Dylan HARPER

City:

Berkeley, California

Country:

United States

Published Applications:

Last publication date:

2021-04-22

Top Assignees for applications by Dylan HARPER

The entities that hold a legal rights for patent applications filed by inventor HARPER Dylan:

Dylan HARPER from Berkeley, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Method and apparatus for continuous fabrication of fiber-bundle-based and tape-base preforms

Non-standard resin-infused fiber bundles

InventorID:

5034363 ⎘