Inventor profile of:

Ehsan Zamani

City:

Phoenix, Arizona

Country:

United States

Published Applications:

17

Last publication date:

2026-03-26

Top Assignees for applications by Ehsan Zamani

The entities that hold a legal rights for patent applications filed by inventor Zamani Ehsan:

Recent patent applications by Zamani Ehsan

Ehsan Zamani from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-03-26
US20260090426A1
Electricity

SEMICONDUCTOR CORE LAYER INCLUDING GLASS SHEET HAVING EDGE PROTECTION STRUCTURE AND METHOD OF MAKING SAME

#2 | 2026-03-19
US20260082970A1
Electricity

INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS-CORE SUBSTRATE

#3 | 2026-01-01
US20260005115A1
Electricity

METHODS AND SYSTEMS FOR FORMING INTEGRATED CIRCUIT PACKAGES COMPRISING GLASS LAYERS

#4 | 2026-01-01
US20260005082A1
Electricity

GLASS CORE EDGE TREATMENTS FOR HYBRID PANELS IN DEVICE PACKAGING

#5 | 2026-01-01
US20260005081A1
Electricity

HYBRID GLASS AND ORGANIC SUBSTRATES

#6 | 2025-12-04
US20250374426A1
Electricity

AUTOMATED MANUFACTURING OF HYBRID PANELS

#7 | 2025-10-02
US20250309148A1
Electricity

SUBSTRATE WITH COMPONENT EMBEDDED IN A BLIND CAVITY

#8 | 2025-09-04
US20250279346A1
Electricity

HIGH ASPECT RATIO VIAS WITH LOW STRESS IN INTEGRATED CIRCUIT PACKAGES

#9 | 2025-07-03
US20250218962A1
Electricity

TECHNOLOGIES FOR A STACK OF COMPONENTS EMBEDDED IN A SUBSTRATE CORE

#10 | 2025-07-03
US20250218956A1
Electricity

METHODS AND APPARATUS FOR MOUNTING SEMICONDUCTOR DEVICES IN CAVITIES

#11 | 2025-07-03
US20250218929A1
Electricity

EMBEDDED DEEP TRENCH CAPACITORS IN INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES

#12 | 2025-07-03
US20250218881A1
Electricity

LIQUID-BASED METHOD FOR EMBEDDING COMPONENTS IN THICK SUBSTRATES

#13 | 2025-06-26
US20250210426A1
Electricity

MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES

#14 | 2025-06-05
US20250183182A1
Electricity

MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATION IN GLASS CORES

#15 | 2025-04-24
US20250132239A1
Electricity

POROUS LINERS FOR THROUGH-GLASS VIAS AND ASSOCIATED METHODS

#16 | 2025-03-27
US20250106997A1
Electricity

ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES

#17 | 2025-01-09
US20250014954A1
Electricity

HYBRID CORES INCLUDING ADHESIVE PROMOTION LAYERS AND RELATED METHODS

InventorID:

6896815 ⎘