Eagle, Idaho
United States
124
2024-10-10
The entities that hold a legal rights for patent applications filed by inventor Hiatt William M.:
William M. Hiatt from Eagle, US has applied for patents for these inventions. The list has both pending applications and granted patents:
MICROFEATURE WORKPIECES AND METHODS FOR FORMING INTERCONNECTS IN MICROFEATURE WORKPIECES
#2 | 2023-04-06Microfeature workpieces and methods for forming interconnects in microfeature workpieces
#3 | 2021-01-07Microfeature workpieces and methods for forming interconnects in microfeature workpieces
#4 | 2020-07-09Microfeature workpieces having alloyed conductive structures, and associated methods
#5 | 2018-11-29Microelectronic devices and methods for filling vias in microelectronic devices
#6 | 2018-10-25SYSTEMS AND METHODS FOR FORMING APERTURES IN MICROFEATURE WORKPIECES
#7 | 2017-11-09MICROFEATURE WORKPIECES AND METHODS FOR FORMING INTERCONNECTS IN MICROFEATURE WORKPIECES
#8 | 2017-11-09Microfeature workpieces having alloyed conductive structures, and associated methods
#9 | 2017-10-19MICROELECTRONIC DEVICES AND METHODS FOR FILLING VIAS IN MICROELECTRONIC DEVICES
#10 | 2017-01-12Systems and methods for forming apertures in microfeature workpieces
#11 | 2016-08-25Disabling electrical connections using pass-through 3D interconnects and associated systems and methods
#12 | 2014-10-30Disabling electrical connections using pass-through 3D interconnects and associated systems and methods
#13 | 2014-09-25Microelectronic devices and methods for filling vias in microelectronic devices
#14 | 2014-09-25Microfeature workpieces having alloyed conductive structures, and associated methods
#15 | 2014-07-31Systems and methods for forming apertures in microfeature workpieces
#16 | 2014-01-16System and methods for forming apertures in microfeature workpieces
#17 | 2013-11-07Through-wafer interconnects for photoimager and memory wafers
#18 | 2013-08-22Disabling electrical connections using pass-through 3D interconnects and associated systems and methods
#19 | 2013-01-03Microfeature workpieces having alloyed conductive structures, and associated methods
#20 | 2013-01-03Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices
#21 | 2013-01-03Multi-component integrated circuit contacts
#22 | 2012-12-06Disabling electrical connections using pass-through 3D interconnects and associated systems and methods
#23 | 2012-05-03Wafer-level packaged microelectronic imagers having interconnects formed through terminals
#24 | 2012-04-19Microelectronic devices and methods for filing vias in microelectronic devices
#25 | 2012-01-12Packaged microelectronic imagers and methods of packaging microelectronic imagers
#26 | 2011-09-29Through-wafer interconnects for photoimager and memory wafers
#27 | 2011-07-21Stacked semiconductor components having conductive interconnects
#28 | 2011-04-21Packaged microelectronic imagers and methods of packaging microelectronic imagers
#29 | 2011-04-07MICROFEATURE WORKPIECES AND METHODS FOR FORMING INTERCONNECTS IN MICROFEATURE WORKPIECES
#30 | 2010-08-12Multi-component integrated circuit contacts
#31 | 2010-06-10Methods for fabricating semiconductor components with conductive interconnects having planar surfaces
#32 | 2009-11-19Disabling electrical connections using pass-through 3D interconnects and associated systems and methods
#33 | 2009-07-30Microelectronic devices and methods for forming interconnects in microelectronic devices
#34 | 2009-07-30Packaged microelectronic imagers and methods of packaging microelectronic imagers
#35 | 2009-07-09Methods of forming interconnects in a semiconductor structure
#36 | 2009-06-04Imager with tuned color filter
#37 | 2009-03-10Imager with tuned color filter
#38 | 2008-11-27WAFER LEVEL LENS ARRAYS FOR IMAGE SENSOR PACKAGES AND THE LIKE, IMAGE SENSOR PACKAGES, AND RELATED METHODS
#39 | 2008-09-25System for fabricating semiconductor components with conductive interconnects
#40 | 2008-08-28Methods for fabricating semiconductor components with conductive interconnects
#41 | 2008-08-28Semiconductor components with conductive interconnects
#42 | 2008-06-12Microelectronic devices and methods for forming interconnects in microelectronic devices
#43 | 2008-05-15Through-wafer interconnects for photoimager and memory wafers
#44 | 2008-03-13Methods of fabricating substrates including at least one conductive via
#45 | 2008-01-24Packaged microelectronic imagers and methods of packaging microelectronic imagers
#46 | 2007-11-22Microfeature workpieces and methods for forming interconnects in microfeature workpieces
#47 | 2007-08-02Substrate supports for use with programmable material consolidation apparatus and systems
#48 | 2007-08-02Pass through via technology for use during the manufacture of a semiconductor device
#49 | 2007-07-26Methods of fabricating substrates including one or more conductive vias
