Christopher M. Scanlan

City:

Hellerup

Country:

Denmark

Published Applications:

Last publication date:

2011-06-14

Top Assignees for applications by Christopher M. Scanlan

The entities that hold a legal rights for patent applications filed by inventor Scanlan Christopher M.:

AMKOR TECHNOLOGY, INC. 2 Chandler, AZ United States

Recent patent applications by Scanlan Christopher M.

Christopher M. Scanlan from Hellerup, DK has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2011-06-14

US12421118

Thermal via heat spreader package and method

#2 | 2010-12-14

US12342829

System and method for shielding of package on package (PoP) assemblies

InventorID:

7254188 ⎘