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Inventor profile of:

Anton Kolbeck

City:

Rohrmoos

Country:

Germany

Published Applications:

4

Last publication date:

2011-11-03

Top Assignees for applications by Anton Kolbeck

The entities that hold a legal rights for patent applications filed by inventor Kolbeck Anton:

FREESCALE SEMICONDUCTOR, INC 4 Austin, TX United States

Recent patent applications by Kolbeck Anton

Anton Kolbeck from Rohrmoos, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2011-11-03

US20110266663A1

Lead frame based semiconductor package and a method of manufacturing the same

#2 | 2011-09-22

US20110227229A1

Semiconductor wafer processing

#3 | 2009-09-03

US20090218663A1

Lead frame based semiconductor package and a method of manufacturing the same

#4 | 2007-10-11

US20070238205A1

Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing

InventorID:

3440468 ⎘