Eisuke Ogawa

City:

Kitakyusyu

Country:

Japan

Published Applications:

Last publication date:

2019-02-28

Top Assignees for applications by Eisuke Ogawa

The entities that hold a legal rights for patent applications filed by inventor Ogawa Eisuke:

Eisuke Ogawa from Kitakyusyu, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Die-casting sleeve and its production method

InventorID:

6522993 ⎘