William E. Boyd

City:

San Clemente, California

Country:

United States

Published Applications:

Last publication date:

2010-06-10

Top Assignees for applications by William E. Boyd

The entities that hold a legal rights for patent applications filed by inventor Boyd William E.:

Aprolase Development Co., LLC 1 Wilmington, DE United States
Irvine Sensors Corp. 1 Costa Mesa, CA United States

Recent patent applications by Boyd William E.

William E. Boyd from San Clemente, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2010-06-10

US20100140777A1

Electricity

Stacked ball grid array package module utilizing one or more interposer layers

#2 | 2007-07-12

US20070158805A1

Electricity

BGA-scale stacks comprised of layers containing integrated circuit die and a method for making the same

#3 | 2006-08-17

US20060180912A1

Electricity

Stacked ball grid array package module utilizing one or more interposer layers

InventorID:

3798649 ⎘