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Inventor profile of:

Dongjun WANG

City:

Country:

United States

Published Applications:

1

Last publication date:

2016-01-14

Recent patent applications by WANG Dongjun

Dongjun WANG from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2016-01-14

US20160010207A1

Chemistry; metallurgy

Plasma-Enhanced Atomic-Layer Deposition System and Method

InventorID:

2970006 ⎘