Ray Fredric De Asis

City:

Mabalacat

Country:

Philippines

Published Applications:

Last publication date:

2026-03-19

Recent patent applications by De Asis Ray Fredric

Ray Fredric De Asis from Mabalacat, PH has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-03-19

US20260082940A1

Electricity

NANOTWIN COPPER PLATING FOR MULTI-LAYERED LEADFRAMES

#2 | 2026-02-05

US20260040989A1

Electricity

SELECTIVELY FORMED BOND PAD STRUCTURE

#3 | 2025-09-04

US20250279323A1

Electricity

SENSOR PACKAGES

#4 | 2025-08-28

US20250273547A1

Electricity

STITCH BOND TO COPPER NANOTWIN PLATED LEAD

#5 | 2025-07-31

US20250246563A1

Electricity

PARTIALLY PULSE-PLATED BOND PADS

#6 | 2025-06-19

US20250201738A1

Electricity

DIE WITH BOND PAD

#7 | 2025-05-01

US20250140735A1

Electricity

DIRECT COPPER WIRE BONDING ON NANOTWIN COPPER STRUCTURES

#8 | 2025-03-06

US20250079388A1

Electricity

INTEGRATED CIRCUIT HAVING IMPROVED BALL BONDING ADHESION

#9 | 2025-01-02

US20250006683A1

Electricity

BUMP LANDING WITH BOND WIRES FOR IMPROVED SOLDER WETTING

InventorID:

6889809 ⎘