James R. Stack

City:

Endicott, New York

Country:

United States

Published Applications:

Last publication date:

2007-02-06

Top Assignees for applications by James R. Stack

The entities that hold a legal rights for patent applications filed by inventor Stack James R.:

James R. Stack from Endicott, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Method and structure for implementing enhanced interconnection performance of a land grid array (LGA) module and a printed wiring board

Structure for repairing or modifying surface connections on circuit boards

Method and structure for repairing or modifying surface connections on circuit boards

InventorID:

4935319 ⎘