Aichi
Japan
33
2025-05-01
The entities that hold a legal rights for patent applications filed by inventor Usui Ryosuke:
Ryosuke Usui from Aichi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
LIQUID IMMERSION COOLING DEVICE
#2 | 2014-03-27Device mounting board and semiconductor power module
#3 | 2014-03-20Semiconductor module and an inverter mounting said semiconductor module
#4 | 2014-02-06BATTERY MODULE
#5 | 2012-04-26Element mounting substrate and semiconductor module
#6 | 2011-10-06SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE, AND PORTABLE APPARATUS
#7 | 2011-08-04Semiconductor module and portable apparatus provided with semiconductor module
#8 | 2011-07-28SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD
#9 | 2011-07-21ELEMENT MOUNTING BOARD, SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, METHOD FOR FABRICATING THE ELEMENT MOUNTING BOARD, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
#10 | 2011-03-31Semiconductor module, method of manufacturing semiconductor module, and mobile device
#11 | 2010-12-23Circuit Device and Method of Manufacturing Thereof
#12 | 2010-11-18ELEMENT MOUNTING SUBSTRATE AND METHOD OF FABRICATING THE SAME, CIRCUIT DEVICE AND METHOD OF FABRICATING THE SAME, AND MOBILE APPLIANCE ( as amended
#13 | 2010-10-21Circuit device, method of manufacturing the circuit device, device mounting board and semiconductor module
#14 | 2010-08-19Semiconductor module, method for manufacturing semiconductor module, and portable device
#15 | 2010-01-14Method of fabricating a circuit apparatus
#16 | 2009-12-10Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus
#17 | 2009-10-08Circuit Device and Method for Manufacturing the Circuit Device
#18 | 2009-05-14Method for manufacturing circuit device
#19 | 2008-12-04Circuit device and manufacturing method therefor
#20 | 2008-10-02Circuit board and circuit device
#21 | 2007-08-30FLEXIBLE SUBSTRATE
#22 | 2007-08-30Circuit board and method for manufacturing the same
#23 | 2006-11-30Circuit device and method of manufacturing the same
#24 | 2006-11-09Circuit device and method of manufacturing thereof
#25 | 2006-09-12Circuit device manufacturing method including mounting circuit elements on a conductive foil, forming separation grooves in the foil, and etching the rear of the foil
#26 | 2006-02-16Circuit device manufacturing method
#27 | 2006-01-05Circuit device and manufacturing method thereof
#28 | 2005-12-01Circuit device and manufacturing method thereof
#29 | 2005-12-01Method for manufacturing circuit device
#30 | 2005-12-01Circuit device and manufacturing method thereof
#31 | 2005-12-01Circuit device and manufacturing method thereof
#32 | 2005-12-01Circuit device with dummy elements
#33 | 2005-10-11Circuit device manufacturing method
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