#50 | 2007-07-19Methods for supporting substrates during fabrication of one or more objects thereon by programmed material consolidation techniques
#51 | 2007-07-12Methods for removing and reclaiming unconsolidated material from substrates following fabrication of objects thereon by programmed material consolidation techniques
#52 | 2007-07-03Substrate supports for use with programmable material consolidation apparatus and systems
#53 | 2007-06-14Semiconductor device structures including nickel plated aluminum, copper, and tungsten structures
#54 | 2007-06-14Semiconductor component having plate, stacked dice and conductive vias
#55 | 2007-05-29Methods for supporting substrates during fabrication of one or more objects thereon by programmable material consolidation techniques
#56 | 2007-04-05Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices
#57 | 2007-03-01Microfeature workpieces and methods for forming interconnects in microfeature workpieces
#58 | 2007-03-01Method for fabricating semiconductor components having encapsulated, bonded, interconnect contacts on redistribution contacts
#59 | 2007-03-01Microfeature workpieces, carriers, and associated methods
#60 | 2007-03-01Microfeature workpieces and methods for forming interconnects in microfeature workpieces
#61 | 2007-03-01Microfeature workpieces having alloyed conductive structures, and associated methods
#62 | 2007-02-27Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices
#63 | 2007-01-25Stress and force management techniques for a semiconductor die
#64 | 2007-01-25Multi-component integrated circuit contacts
#65 | 2007-01-04Selective activation of aluminum, copper, and tungsten structures
#66 | 2007-01-04Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom
#67 | 2006-11-30Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts
#68 | 2006-11-23Backside method for fabricating semiconductor components with conductive interconnects
#69 | 2006-11-23Microelectronic imagers and methods of packaging microelectronic imagers
#70 | 2006-11-16Systems and methods for testing microfeature devices
#71 | 2006-11-16Substrate precursor structures
#72 | 2006-11-02Compliant contact pin test assembly and methods thereof
#73 | 2006-10-03Multi-component integrated circuit contacts
#74 | 2006-09-21Programmed material consolidation processes for fabricating electrical contacts and the resulting electrical contacts
#75 | 2006-09-14Methods for fabricating electronic device components that include protruding contacts and electronic device components so fabricated
#76 | 2006-09-14Microelectronic devices having conductive complementary structures and methods of manufacturing microelectronic devices have conductive complementary structures
#77 | 2006-09-07Microelectronic devices and methods for forming interconnects in microelectronic devices
#78 | 2006-08-31Systems and methods for forming apertures in microfeature workpieces
#79 | 2006-08-24Methods for packaging microelectronic imagers
#80 | 2006-08-24Systems and methods for forming apertures in microfeature workpieces
#81 | 2006-06-13Wafer level methods for fabricating multi-dice chip scale semiconductor components
#82 | 2006-06-01Semiconductor component having plate and stacked dice
#83 | 2006-04-20Chip-scale packages
#84 | 2006-03-02Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed thereby
#85 | 2006-03-02Selective nickel plating of aluminum, copper, and tungsten structures
#86 | 2006-03-02Pass through via technology for use during the manufacture of a semiconductor device
#87 | 2006-03-02Methods for forming interconnects in vias and microelectronic workpieces including such interconnects
#88 | 2006-02-23Through-hole conductors for semiconductor substrates and method for making same
#89 | 2006-02-23Through-hole conductors for semiconductor substrates and system for making same
#90 | 2006-01-12Materials for use in programmed material consolidation processes
#91 | 2006-01-05Assemblies including semiconductor substrates of reduced thickness and support structures therefor
#92 | 2006-01-05Methods for optimizing physical characteristics of selectively consolidatable materials
#93 | 2006-01-05Multi-component integrated circuit contacts
#94 | 2006-01-05Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates
#95 | 2005-12-29Microelectronic devices and methods for forming interconnects in microelectronic devices
#96 | 2005-12-29Packaged microelectronic imagers and methods of packaging microelectronic imagers
#97 | 2005-12-15Wafer-level packaged microelectronic imagers and processes for wafer-level packaging
#98 | 2005-12-15Contact pin assembly and contactor card
#99 | 2005-12-15Compliant contact pin assembly and card system
#100 | 2005-12-15Prefabricated housings for microelectronic imagers
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