneous miniaturization platform

Liquid crystal lens with variable focal length

Wafer level integration including design/co-design, structure process, equipment stress management and thermal management

Wafer level integration including design/co-design, structure process, equipment stress management and thermal management

Wafer level integration including design/co-design, structure process, equipment stress management, and thermal management

Wearable blood pressure monitoring system

Wearable blood pressure monitoring system

Liquid crystal lens with variable focal length

Via and trench filling using injection molded soldering

Via and trench filling using injection molded soldering

Via and trench filling using injection molded soldering

Via and trench filling using injection molded soldering

Enhanced data security platform

Integrated wafer-level processing system

IR assisted fan-out wafer level packaging using silicon handler

Via and trench filling using injection molded soldering

Via and trench filling using injection molded soldering

Heterogeneous miniaturization platform

Low cost hermetic micro-electronics

Low cost hermetic micro-electronics

Handler bonding and debonding for semiconductor dies

Handler bonding and debonding for semiconductor dies

Methods of forming microelectronic smart tags

Saccade and vergence tracking for distance auto focus adjustment

Saccade and vergence tracking for distance auto focus adjustment

Wearable sensor monitoring and data analysis

System for continuous monitoring of body sounds

Device layer thin-film transfer to thermally conductive substrate

Toothbrush with sensors

Bonding substrates using solder surface tension during solder reflow for three dimensional self-alignment of substrates

Chip stack structures that implement two-phase cooling with radial flow

Microelectronic smart tags

Double layer release temporary bond and debond processes and systems

Planarity-tolerant reworkable interconnect with integrated testing

Chip stack structures that implement two-phase cooling with radial flow

Double Layer Release Temporary Bond and Debond Processes and Systems

Planarity-tolerant reworkable interconnect with integrated testing

Microchip substance delivery devices having low-power electromechanical release mechanisms

Method and apparatus for laser dicing of wafers

Thin, flexible microsystem with integrated energy source

VARIABLE FOCAL LENGTH LENS

Wafer debonding using long-wavelength infrared radiation ablation

WAFER DEBONDING USING LONG-WAVELENGTH INFRARED RADIATION ABLATION

Chip stack structures that implement two-phase cooling with radial flow

MICROBUMP SEAL

Integrated circuit (IC) test probe

MODULAR CHIP STACK AND PACKAGING TECHNOLOGY WITH VOLTAGE SEGMENTATION, REGULATION, INTEGRATED DECOUPLING CAPACITANCE, AND COOLING STRUCTURE AND PROCESS

Semiconductor device and method of making semiconductor device

Direct edge connection for multi-chip integrated circuits

Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers

Reworkable electronic device assembly and method

Injection molded soldering process and arrangement for three-dimensional structures

Electronic package with a thermal interposer and method of manufacturing the same

Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers

Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers

Semiconductor device and method of making semiconductor device

MICROBUMP SEAL

FLEXIBLE NOZZLE FOR INJECTION MOLDED SOLDER

Integrated module for data processing system

Modular chip stack and packaging technology with voltage segmentation, regulation, integrated decoupling capacitance and cooling structure and process

TEST HEAD FOR FUNCTIONAL WAFER LEVEL TESTING, SYSTEM AND METHOD THEREFOR

Conductive adhesive for thinned silicon wafers with through silicon vias

Semiconductor device and method of making semiconductor device

Structure and method for creating reliable deep via connections in a silicon carrier

MICROBUMP SEAL

Rotational fill techniques for injection molding of solder

Direct edge connection for multi-chip integrated circuits

Fill head for injection molding of solder

Apparatus and Methods for Constructing Semiconductor Chip Packages with Silicon Space Transformer Carriers

Method to enhance micro-C4 reliability by reducing the impact of hot spot pulsing

Conductive bonding material fill techniques

LOW COST AND LOW COEFFICIENT OF THERMAL EXPANSION PACKAGING STRUCTURES AND PROCESSES

Injection molded soldering process and arrangement for three-dimensional structures

STRUCTURE AND METHOD FOR CREATING RELIABLE DEEP VIA CONNECTIONS IN A SILICON CARRIER

FLEXIBLE NOZZLE FOR INJECTION MOLDED SOLDER

Techniques for forming interconnects

CHIP STACK WITH PRECISION ALIGNMENT, HIGH YIELD ASSEMBLY AND THERMAL CONDUCTIVITY

Precision fabricated silicon mold

Chip system architecture for performance enhancement, power reduction and cost reduction