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Inventor profile of:

Chih-Lin CHEN

City:

Hsinchu

Country:

Taiwan

Published Applications:

11

Last publication date:

2026-03-26

Top Assignees for applications by Chih-Lin CHEN

The entities that hold a legal rights for patent applications filed by inventor CHEN Chih-Lin:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 9 Hsinchu, Taiwan
MACRONIX INTERNATIONAL CO., LTD. 1 Hsinchu, Taiwan

Recent patent applications by CHEN Chih-Lin

Chih-Lin CHEN from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-03-26

US20260087223A1

DESIGN FLOW OF INTEGRATED CIRCUIT (IC) WITH THERMAL SENSING RESISTOR

#2 | 2025-10-09

US20250315069A1

SEMICONDUCTOR DEVICES INCLUDING VOLTAGE MONITORS

#3 | 2024-05-30

US20240176373A1

SEMICONDUCTOR DEVICES INCLUDING VOLTAGE MONITORS

#4 | 2023-09-21

US20230299052A1

Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same

#5 | 2021-09-30

US20210305213A1

Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same

#6 | 2020-06-04

US20200176349A1

Heat transfer structures and methods for IC packages

#7 | 2020-04-23

US20200126952A1

Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same

#8 | 2019-12-19

US20190385980A1

Second semiconductor wafer attached to a first semiconductor wafer with a through hole connected to an inductor

#9 | 2019-05-23

US20190157180A1

Heat transfer structures and methods for IC packages

#10 | 2018-05-31

US20180151466A1

Heat transfer structures and methods for IC packages

#11 | 2009-06-11

US20090146266A1

Memory device and method of fabricating the same

InventorID:

2204014 ⎘