Hiroki Sudo

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2025-11-13

Top Assignees for applications by Hiroki Sudo

The entities that hold a legal rights for patent applications filed by inventor Sudo Hiroki:

SENJU METAL INDUSTRY CO., LTD 6 Tokyo, Japan
NIPPON TELEGRAPH AND TELEPHONE CORPORATION 3 TOKYO, Japan
SENJU METAL INDUSTRY CO., LTD 1 Adachi-ku, Tokyo, Japan

Recent patent applications by Sudo Hiroki

Hiroki Sudo from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-11-13

US20250349228A1

Physics

SECURE COMPUTATION DEVICE, SECURE COMPUTATION METHOD, AND PROGRAM

#2 | 2025-05-08

US20250150265A1

Electricity

SECURE COMPUTATION APPARATUS, SECURE COMPUTATION METHOD, AND PROGRAM

#3 | 2025-05-08

US20250148095A1

Physics

SECURE COMPUTATION APPARATUS, SECURE COMPUTATION METHOD, AND PROGRAM

#4 | 2024-12-26

US20240424615A1

Performing operations; transporting

Solder Alloy, Solder Ball, Solder Paste, and Solder Joint

#5 | 2024-03-28

US20240100635A1

Performing operations; transporting

CORE MATERIAL, ELECTRONIC COMPONENT AND METHOD FOR FORMING BUMP ELECTRODE

#6 | 2024-01-25

US20240024990A1

Performing operations; transporting

Solder alloy, solder ball, solder paste, and solder joint

#7 | 2023-06-08

US20230173619A1

Performing operations; transporting

Lead-Free and Antimony-Free Solder Alloy, Solder Ball, Ball Grid Array, and Solder Joint

#8 | 2022-07-07

US20220212294A1

Performing operations; transporting

Core material, electronic component and method for forming bump electrode

#9 | 2021-12-16

US20210387276A1

Performing operations; transporting

Method for forming bump electrode substrate

#10 | 2020-12-03

US20200376607A1

Performing operations; transporting

Solder material, solder paste, and solder joint

InventorID:

2921944 ⎘