KINSUS INTERCONNECT TECHNOLOGY CORP.

City:

Country:

United States

Published Applications:

Last publication date:

2013-08-29

Top Assignees for applications by KINSUS INTERCONNECT TECHNOLOGY CORP.

The entities that hold a legal rights for patent applications filed by inventor KINSUS INTERCONNECT TECHNOLOGY CORP.:

KINSUS INTERCONNECT TECHNOLOGY CORP. 2 Taoyuan, Taiwan

Recent patent applications by KINSUS INTERCONNECT TECHNOLOGY CORP.

KINSUS INTERCONNECT TECHNOLOGY CORP. from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-08-29

US20130224513A1

Electricity

Laminate circuit board with a multi-layer circuit structure

#2 | 2013-08-29

US20130219713A1

Electricity

METHOD OF MANUFACTURING A LAMINATE CIRCUIT BOARD WITH A MULTILAYER CIRCUIT STRUCTURE

InventorID:

406822 ⎘