Gary E. Oberlin

City:

Windfall, Indiana

Country:

United States

Published Applications:

Last publication date:

2009-04-30

Top Assignees for applications by Gary E. Oberlin

The entities that hold a legal rights for patent applications filed by inventor Oberlin Gary E.:

Gary E. Oberlin from Windfall, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Method of producing an overmolded electronic module with a flexible circuit pigtail

Fluid cooled electronic assembly

Thermal conductor and use thereof

Multi-path bar bond connector for an integrated circuit assembly

Microelectronic assembly having variable thickness solder joint

Power electronic system with passive cooling

Thermally enhanced electronic module with self-aligning heat sink

InventorID:

4498139 ⎘