Warstein
Germany
7
2011-12-29
The entities that hold a legal rights for patent applications filed by inventor Siepe Dirk:
Dirk Siepe from Warstein, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor arrangement, semiconductor module, and method for connecting a semiconductor chip to a ceramic substrate
#2 | 2011-05-26Bonding connection between a bonding wire and a power semiconductor chip
#3 | 2011-05-19Power semiconductor module and method for operating a power semiconductor module
#4 | 2010-08-26Method for fabricating a bond
#5 | 2009-05-21DEVICE AND METHOD FOR PRODUCING A BONDING CONNECTION
#6 | 2009-05-21Apparatus and method for producing a bonding connection
#7 | 2008-05-29Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apart
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