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Inventor profile of:

Andreas Meyer

City:

Dresden

Country:

Germany

Published Applications:

1

Last publication date:

2010-03-04

Recent patent applications by Meyer Andreas

Andreas Meyer from Dresden, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2010-03-04

US20100052137A1

ENHANCED WIRE BOND STABILITY ON REACTIVE METAL SURFACES OF A SEMICONDUCTOR DEVICE BY ENCAPSULATION OF THE BOND STRUCTURE

InventorID:

3588268 ⎘