United States
6
2013-08-29
The entities that hold a legal rights for patent applications filed by inventor STATS ChipPAC, Ltd.:
STATS ChipPAC, Ltd. from , US has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus
#2 | 2013-08-22Integrated circuit packaging system with formed under-fill and method of manufacture thereof
#3 | 2013-08-22Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in Fo-WLCSP
#4 | 2013-08-22Semiconductor device and method of forming base leads from base substrate as standoff for stacking semiconductor die
#5 | 2013-08-22Package-in-package using through-hole via die on saw streets
#6 | 2013-08-15Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure
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