Edward Fuergut

ELECTRONIC MODULE HAVING A CLIP CONNECTED TO A SEMICONDUCTOR PACKAGE

MULTI-DEVICE SEMICONDUCTOR CHIP WITH ELECTRICAL ACCESS TO DEVICES AT EITHER SIDE

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP ON ENCAPSULANT

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED SEMICONDUCTOR DIE

AN ELECTRONIC MODULE INCLUDING A SEMICONDUCTOR PACKAGE DISPOSED ON AN INTERPOSER LAYER

Package with electrically insulated carrier and at least one step on encapsulant

Semiconductor package

EMBEDDED PACKAGE WITH DELAMINATION MITIGATION

CHIP PACKAGE STRUCTURE, CHIP PACKAGE SYSTEM, AND METHOD OF FORMING A CHIP PACKAGE STRUCTURE

Semiconductor Device Module Comprising Flexible Leads for the Purpose of Height Adjustment

Semiconductor Power Module with Two Different Potting Materials and a Method for Fabricating the Same

Semiconductor device with improved performance in operation and improved flexibility in the arrangement of power chips

Method of forming a semiconductor package with connection lug

Semiconductor package with connection lug

Silicon carbide device and method for forming a silicon carbide device

Molded semiconductor package with dual integrated heat spreaders

Package with electrically insulated carrier and at least one step on encapsulant

Multi-device semiconductor chip with electrical access to devices at either side

Linear spacer for spacing a carrier of a package

Semiconductor device module having vertical metallic contacts and a method for fabricating the same

Semiconductor package having a chip carrier with a pad offset feature

Semiconductor device package comprising a thermal interface material with improved handling properties

Package and lead frame design for enhanced creepage and clearance

Semiconductor package with signal distribution element

Semiconductor device including an embedded semiconductor die

Additive manufacturing of a frontside or backside interconnect of a semiconductor die

Electronic module including a semiconductor package connected to a fluid heatsink

Power semiconductor device and method

Electronic devices including electrically insulated load electrodes

Thermal interface material having defined thermal, mechanical and electric properties

Semiconductor package and method of forming a semiconductor package

Electronic module comprising a semiconductor package with integrated clip and fastening element

Method for fabricating an electronic module via compression molding

Semiconductor module

Silicon carbide device and method for forming a silicon carbide device

Systems and methods using an RF circuit on isolating material

Method of manufacturing a package having a power semiconductor chip

Power package having multiple mold compounds

Method of reducing a sheet resistance in an electronic device, and an electronic device

An Electronic Device Package

Method for fabricating a semiconductor chip panel

Semiconductor device having die pads with exposed surfaces

Method of manufacturing a semiconductor power package

Method for producing a semiconductor module

Electronic device package having a dielectric layer and an encapsulant

Spatially selective roughening of encapsulant to promote adhesion with functional structure

Method for manufacturing an arrangement including a chip carrier notch

Attaching chip attach medium to already encapsulated electronic chip

Semiconductor devices with improved thermal and electrical performance

Electronic component and methods of manufacturing the same

Power device with overvoltage arrester

Method for producing a power semiconductor module

Thermal interface material having defined thermal, mechanical and electric properties

Functionalized interface structure

Method for producing a number of chip assemblies and method for producing a semiconductor arrangement

Arrangement and method for manufacturing the same

Method for fabricating a semiconductor chip panel

Electrically insulating thermal interface on the discontinuity of an encapsulation structure

Electronic Devices with Increased Creepage Distances

Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement

Arrangement of multiple power semiconductor chips and method of manufacturing the same

Semiconductor power package and method of manufacturing the same

Method of reducing a sheet resistance in an electronic device, and an electronic device

Electronic module comprising fluid cooling channel and method of manufacturing the same

Integrated circuit and method of manufacturing an integrated circuit

Method of manufacturing a semiconductor component and semiconductor component

Spring contact for semiconductor chip

Systems and Methods Using an RF Circuit on Isolating Material

Electronic module comprising a plurality of encapsulation layers and a method for producing it

Method of producing a semiconductor device and a semiconductor device

Method for manufacturing a chip arrangement

Electronic device package including metal blocks

Semiconductor device including a dielectric material

ARRANGEMENT AND METHOD FOR MANUFACTURING THE SAME

Chip arrangement and method of manufacturing the same

Electronic component with electronic chip between redistribution structure and mounting structure

Thinning in package using separation structure as stop

Electrically insulating thermal interface on the discontinuity of an encapsulation structure

Arrangement and method for manufacturing the same

System and method for packaged MEMS device having embedding arrangement, MEMS die, and grille

MEMS device

Semiconductor arrangement, method for producing a number of chip assemblies and method for producing a semiconductor arrangement

Semiconductor module and a method for fabrication thereof by extended embedding technologies

Apparatus comprising and a method for manufacturing an embedded MEMS device

Method of manufacturing a semiconductor device

Removable indicator structure in electronic chips of a common substrate for process adjustment

Arrangement having a plurality of chips and a chip carrier, and a processing arrangement

Chip arrangement and a method of manufacturing a chip arrangement

Method for fabricating a semiconductor chip panel

Method for testing semiconductor chips or semiconductor chip modules

Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package

Embedded chip package, a chip package, and a method for manufacturing an embedded chip package

Method for fabricating an electronic component

Chip arrangements and methods for manufacturing a chip arrangement

Semiconductor device with encapsulant

Method for manufacturing an electronic module and an electronic module

Apparatus comprising and a method for manufacturing an embedded MEMS device

Electric device package comprising a laminate and method of making an electric device package comprising a laminate

Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package

METHODS FOR MANUFACTURING A CHIP PACKAGE, A METHOD FOR MANUFACTURING A WAFER LEVEL PACKAGE, AND A COMPRESSION APPARATUS