Ajit Balakrishna

City:

Country:

United States

Published Applications:

Last publication date:

2009-06-18

Top Assignees for applications by Ajit Balakrishna

The entities that hold a legal rights for patent applications filed by inventor Balakrishna Ajit:

Ajit Balakrishna from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

Method and apparatus for removing polymer from the wafer backside and edge

InventorID:

3969901 ⎘