Michael STADLER

City:

München

Country:

Germany

Published Applications:

Last publication date:

2026-03-05

Top Assignees for applications by Michael STADLER

The entities that hold a legal rights for patent applications filed by inventor STADLER Michael:

Michael STADLER from München, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Semiconductor Package with Selective Surface Roughening

INTERCONNECT CLIP FOR VERTICALLY STACKED DIE ARRANGEMENT

PACKAGE WITH CONCAVE WETTABILITY AND/OR METALLIZATION LAYER

InventorID:

6930690 ⎘