Inventor profile of:

Cameron Danesh

City:

Mountain View, California

Country:

United States

Published Applications:

26

Last publication date:

2024-07-11

Top Assignees for applications by Cameron Danesh

The entities that hold a legal rights for patent applications filed by inventor Danesh Cameron:

Recent patent applications by Danesh Cameron

Cameron Danesh from Mountain View, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-07-11
US20240235697A9
Electricity

INTERCONNECT NETWORKS USING MICROLED-BASED OPTICAL LINKS

#2 | 2024-04-25
US20240137132A1
Electricity

Interconnect networks using microLED-based optical links

#3 | 2024-02-15
US20240053558A1
Physics

Integration of OE devices with ICS

#4 | 2024-02-01
US20240036246A1
Physics

Multi-layer planar waveguide interconnects

#5 | 2024-01-25
US20240030377A1
Electricity

P-TYPE DOPING IN GAN LEDS FOR HIGH SPEED OPERATION AT LOW CURRENT DENSITIES

#6 | 2024-01-18
US20240022330A1
Electricity

COHERENT FIBER BUNDLE PARALLEL OPTICAL LINKS

#7 | 2024-01-11
US20240012215A1
Physics

COUPLING MICROLEDS TO OPTICAL COMMUNICATION CHANNELS

#8 | 2023-12-21
US20230412282A1
Electricity

LED chip-to-chip vertically launched optical communications with optical fiber

#9 | 2023-04-27
US20230129843A1
Physics

SEPARATE OPTOELECTRONIC SUBSTRATE

#10 | 2023-02-23
US20230054560A1
Physics

MICROLED PARALLEL OPTICAL INTERCONNECTS

#11 | 2023-01-19
US20230020634A1
Electricity

Coherent fiber bundle parallel optical links

#12 | 2022-09-08
US20220286211A1
Electricity

LED chip-to-chip vertically launched optical communications with optical fiber

#13 | 2022-06-09
US20220181518A1
Electricity

P-type doping in GaN LEDs for high speed operation at low current densities

#14 | 2022-06-09
US20220181517A1
Electricity

P-type doping in GaN LEDs for high speed operation at low current densities

#15 | 2022-04-14
US20220113483A1
Physics

Integration of OE devices with ICs

#16 | 2022-04-07
US20220107456A1
Physics

Multi-layer planar waveguide interconnects

#17 | 2022-03-03
US20220069914A1
Electricity

Hybrid integration of microLED interconnects with ICs

#18 | 2022-02-10
US20220045234A1
Electricity

Enhanced microLEDs for inter-chip communications

#19 | 2022-01-06
US20220005845A1
Electricity

CMOS-COMPATIBLE SHORT WAVELENGTH PHOTODETECTORS

#20 | 2021-12-02
US20210376932A1
Electricity

Coherent fiber bundle parallel optical links

#21 | 2021-11-18
US20210356662A1
Physics

Embedding LEDs with waveguides

#22 | 2021-10-14
US20210320726A1
Electricity

Interconnect networks using microLED-based optical links

#23 | 2021-10-14
US20210320721A1
Electricity

Parallel optical communication channels using microLEDs

#24 | 2021-10-14
US20210320718A1
Electricity

Optically-enhanced multichip packaging

#25 | 2021-10-14
US20210318503A1
Physics

COUPLING MICROLEDS TO OPTICAL COMMUNICATION CHANNELS

#26 | 2021-09-23
US20210296292A1
Electricity

LED array for in-plane optical interconnects

InventorID:

5198280 ⎘