🔗 Permalink

Inventor profile of:

STEPHEN E. MICK

City:

APEX, North Carolina

Country:

United States

Published Applications:

Last publication date:

2013-10-24

Top Assignees for applications by STEPHEN E. MICK

The entities that hold a legal rights for patent applications filed by inventor MICK STEPHEN E.:

PROTOCHIPS, INC. 9 Raleigh, NC United States
North Carolina State University 2 Raleigh, NC United States

Recent patent applications by MICK STEPHEN E.

STEPHEN E. MICK from APEX, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-10-24

US20130277572A1

Electricity

Sample holder providing interface to semiconductor device with high density connections

#2 | 2011-10-13

US20110248165A1

Electricity

Sample holder providing interface to semiconductor device with high density connections

#3 | 2011-06-02

US20110127427A1

Electricity

Specimen holder used for mounting

#4 | 2011-04-07

US20110079710A1

Electricity

Microscopy support structures

#5 | 2011-02-10

US20110032611A1

Electricity

Specimen mount for microscopy

#6 | 2010-09-02

US20100221488A1

Electricity

REUSABLE TEMPLATE FOR CREATION OF THIN FILMS; METHOD OF MAKING AND USING TEMPLATE; AND THIN FILMS PRODUCED FROM TEMPLATE

#7 | 2010-06-10

US20100143198A1

Physics

Sample support structure and methods

#8 | 2010-06-10

US20100140497A1

Physics

Membrane supports with reinforcement features

#9 | 2006-12-14

US20060277778A1

Electricity

Reusable template for creation of thin films; method of making and using template; and thin films produced from template

#10 | 2006-02-02

US20060022336A1

Electricity

Microelectronic packages including solder bumps and AC-coupled interconnect elements

#11 | 2005-04-26

US9997586

Inductively coupled electrical connectors

#12 | 2005-03-03

US20050046037A1

Electricity

Buried solder bumps for AC-coupled microelectronic interconnects

InventorID:

493205 ⎘