Inventor profile of:

Brian E. Goodlin

City:

Plano, Texas

Country:

United States

Published Applications:

29

Last publication date:

2021-10-21

Top Assignees for applications by Brian E. Goodlin

The entities that hold a legal rights for patent applications filed by inventor Goodlin Brian E.:

Recent patent applications by Goodlin Brian E.

Brian E. Goodlin from Plano, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-10-21
US20210327802A1
Electricity

IC having trench-based metal-insulator-metal capacitor

#2 | 2021-03-11
US20210074630A1
Electricity

IC having trench-based metal-insulator-metal capacitor

#3 | 2020-11-12
US20200354214A1
Performing operations; transporting

Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip

#4 | 2019-07-04
US20190206785A1
Electricity

Electronic devices with bond pads formed on a molybdenum layer

#5 | 2019-06-06
US20190169019A1
Performing operations; transporting

Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip

#6 | 2018-05-10
US20180127266A1
Performing operations; transporting

Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip

#7 | 2017-07-13
US20170197823A1
Performing operations; transporting

Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip

#8 | 2017-06-22
US20170178916A1
Electricity

ENHANCED LATERAL CAVITY ETCH

#9 | 2017-06-22
US20170174505A1
Performing operations; transporting

Infrared sensor design using an epoxy film as an infrared absorption layer

#10 | 2017-03-28
US14973904
Electricity

Enhanced lateral cavity etch

#11 | 2017-03-02
US20170063325A1
Electricity

Devices with specific termination angles in titanium tungsten layers and methods for fabricating the same

#12 | 2017-02-28
US15047592
Electricity

Process to enable ferroelectric layers on large area substrates

#13 | 2016-11-03
US20160322235A1
Electricity

Method for fabricating specific termination angles in titanium tungsten layers

#14 | 2015-09-03
US20150246810A1
Performing operations; transporting

INFRARED SENSOR DESIGN USING AN EPOXY FILM AS AN INFRARED ABSORPTION LAYER

#15 | 2014-08-14
US20140227805A1
Electricity

Adhesion of ferroelectric material to underlying conductive capacitor plate

#16 | 2014-08-14
US20140225226A1
Electricity

Multi-step deposition of ferroelectric dielectric material

#17 | 2013-09-26
US20130249096A1
Electricity

THROUGH SILICON VIA FILLING

#18 | 2013-09-19
US20130240637A1
Electricity

SHOWERHEAD FOR CVD DEPOSITIONS

#19 | 2012-09-06
US20120223400A1
Performing operations; transporting

Infrared sensor design using an epoxy film as an infrared absorption layer

#20 | 2012-05-03
US20120108076A1
Electricity

Showerhead for CVD depositions

#21 | 2011-12-01
US20110294246A1
Electricity

Silicon dioxide cantilever support and method for silicon etched structures

#22 | 2011-12-01
US20110291222A1
Electricity

Silicon dioxide cantilever support and method for silicon etched structures

#23 | 2011-10-20
US20110256729A1
Electricity

Showerhead for CVD depositions

#24 | 2011-06-30
US20110158439A1
Electricity

Silicon microphone transducer

#25 | 2011-01-27
US20110018107A1
Electricity

TSVS Having Chemically Exposed TSV Tips for Integrated Circuit Devices

#26 | 2010-12-30
US20100327393A1
Physics

Etching cavity structures in silicon under dielectric membrane

#27 | 2010-11-18
US20100289108A1
Electricity

Silicon dioxide cantilever support and method for silicon etched structures

#28 | 2009-11-26
US20090289324A1
Electricity

Mask overhang reduction or elimination after substrate etch

#29 | 2009-11-12
US20090278238A1
Electricity

TSVS having chemically exposed TSV tips for integrated circuit devices

InventorID:

439492 ⎘