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Inventor profile of:

Jun Genba

City:

Itami

Country:

Japan

Published Applications:

7

Last publication date:

2018-07-26

Top Assignees for applications by Jun Genba

The entities that hold a legal rights for patent applications filed by inventor Genba Jun:

  • SUMITOMO ELECTRIC INDUSTRIES, LTD. 7 Osaka-shi, Japan

Recent patent applications by Genba Jun

Jun Genba from Itami, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2018-07-26
US20180209064A1
Chemistry; metallurgy

Epitaxial wafer and method for manufacturing same

#2 | 2016-12-08
US20160355949A1
Chemistry; metallurgy

Method for manufacturing silicon carbide epitaxial substrate, and silicon carbide epitaxial substrate

#3 | 2016-11-10
US20160326668A1
Chemistry; metallurgy

Epitaxial wafer and method for manufacturing same

#4 | 2016-09-01
US20160254149A1
Electricity

Method of manufacturing silicon carbide semiconductor substrate and method of manufacturing silicon carbide semiconductor device

#5 | 2015-10-29
US20150311069A1
Electricity

Method for manufacturing silicon carbide semiconductor substrate

#6 | 2015-08-06
US20150221498A1
Electricity

Method of manufacturing silicon carbide semiconductor substrate and method of manufacturing silicon carbide semiconductor device

#7 | 2015-03-12
US20150072100A1
Chemistry; metallurgy

Silicon carbide epitaxial substrate and method of manufacturing silicon carbide epitaxial substrate

InventorID:

6364935 ⎘

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